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HiSilicon

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HiSilicon Co., Ltd.
Native name
海思半导体有限公司；上海海思
Company typeSubsidiary
IndustryFabless semiconductors, Semiconductors, Integrated circuit design
Founded1991; 33 years ago (1991)[1][citation needed]
HeadquartersShenzhen, Guangdong, China
ProductsSoCs
Brands
  • Kirin

    Gigahom Kunpeng Balong

    Ascend
ParentHuawei
Websitewww.hisilicon.com Edit this at Wikidata
HiSilicon
Simplified Chinese海思半导体有限公司
Traditional Chinese海思半導體有限公司
Literal meaningHaisi Semiconductor Limited Company
Transcriptions
Standard Mandarin
Hanyu PinyinHǎisī Bàndǎotǐ Yǒuxiàn Gōngsī

HiSilicon (Chinese: 海思; pinyin: Hǎisī) is a Chinese fabless semiconductor company based in Shenzhen, Guangdong province and wholly owned by Huawei. HiSilicon purchases licenses for CPU designs from ARM Holdings, including the ARM Cortex-A9 MPCore, ARM Cortex-M3, ARM Cortex-A7 MPCore, ARM Cortex-A15 MPCore,[2][3] ARM Cortex-A53, ARM Cortex-A57 and also for their Mali graphics cores.[4][5] HiSilicon has also purchased licenses from Vivante Corporation for their GC4000 graphics core.

HiSilicon is reputed to be the largest domestic designer of integrated circuits in China.[6] In 2020, the United States instituted rules that require any American firms providing equipment to HiSilicon or non-American firms who use American technologies or IPR (such as TSMC) that supply HiSilicon to have licenses[7] as part of the ongoing trade dispute, and Huawei announced it will stop producing its Kirin chipsets from 15 September 2020 onwards[8] due to this disruption of its supply chain. On August 29, 2023, Huawei announced the first fully domestically fabricated chip, the Kirin 9000S, which is used on its latest Mate 60 Pro phablet series of phones and MatePad 13.2 tablets.

History

[edit]

HiSilicon was Huawei's ASIC design center, which was founded in 1991.

  • 2004– Shenzhen HiSilicon Semiconductor Co., Ltd. was registered and the company was formally established.
  • 2016– HiSilicon's Kirin 960 chipset was rated one of the "best of Android 2016" in performance by Android Authority.[9]
  • 2019– Shanghai HiSilicon, a wholly-owned subsidiary of Huawei, was established.[10]

Smartphone application processors

[edit]
HiSilicon Hi6250

HiSilicon develops SoCs based on the ARM architecture. Though not exclusive, these SoCs see preliminary use in handheld and tablet devices of its parent company Huawei.

K3V2

[edit]

The first well known product of HiSilicon is the K3V2 used in Huawei Ascend D Quad XL (U9510) smartphones[11] and Huawei MediaPad 10 FHD7 tablets. This chipset is based on the ARM Cortex-A9 MPCore fabbed at 40 nm and uses a 16 core Vivante GC4000 GPU.[12] The SoC supports LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
K3V2 (Hi3620) 40 nm ARMv7 Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB 4 1.4 Vivante GC4000 240 MHz

(15.3GFlops)

LPDDR2 64-bit dual-channel 7.2 (up to 8.5) — — — — Q1 2012
List

K3V2E

[edit]

This is a revised version of K3V2 SoC with improved support of Intel baseband. The SoC supports LPDDR2-1066, but actual products are found with LPDDR-900 instead for lower power consumption.

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
K3V2E (Hi3620) 40 nm ARMv7 Cortex-A9 L1: 32 KB instruction + 32 KB data, L2: 1 MB 4 1.5 Vivante GC4000 240 MHz

(15.3GFlops)

LPDDR2 64-bit dual-channel 7.2 (up to 8.5) — — — — 2013
List

Kirin 620

[edit]

• supports – USB 2.0 / 13 MP / 1080p video encode

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 620 (Hi6220)[13] 28 nm ARMv8-A Cortex-A53 8[14] 1.2 Mali-450 MP4 500 MHz (32GFlops) LPDDR3 (800 MHz) 32-bit single-channel 6.4 — Dual SIM LTE Cat.4 (150 Mbit/s) — — Q1 2015
List

Kirin 650, 655, 658, 659

[edit]
Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 650 (Hi6250) 16 nm FinFET+ ARMv8-A Cortex-A53
Cortex-A53 		4+4 2.0 (4xA53) 1.7 (4xA53) Mali-T830 MP2 900 MHz

(40.8GFlops)

LPDDR3 (933 MHz) 64-bit dual-channel (2x32bit)[15] A-GPS, GLONASS Dual SIM LTE Cat.6 (300 Mbit/s) 802.11 b/g/n Bluetooth v4.1 Q2 2016
List
Kirin 655 2.12 (4xA53) 1.7 (4xA53) Q4 2016
List
Kirin 658 2.35 (4xA53) 1.7 (4xA53) 802.11 b/g/n/ac Q2 2017
List
  • P10 Lite

Kirin 710

[edit]
Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 710 (Hi6260) TSMC 12 nm FinFET ARMv8-A Cortex-A73
Cortex-A53 		4+4 2.2 (A73)

1.7 (A53)

Mali-G51 MP4 1000 MHz
(64 GFLOPS in FP32) 		LPDDR3 LPDDR4 32-bit A-GPS, GLONASS Dual SIM LTE Cat.12 (600 Mbit/s) 802.11 b/g/n Bluetooth v4.2 Q3 2018
List
  • Huawei Nova 3i, Honor 10 Lite, Huawei P Smart+, Huawei P Smart 2019, Huawei Mate 20 Lite, Honor 8X, Huawei Y9 (2019), Huawei P30 Lite，Huawei Y9 Prime 2019, Huawei Y9s, Huawei Mate 20 Lite, Honor 20i
Kirin 710F[16]
List
  • Honor 9X, Huawei P40 lite E, Huawei Y8p
Kirin 710A SMIC 14 nm FinFET[17] 2.0 (A73)

1.7 (A53)

List
  • Honor Play 4T, Huawei P smart 2021, Huawei Nova Y70, Huawei Nova Y71, Huawei Nova Y72, Huawei MatePad SE 11

Kirin 810 and 820

[edit]
  • DaVinci NPU based on Tensor Arithmetic Unit
  • Kirin 820 supported 5G NSA & SA
Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 810 (Hi6280) 7 nm FinFET ARMv8.2-A Cortex-A76
Cortex-A55
DynamIQ 		2+6 2.27 (2xA76)
1.9 (6xA55) 		Mali-G52 MP6 820 MHz
(157.4 GFLOPS in FP32) 		LPDDR4X (2133 MHz) 64-bit (16-bit quad-channel) 31.78 A-GPS, GLONASS, BDS Dual SIM LTE Cat.12 (600 Mbit/s) 802.11 b/g/n/ac Bluetooth v5.0 Q2 2019
List
    • Huawei Nova 5
    • Huawei Honor 9x
    • Huawei Honor 9x Pro
    • Huawei Mate 30 Lite
    • Huawei P40 Lite
    • Huawei Nova 7i
    • Huawei nova 6 SE
    • Huawei P smart Pro 2019
    • Huawei nova 5z
    • Huawei nova 5i Pro
    • Huawei Honor 20S
    • Huawei MatePad 10.4
Kirin 820 5G (1+3)+4 2.36 (1xA76 H)
2.22 (3xA76 L)
1.84 (4xA55) 		Mali-G57 MP6 Balong 5000 (Sub-6 GHz Only; NSA & SA) Q1 2020
List
  • Honor 30S
  • Honor X10 5G
Kirin 820E 5G 3+3
2.22 (4xA76 L)
1.84 (4xA55) 		Mali-G57 MP6 Balong 5000 (Sub-6 GHz Only; NSA & SA) Q1 2021

Kirin 8000

[edit]

HiSilicon Kirin 8000 is a mid-range Kirin 8 series chip not officially announced, however, it was released along with the announcement of Huawei nova 12.[18]

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 8000 SMIC N+2 
7 nm FinFET 		ARMv8.2-A Cortex-A77
Cortex-A77
Cortex-A55
DynamIQ 		1+3+4 2.40 (1xA77 H)
2.19 (3xA77 L)
1.84 (4xA55) 		Mali-G610 MP4 864 MHz LPDDR5 (3200 MHz) 64-bit (16-bit quad-channel) 51.2 GPS, A-GPS, GLONASS, BeiDou, Galileo, QZSS Balong modem Wi-Fi 6 (11ax) Bluetooth v5.2 Q2 2019
List
    • Huawei Nova 12
    • Huawei Nova 12 Pro
    • Huawei Nova Flip

Kirin 910 and 910T

[edit]
Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 910 (Hi6620) 28 nm HPM ARMv7 Cortex-A9 4 1.6 Mali-450 MP4 533 MHz

(32GFlops)

LPDDR3 32-bit single-channel 6.4 — LTE Cat.4 — — H1 2014
List
  • HP Slate 7 VoiceTab Ultra, Huawei MediaPad X1,[19] Huawei P6 S,[20] Huawei MediaPad M1,[21] Huawei Honor 3C 4G
Kirin 910T 1.8 700 MHz

(41.8GFlops)

— — — H1 2014
List
  • Huawei Ascend P7

Kirin 920, 925 and 928

[edit]

• The Kirin 920 SoC also contains an image processor that supports up to 32-megapixel

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 920 28 nm HPM ARMv7 Cortex-A15
Cortex-A7
big.LITTLE		 4+4 1.7 (A15)
1.3 (A7) 		Mali-T628 MP4 600 MHz

(76.8GFlops)

LPDDR3 (1600 MHz) 64-bit dual-channel 12.8 — LTE Cat.6 (300 Mbit/s) — — H2 2014
List
Kirin 925 (Hi3630) 1.8 (A15)
1.3 (A7) 		— — — Q3 2014
List
Kirin 928 2.0 (A15)
1.3 (A7) 		— — — —
List
  • Huawei Honor6 extreme Edition

Kirin 930 and 935

[edit]

• supports – SD 3.0 (UHS-I) / eMMC 4.51 / Dual-band a/b/g/n Wi-Fi / Bluetooth 4.0 Low Energy / USB 2.0 / 32 MP ISP / 1080p video encode

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 930 (Hi3635) 28 nm HPC ARMv8-A Cortex-A53
Cortex-A53 		4+4 2.0 (A53)
1.5 (A53) 		Mali-T628 MP4 600 MHz

(76.8GFlops)

LPDDR3 (1600 MHz) 64-bit(2x32-bit) Dual-channel 12.8 GB/s — Dual SIM LTE Cat.6 (DL:300 Mbit/s UP:50 Mbit/s) — — Q1 2015
List
Kirin 935 2.2 (A53)
1.5 (A53) 		680 MHz

(87GFlops)

— — — Q1 2015
List

Kirin 950 and 955

[edit]

• supports – SD 4.1 (UHS-II) / UFS 2.0 / eMMC 5.1 / MU-MIMO 802.11ac Wi-Fi / Bluetooth 4.2 Smart / USB 3.0 / NFS / Dual ISP (42 MP) / Native 10-bit 4K video encode / i5 coprocessor / Tensilica HiFi 4 DSP

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 950 (Hi3650) TSMC 16 nm FinFET+[23] ARMv8-A Cortex-A72
Cortex-A53
big.LITTLE 		4+4 2.3 (A72)
1.8 (A53) 		Mali-T880 MP4 900 MHz

(168 GFLOPS FP32)

LPDDR4 64-bit(2x32-bit) Dual-channel 25.6 — Dual SIM LTE Cat.6 — — Q4 2015
List
  • Huawei Mate 8, Huawei Honor V8 32 GB, Huawei Honor 8, Huawei Honor Magic, Huawei MediaPad M3 (BTV-W09)[24]
Kirin 955[25] 2.5 (A72)
1.8 (A53) 		LPDDR3 (3 GB) LPDDR4 (4 GB) — — — Q2 2016
List
  • Huawei P9, Huawei P9 Plus, Honor Note 8, Honor V8 64 GB

Kirin 960

[edit]
  • Interconnect: ARM CCI-550, Storage: UFS 2.1, eMMC 5.1, Sensor Hub: i6
Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 960 (Hi3660)[26] TSMC 16 nm FFC ARMv8-A Cortex-A73
Cortex-A53
big.LITTLE 		4+4 2.36 (A73)
1.84 (A53) 		Mali-G71 MP8 1037 MHz
(199.1 GFLOPS in FP32) 		LPDDR4-1600 64-bit(2x32-bit) Dual-channel 28.8 — Dual SIM LTE Cat.12 LTE 4x CA, 4x4 MIMO — — Q4 2016
List

Kirin 970

[edit]
  • Interconnect: ARM CCI-550, Storage: UFS 2.1, Sensor Hub: i7
  • Cadence Tensilica Vision P6 DSP.[27]
  • NPU made in collaboration with Cambricon Technologies. 1.92T FP16 OPS.[28]
Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 970 (Hi3670) TSMC 10 nm FinFET+ ARMv8-A Cortex-A73
Cortex-A53
big.LITTLE 		4+4 2.36 (A73)
1.84 (A53) 		Mali-G72 MP12 746 MHz
(214.8 GFLOPS in FP32) 		LPDDR4X-1866 64-bit(4x16-bit) Quad-channel 29.8 Galileo Dual SIM LTE Cat.18 LTE 5x CA, No 4x4 MIMO — — Q4 2017
List

Kirin 980 and Kirin 985 5G/4G

[edit]

Kirin 980 is HiSilicon's first SoC based on 7 nm FinFET technology.

  • Interconnect: ARM Mali G76-MP10, Storage: UFS 2.1, Sensor Hub: i8
  • Dual NPU made in collaboration with Cambricon Technologies.

Kirin 985 5G is the second Hisilicon's 5G SoC based on 7 nm FinFET Technology.

  • Interconnect: ARM Mali-G77 MP8, Storage UFS 3.0
  • Big-Tiny Da Vinci NPU: 1x Da Vinci Lite + 1x Da Vinci Tiny
Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 980 TSMC 7 nm FinFET ARMv8.2-A Cortex-A76
Cortex-A55
DynamIQ 		(2+2)+4 2.6 (A76 H)
1.92 (A76 L)
1.8 (A55) 		Mali-G76 MP10 720 MHz
(345.6 GFLOPS in FP32)[29] 		LPDDR4X-2133 64-bit(4x16-bit) Quad-channel 34.1 Galileo Dual SIM LTE Cat.21 LTE 5x CA, No 4x4 MIMO — — Q4 2018
List
Kirin 985 5G/4G (Hi6290) (1+3)+4 2.58 (A76 H)
2.40 (A76 L)
1.84 (A55) 		Mali-G77 MP8 700 MHz
(358.4 GFLOPS in FP32) 		Balong 5000 (Sub-6 GHz only; NSA & SA), 4G version available — — Q2 2020
List
  • Honor 30
  • Honor V6
  • Huawei nova 7 5G
  • Huawei nova 7 Pro 5G
  • Huawei nova 8 5G
  • Huawei nova 8 Pro 5G

Kirin 990 4G, Kirin 990 5G and Kirin 990E 5G

[edit]

Kirin 990 5G is HiSilicon's first 5G SoC based on N7 nm+ FinFET technology.[30]

  • Interconnect
    • Kirin 990 4G: ARM Mali-G76 MP16
    • Kirin 990 5G: ARM Mali-G76 MP16
    • Kirin 990E 5G: ARM Mali-G76 MP14
  • Da Vinci NPU.
    • Kirin 990 4G: 1x Da Vinci Lite + 1x Da Vinci Tiny
    • Kirin 990 5G: 2x Da Vinci Lite + 1x Da Vinci Tiny
    • Kirin 990E 5G: 1x Da Vinci Lite + 1x Da Vinci Tiny
  • Da Vinci Lite features 3D Cube Tensor Computing Engine (2048 FP16 MACs + 4096 INT8 MACs), Vector unit (1024bit INT8/FP16/FP32)
  • Da Vinci Tiny features 3D Cube Tensor Computing Engine (256 FP16 MACs + 512 INT8 MACs), Vector unit (256bit INT8/FP16/FP32)[31]
Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 990 4G TSMC 7 nm FinFET (DUV) ARMv8.2-A Cortex-A76
Cortex-A55
DynamIQ 		(2+2)+4 2.86 (A76 H)
2.09 (A76 L)
1.86 (A55) 		Mali-G76 MP16 600 MHz
(460.8 GFLOPS in FP32) 		LPDDR4X-2133 64-bit(4x16-bit) Quad-channel 34.1 Beidou, Galileo, GLONASS Balong 765 (LTE Cat.19) — — Q4 2019
List
Kirin 990 5G TSMC 7 nm+ FinFET (EUV) 2.86 (A76 H)
2.36 (A76 L)
1.95 (A55) 		Balong 5000 (Sub-6-GHz only; NSA & SA) — —
List
  • Huawei Mate 30 5G
  • Huawei Mate 30 Pro 5G
  • Huawei Mate 30 RS Porche Design
  • Huawei P40
  • Huawei P40 Pro
  • Huawei P40 Pro+
  • Honor V30 Pro
  • Huawei MatePad Pro 5G (2020)
  • Honor 30 Pro
  • Honor 30 Pro+
Kirin 990E 5G Mali-G76 MP14 600 MHz
(403.2 GFLOPS in FP32) 		— — Q4 2020
List
  • Huawei Mate 30E Pro 5G
  • Huawei Mate 40E (4G/5G)

Kirin 9000 5G/4G and Kirin 9000E, Kirin 9000L

[edit]

Kirin 9000 is HiSilicon's first SoC based on 5 nm+ FinFET (EUV) TSMC technology (N5 node) and the first 5 nm SoC to be launched on the international market.[32] This octa-core system on a chip is based on the 9th Gen of the HiSilicon Kirin series and is equipped with 15.3 billion transistors in a 1+3+4 core configuration: 4 Arm Cortex-A77 CPU (1x 3.13 GHz and 3x 2.54 GHz), 4 Arm Cortex-A55 (4x 2.05 GHz) and a 24-core Mali-G78 GPU (22-core in the Kirin 9000E version) The Kirin 9000L uses a 1+2+3 core configuration: 3 Arm Cortex-A77 (1x 3.13 GHz and 2x 2.54 GHz), 3 Arm Cortex-A55 (3x 2.05 GHz) and a 22-core Mali-G78 GPU with Kirin Gaming+ 3.0 implementation.[32]

The integrated quad pipeline NPU (Dual Big Core + 1 Tiny Core configuration) is equipped with the Kirin ISP 6.0 to support advanced computational photography. The Huawei Da Vinci Architecture 2.0 for AI supports 2x Ascend Lite + 1x Ascend Tiny (only 1 Lite in 9000E/L). The system cache is 8 MB and the SoC works with the new LPDDR5/4X memories (made by Samsung in the Huawei Mate 40 series). Due to the integrated 3rd generation 5G proprietary modem "Balong 5000", Kirin 9000 supports 2G, 3G, 4G and 5G SA & NSA Sub-6 GHz connectivity.[32] The SoC's TDP is 6W.

The 2021 4G version of the Kirin 9000 has the Balong modem limited via software to comply with the ban imposed on Huawei by the US government for non-chinese 5G technologies. The Kirin 9006C is a rebranded variant of the Kirin 9000E for the Huawei Qingyun L420 and L540 laptops.[33][34]

  • GPU
    • Kirin 9000L: ARM Mali-G78 MP22
    • Kirin 9000E: ARM Mali-G78 MP22
    • Kirin 9000: ARM Mali-G78 MP24
  • Da Vinci NPU architecture 2.0
    • Kirin 9000L: 1x Big Core + 1x Tiny Core
    • Kirin 9000E: 1x Big Core + 1x Tiny Core
    • Kirin 9000: 2x Big Cores + 1x Tiny Core
Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 9000L TSMC 5 nm+ FinFET (EUV) ARMv8.2-A Cortex-A77
Cortex-A55
DynamIQ 		(1+2)+3 3.13 (A77 H)
2.54 (A77 L)
2.05 (A55) 		Mali-G78 MP22 759 MHz (1068.7 GFLOPS in FP32) LPDDR4X-2133
LPDDR5-2750 		64-bit(4x16-bit) Quad-channel 34.1 (LPDDR4X)
44 (LPDDR5) 		Beidou, Galileo, GLONASS Balong 5000 (Sub-6-GHz only; NSA & SA) Wi-Fi 6 Q4 2020 Huawei Mate 40E Pro
Kirin 9000E (1+3)+4 Balong 5000 (Sub-6-GHz only; NSA & SA), 4G version available — —
List
Kirin 9000 Mali-G78 MP24 759 MHz (1165.8 GFLOPS in FP32) Wi-Fi 6
List
  • Huawei Mate 40 Pro
  • Huawei Mate 40 Pro+
  • Huawei Mate 40 RS Porsche Design
  • Huawei P50 Pro
  • Huawei Mate X2

Kirin 9000S and Kirin 9010 Family

[edit]

The Kirin 9000S, Kirin 9000S1, and Kirin 9010 of the Kirin 9000 Hi36A0 family are the first HiSilicon-developed SoCs manufactured in high volumes in mainland China by SMIC. The SoC had its debut with the Huawei Mate 60 in late 2023 with the Kirin 9000S alongside overclocked enhancements of the Kirin 9000S1 and Kirin 9010 with the Huawei Pura 70 series in early 2024.[35] According to Tom's Hardware, the Taishan V120 core, developed by HiSilicon, was roughly on par with AMD's Zen 3 cores from late 2020.[36] Four of these cores were used in the 9000 series alongside four efficiency-focused Arm Cortex-A510 cores.[37] The SoCs are based on SMIC's 7nm technology node, referred to as "N+2". It also includes 1 Da Vinci "big" NPU core and 1 Da Vinci "small" NPU core. Kirin 9000W, a Wi-Fi only SoC for the Huawei MatePad Pro 13.2 Wi-Fi only model, debuted in global markets in Q1 2024. The Kirin 9010 and Kirin 9000S1 debuted in Q2 2024, using a modified 2+6+4 core configuration with a new large Taishan core with the same configurations of medium and small cores from the Kirin 9000S with faster enhancements over the Kirin 9000S.[38]

Model Number Fab CPU GPU Memory Technology Nav Wireless Sampling availability Devices using
ISA Microarchitecture Cores (Total) Threads (Total) Frq (GHz) Microarchitecture Frq (MHz) Type Bus width (bit) Bandwidth (GB/s) Cellular WLAN PAN
Kirin 9000S (Hi36A0) SMIC 7 nm FinFET[39][40] ARMv8.x HiSilicon Taishan microarchitecture,
Cortex-A510 		1+3+4 (8) 2+6+4 (12) 2.62 (TaishanV120)
2.15 (TaishanV120)
1.53 (Cortex-A510) 		HiSilicon Maleoon 910 (Up to 4 CUs / 1,024 ALUs) 750 MHz (Up to 1,536 GFLOPS in FP32) LPDDR5-6400

LPDDR5X-8533

64-bit (4x16-bit) Quad-channel 51.2 (LPDDR5)

68.2 (LPDDR5X)

Beidou, Galileo, GLONASS Balong 5000 5G 3GPP Rel. 15 (Sub-6-GHz) Wi-Fi 6 (External Module) Bluetooth 5.2, NearLink

NFC

Q3 2023
List
Kirin 9000S1 (Hi36A0) 2.49 (TaishanV120)
2.15 (TaishanV120)
1.53 (Cortex-A510) 		Q1 2024 Huawei Pura 70
Kirin 9000W (Hi36A0) — Q4 2023
List
Kirin 9000WL (Hi36A0) — Q2 2024 Huawei MatePad 11.5 S PaperMatte Edition
Kirin 9000WE (Hi36A0) — Q2 2024 Huawei MatePad 11.5 S (12GB RAM)
Kirin T90 (Hi36A0) — Q3 2024 Huawei MatePad Air (2024)
Kirin T90A (Hi36A0) — Q3 2024 Huawei MatePad 12 X
Kirin 9000SL (Hi36A0) 1+2+3 (6) 2+4+3 (9) 2.35 (TaishanV120)
2.15 (TaishanV120)
1.53 (Cortex-A510) 		Balong 5000 5G 3GPP Rel. 15 (Sub-6-GHz) Q4 2023 Huawei Nova 12 Ultra
Kirin 9000WM (Hi36A0) — Q2 2024 Huawei MatePad 11.5 S Smart Model
Kirin 9010 (Hi36A0) 1+3+4 (8) 2+6+4 (12) 2.30 (TaishanV121)
2.18 (TaishanV120)
1.55 (Cortex-A510) 		Balong 5000 5G 3GPP Rel. 15 (Sub-6-GHz) Q2 2024
List
Kirin 9010E (Hi36A0) 2.19 (TaishanV121)
2.18 (TaishanV120)
1.55 (Cortex-A510) 		Q3 2024 Huawei Nova Flip
Kirin 9010A (Hi36A0) Q3 2024
Kirin 9010W (Hi36A0) — Q3 2024
Kirin T91 (Hi36A0) — Q3 2024 Huawei MatePad Pro 12.2 (2024)
Kirin 9010L (Hi36A0) 1+2+3 (6) 2+4+3 (9) 2.19 (TaishanV121)
2.18 (TaishanV120)
1.40 (Cortex-A510) 		Balong 5000 5G 3GPP Rel. 15 (Sub-6-GHz) Q2 2024 Huawei Nova 12 Ultra Star Edition

Smartphone modems

[edit]

HiSilicon develops smartphone modems which are primarily used in its parent company Huawei's handheld and tablet devices.

Balong 700

[edit]

The Balong 700 supports LTE TDD/FDD.[41] Its specs:

  • 3GPP R8 protocol
  • LTE TDD and FDD
  • 4x2/2x2 SU-MIMO

Balong 710

[edit]

At MWC 2012, HiSilicon released the Balong 710.[42] It is a multi-mode chipset supporting 3GPP Release 9 and LTE Category 4 at GTI (Global TD-LTE Initiative). The Balong 710 was designed to be used with the K3V2 SoC. Its specs:

  • LTE FDD mode : 150 Mbit/s downlink and 50 Mbit/s uplink.
  • TD-LTE mode: up to 112 Mbit/s downlink and up to 30 Mbit/s uplink.
  • WCDMA Dual Carrier with MIMO: 84 Mbit/s downlink and 23 Mbit/s uplink.

Balong 720

[edit]

The Balong 720 supports LTE Cat6 with 300 Mbit/s peak download rate.[41] Its specs:

  • TSMC 28 nm HPM process
  • TD-LTE Cat.6 standard
  • Dual-carrier aggregation for the 40 MHz bandwidth
  • 5-mode LTE Cat6 Modem

Balong 750

[edit]

The Balong 750 supports LTE Cat 12/13, and it is first to support 4CC CA and 3.5 GHz.[41] Its specs:

  • LTE Cat.12 and Cat.13 UL network standards
  • 2CC (dual-carrier) data aggregation
  • 4x4 multiple-input multiple-output (MIMO)
  • TSMC 16 nm FinFET+ process

Balong 765

[edit]

The Balong 765 supports 8×8 MIMO technology, LTE Cat.19 with downlink data-rate up to 1.6 Gbit/s in FDD network and up to 1.16 Gbit/s in the TD-LTE network.[43] Its specs:

  • 3GPP Rel.14
  • LTE Cat.19 Peak data rate up to 1.6 Gbit/s
  • 4CC CA + 4×4 MIMO/2CC CA + 8×8 MIMO
  • DL 256QAM
  • C-V2X

Balong 5G01

[edit]

The Balong 5G01 supports the 3GPP standard for 5G with downlink speeds of up to 2.3 Gbit/s. It supports 5G across all frequency bands including sub-6 GHz and millimeter wave (mmWave).[41] Its specs:

  • 3GPP Release 15
  • Peak data rate up to 2.3 Gbit/s
  • Sub-6 GHz and mmWave
  • NSA/SA
  • DL 256QAM

Balong 5000

[edit]

The Balong 5000 is the world's first 7 nm TSMC 5G multi-mode chipset (launched in Q1 2019), the world's first SA/NSA implementation, and the first smartphone chipset to support the full NR TDD/FDD spectrum.[44] The modem has an advanced 2G, 3G, 4G, and 5G connectivity.[45] Its specs:

  • 2G/3G/4G/5G Multi Mode
  • Fully compliant with 3GPP Release 15
  • Sub-6 GHz: 100 MHz x 2CC CA
  • Sub-6 GHz: Downlink up to 4.6 Gbit/s, Uplink up to 2.5 Gbit/s
  • mmWave: Downlink up to 6.5 Gbit/s, Uplink up to 3.5 Gbit/s
  • NR+LTE: Downlink up to 7.5 Gbit/s
  • FDD & TDD Spectrum Access
  • SA & NSA Fusion Network Architecture
  • Supports 3GPP R14 V2X
  • 3 GB LPDDR4X RAM[46]

Wearable SoCs

[edit]

HiSilicon develops SoCs for wearables such as wireless earbuds, wireless headphones, neckband earbuds, smart speakers, smart eyewear, and smartwatches.[47]

Kirin A1

[edit]

The Kirin A1 (Hi1132) was announced on 6 September 2019.[47] It features:

  • BT/BLE dual-mode Bluetooth 5.1[48]
  • Isochronous Dual Channel transmission technology
  • 356 MHz audio processor
  • Cortex-M7 microprocessor

Kirin A2

[edit]

The Kirin A2 was announced on September 25, 2023.[49] It features:

  • Faster Transmission
  • Stable signal with Polar code technology
  • Increase of 50% in computing power performance
  • Audio Vivid

Server processors

[edit]

HiSilicon develops server processor SoCs based on the ARM architecture.

Hi1610

[edit]

The Hi1610 is HiSilicon's first generation server processor announced in 2015. It features:

  • 16x ARM Cortex-A57 at up to 2.1 GHz[50]
  • 48 KB L1-I, 32 KB L1-D, 1 MB L2/4 cores and 16 MB CCN L3
  • TSMC 16 nm
  • 2x DDR4-1866
  • 16 PCIe 3.0

Hi1612

[edit]

The Hi1612 is HiSilicon's second generation server processor launched in 2016. It is the first chiplet-based Kunpeng with two computing dies. It features:

  • 32x ARM Cortex-A57 at up to 2.1 GHz[50]
  • 48 KB L1-I, 32 KB L1-D, 1 MB L2/4 cores and 32 MB CCN L3
  • TSMC 16 nm
  • 4x DDR4-2133
  • 16 PCIe 3.0

Kunpeng 916 (formerly Hi1616)

[edit]

The Kunpeng 916 (formerly known as Hi1616) is HiSilicon's third generation server processor launched in 2017. The Kunpeng 916 is used in Huawei's TaiShan 2280 Balanced Server, TaiShan 5280 Storage Server, TaiShan XR320 High-Density Server Node and TaiShan X6000 High-Density Server.[51][52][53][54] It features:

  • 32x ARM Cortex-A72 at up to 2.4 GHz[50]
  • 48 KB L1-I, 32 KB L1-D, 1 MB L2/4 cores and 32 MB CCN L3
  • TSMC 16 nm
  • 4x DDR4-2400
  • 2-way Symmetric multiprocessing (SMP), Each socket has 2x ports with 96 Gbit/s per port (total of 192 Gbit/s per each socket interconnects)
  • 46 PCIe 3.0 and 8x 10 Gigabit Ethernet
  • 85 W

Kunpeng 920 (formerly Hi1620)

[edit]

The Kunpeng 920 (formerly known as Hi1620) is HiSilicon's fourth generation server processor announced in 2018, and launched in 2019. Huawei claims the Kunpeng 920 CPU scores more than an estimated 930 on SPECint_rate_base2006.[55] The Kunpeng 920 is used in Huawei's TaiShan 2280 V2 Balanced Server, TaiShan 5280 V2 Storage Server, and TaiShan XA320 V2 High-Density Server Node.[56][57][58] It features:

  • 32 to 64x custom TaiShan V110 cores at up to 2.6 GHz.[59]
  • The TaiShan V110 core is a 4-way superscalar, out-of-order microarchitecture that implements the ARMv8.2-A ISA. Huawei reports the core supports almost all the ARMv8.4-A ISA features with a few exceptions, including the dot product and FP16 FML extensions.[59]
  • The TaiShan V110 cores are likely a new core not based on ARM designs[60][original research?]
  • 3x Simple ALUs, 1x Complex MDU, 2x BRUs (sharing ports with ALU2/3), 2x FSUs (ASIMD FPU), 2x LSUs[60]
  • 64 KB L1-I, 64 KB L1-D, 512 KB Private L2 and 1 MB L3/core Shared.
  • TSMC 7 nm HPC
  • 8x DDR4-3200
  • 2-way and 4-way symmetric multiprocessing (SMP). Each socket has 3x Hydra ports with 240 Gbit/s per port (total of 720 Gbit/s per each socket interconnects)
  • 40 PCIe 4.0 with CCIX support, 4x USB 3.0, 2x SATA 3.0, 8x SAS 3.0 and 2x 100 gigabit ethernet
  • 100 to 200 W
  • Compression engine (GZIP, LZS, LZ4) capable of up to 40 Git/s compress and 100 Gbit/s decompress
  • Crypto offload engine (for AES, DES, 3DES, SHA1/2, etc..) capable of throughputs up to 100 Gbit/s

Kunpeng 930 (formerly Hi1630)

[edit]

The Kunpeng 930 (formerly known as Hi1630) is HiSilicon's fifth-generation server processor announced in 2019 and scheduled for launch in 2021. It features:

  • 80 custom TaishanV120 cores at 3 GHz frequency, with support for simultaneous multithreading (SMT) and ARM's Scalable Vector Extension (SVE).[59]
  • 64 KB L1-I, 64 KB L1-D, 512 KB Private L2 and 1 MB L3/core Shared
  • TSMC 5 nm
  • 8x DDR5

Kunpeng 950

[edit]

The Kunpeng 950 is HiSilicon's sixth-generation server processor announced in 2019 and scheduled for launch in 2023.

AI acceleration

[edit]

HiSilicon also develops AI Acceleration chips.

Da Vinci architecture

[edit]

Each Da Vinci Max AI Core features a 3D Cube Tensor Computing Engine (4096 FP16 MACs + 8192 INT8 MACs), a vector unit (2048bit INT8/FP16/FP32), and a scalar unit. It includes a new AI framework called "MindSpore", a platform-as-a-service product called ModelArts, and a lower-level library called Compute Architecture for Neural Networks (CANN).[31]

Ascend 310

[edit]

The Ascend 310 is an AI inference SoC, it was codenamed Ascend-Mini. The Ascend 310 is capable of 16 TOPS@INT8 and 8 TOPS@FP16.[61] The Ascend 310 features:

  • 2x Da Vinci Max AI cores[31]
  • 8x ARM Cortex-A55 CPU cores
  • 8 MB on-chip buffer
  • 16 channel video decode – H.264/H.265
  • 1 channel video encode – H.264/H.265
  • TSMC 12 nm FFC process
  • 8W TDP

Ascend 910

[edit]

The Ascend 910 is an AI training SoC, it was codenamed Ascend-Max. which delivers 256 TFLOPS@FP16 and 512 TOPS@INT8. The Ascend 910 features:

  • 32x Da Vinci Max AI cores arranged in 4 clusters[31]
  • 1024-bit NoC Mesh @ 2 GHz, with 128 GB/s bandwidth Read/Write per core
  • 3x 240 Gbit/s HCCS ports for Numa connections
  • 2x 100 Gbit/s RoCE interfaces for networking
  • 4x HBM2E, 1.2 TB/s bandwidth
  • 3D-SRAM stacked below AI SoC die
  • 1228 mm2 Total die size (456 mm2 Virtuvian AI SoC, 168 mm2 Nimbus V3 IO Die, 4x96 mm2 HBM2E, 2x110 mm2 Dummy Die)
  • 32 MB on-chip buffer
  • 128 channel video decode – H.264/H.265
  • TSMC 7 nm EUV (N7+) process
  • 350 W

See also

[edit]

References

[edit]
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  2. ^ HiSilicon Licenses ARM Technology for use in Innovative 3G/4G Base Station, Networking Infrastructure and Mobile Computing Applications Archived 27 January 2013 at the Wayback Machine, 2 August 2011 on ARM.com
  3. ^ "HiSilicon Technologies Co., Ltd. 海思半导体有限公司". ARM Holdings. Archived from the original on 15 January 2013. Retrieved 26 April 2013.
  4. ^ ARM Launches Cortex-A50 Series, the World’s Most Energy-Efficient 64-bit Processors Archived 5 January 2013 at the Wayback Machine on ARM.com
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