PDF n27
PDF n27
PDF n27
EPCOS AG 2017. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS’ prior express consent is prohibited.
Material properties
DC magnetic bias
measured on ETD cores
(B ≤ 0.25 mT, f = 10 kHz, T = 25 °C)
Heating up
Ferrites can run hot during operation at higher flux densities and higher frequencies.
NiZn-materials
The magnetic properties of NiZn-materials can change irreversible in high magnetic fields.
Ferrite Accessories
EPCOS ferrite accessories have been designed and evaluated only in combination with EPCOS
ferrite cores. EPCOS explicitly points out that EPCOS ferrite accessories or EPCOS ferrite cores
may not be compatible with those of other manufacturers. Any such combination requires prior te-
sting by the customer and will be at the customer‘s own risk.
EPCOS assumes no warranty or reliability for the combination of EPCOS ferrite accessories with
cores and other accessories from any other manufacturer.
Processing remarks
The start of the winding process should be soft. Else the flanges may be destroyed.
– Too strong winding forces may blast the flanges or squeeze the tube that the cores can not be
mounted any more.
– Too long soldering time at high temperature (>300 °C) may effect coplanarity or pin arrange-
ment.
– Not following the processing notes for soldering of the J-leg terminals may cause solderability
problems at the transformer because of pollution with Sn oxyde of the tin bath or burned insula-
tion of the wire. For detailed information see chapter “Processing notes”, section 2.2.
– The dimensions of the hole arrangement have fixed values and should be understood as
a recommendation for drilling the printed circuit board. For dimensioning the pins, the group
of holes can only be seen under certain conditions, as they fit into the given hole arrangement.
To avoid problems when mounting the transformer, the manufacturing tolerances for positioning
the customers’ drilling process must be considered by increasing the hole diameter.
Surface-mount device