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    SESD_lab9-11 (24-25)

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    Carlos Gamio

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    SESD_lab9-11 (24-25)

    Uploaded by

    Carlos Gamio
    13 views5 pages

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    © © All Rights Reserved

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    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    13 views5 pages

    SESD_lab9-11 (24-25)

    Uploaded by

    Carlos Gamio

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
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    School of Computing, Engineering

    and Built Environment

    LABORATORY 9-11. COURSEWORK 2


    IMPLEMENTATION STUDY – 3­OPAMP INA

    HANDS-ON DESIGN

    During CW1 you’ve already prepared the schematic for the INA using a quad-OpAmp chip,
    LM324AD as shown in Figure 1:

    Figure 1: 3-OpAmp INA design on Multisim

    Once the circuit operates correctly during the simulations, the next step would be
    producing a prototype before starting the final production. This prototyping can be done in
    different ways:

    - Breadboards allow a very fast prototyping, but are only suitable for low frequencies
    and are prone to deficient contacts or loose wires. Only through-hole components
    can be placed, surface mounted devices (SMD) components cannot be used. On the
    other hand, it needs no soldering.

    - Stripboards (Veroboards) require soldering and cutting out traces, but produce
    more robust prototypes (it’s no longer easy to loose connections). It allows
    mounting of SMD components as long as the pitch (distance between pins) is
    matched. This is the option we’ll use in this coursework.

    M. Mata 1 SESD
    - Printed Circuit Boards (PCB) are used for final products. They allow accommodating
    both through-hole or SMD components with any pitch, optimize trace widths and
    impedances, and implement a number of protective elements such as ground planes.
    They can be produced with one or two copper layers (sides), and even built one
    upon another in a sandwich-like structure. However, they are expensive to produce,
    a large number of them needs to be manufactured to bring down the unit cost. In
    this coursework you’ve learnt the basics of PCB design using Ultiboard. After
    adding connectors, protections and mounting holes to the design, it is then possible
    to send the PCB design files to an electronic manufacturing company for the final
    production.

    TASK 1: CIRCUIT DESIGN ON STRIPBOARD (VEROBOARD)

    Make a list of the components (Bill of Materials, BOM) required to complete the design. All
    components are available from the technicians’ office M326A.

    Implement the circuit using stripboard as shown in Figure 2.

    2
    Figure 2: proposed stripboard design, top side (component side).
    Soldering and track cuts are done in the bottom side where the strips are found

    Notice that a stripboard provides long conductive strips to solder the components on,
    producing electrical connectivity between them (they become the circuit traces); these
    strips need to be cut out to break this connectivity and isolate one component from
    another whenever required.
    The recommended layout including track cuts is set out on Figure 2, but you can come out
    with your own design, there are templates that you can print out to help you doing that
    using pencil and eraser.

    The recommended method to implement the basic circuit in stripboard is:

    • Place the IC socket for the LM324 and solder the corner pins to hold it firm.
    • Using a fine marker, mark the position of each track cut. Be sure to remember that
    you have been given the component (top) view and you have to translate it so that
    you can create the track cuts on the underside (bottom) of the board.
    • Now make the necessary track cuts as shown with an appropriate track cutter.
    Verify the cut has been made. Test continuity it with a Multimeter.
    • When a connection is needed from one track to another, cut and form the necessary
    links with sheathed wire and solder into position.
    • Use longer wires to produce the board connectors: supply (+Vcc, -Vcc, GND), inputs
    (Vin1, Vin2) and output (Vout). Colour-coding the wires will reduce the chances of
    mistakes.

    3
    • Cut and form the leads of all the passive components and solder into position. Leads
    should not be longer than strictly needed.
    • Solder the remaining IC socket pins and carefully verify the layout.
    • Do not at this stage place the op-amp into the socket.

    Before proceeding to the next stage, get the laboratory assistant to teach you how to
    properly check the build including the solder connections.

    TASK 2: PRELIMINARY TESTS

    With +12V, -12V and GND connected to the board and the power turned on, use a
    Multimeter to probe the board and verify the voltages at the following points:

    • Check the supply voltages input to the board with respect to ground.
    • Check for the correct supply voltages at the IC socket.
    • Check the voltages at the outputs of each of the op-­­amps with respect to the GND
    connection.

    If everything checks out, turn off the supply and put the LM324 chip into its socket. Be
    mindful of the correct orientation (pin 1 in the IC to pin 1 in the socket) and not to
    introduce Electro-Static Discharge (ESD) with your fingers.

    TASK 3: EVALUATING THE DESIGN. COMMON_MODE REJECTION MEASUREMENTS

    The objective of the practical tests is to measure the differential gain Adiff, the common-
    mode gain ACM and hence the common-mode rejection ratio (CMRR) of the INA you have
    just constructed. This script will help you to record the relevant data for the 2nd
    coursework component (CW2) report II, and will also help you preparing the demo
    where you’ll demonstrate the differential and common-mode gains of your circuit to the lab
    teacher.

    Part 1. Test Adiff

    Use a 2-channel function generator (or two synchronised 1-channel) produce a purely
    differential signal with no common-mode component (making VIN1 = - VIN2). Set both
    channels to produce a 0.1 Vpk 10 kHz sine wave but set a phase shift of 180° on CH2.

    Use the oscilloscope to display VIN2, VIN1 and VDIFF = VIN2-VIN1. Take a screenshot for
    the report and measure the amplitude of VDIFF.

    Now display VOUT on the oscilloscope, take a screenshot and measure the amplitude of
    VOUT.

    Calculate the measured differential gain:

    𝑉𝑂𝑈𝑇 𝑉𝑂𝑈𝑇
    𝐴𝑑𝑖𝑓𝑓 = =
    𝑉𝑑𝑖𝑓𝑓 𝑉𝐼𝑁2 − 𝑉𝐼𝑁1

    4
    Part 2. Test ACM

    Connect together the terminals VIN1 and VIN2 and apply a 10 Vpk 1 kHz sine wave: the
    signal will now be purely common-mode (no differential component): VIN1=VIN2=VCM.

    Use the oscilloscope to display VCM and VOUT. Take a screenshot for the report and
    measure the amplitude of VOUT.

    Calculate the measured common-mode gain:

    𝑉𝑂𝑈𝑇 𝑉𝑂𝑈𝑇
    𝐴𝐶𝑀 = =
    (𝑉𝐼𝑁2 + 𝑉𝐼𝑁1 )/2 𝑉𝐶𝑀

    Hence determine the Common Mode Rejection Ratio (CMRR) exhibited by the INA:

    𝐴𝑑𝑖𝑓𝑓
    𝐶𝑀𝑅𝑅 = 20 log ( )
    𝐴𝐶𝑀

    TASK 4: DISCUSSION AND OBSERVATIONS FOR YOUR REPORT II

    1. Compare the measured value of Adiff with the theoretical value = 11. Explain any
    differences. Compare the measured value of the CMRR with the value from the
    simulation and explain any difference.
    2. State why a high CMRR value is desirable in an instrumentation amplifier (INA)
    3. State some factors which affect the operating value of the CMRR in the INA circuit.
    4. Provide an example of a commercially available INA.
    5. Discuss an application which requires an instrumentation amplifier.

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