300mm Ultima HDP-CVD Maintenance Manual
300mm Ultima HDP-CVD Maintenance Manual
300mm Ultima
HDP-CVD
Maintenance Manual
The materials and information contained herein are being provided by Applied Materials
to its Customer solely for Customer’s use for its internal business purposes.
Applied Materials retains all right, title, interest in and copyrights to the materials and
information herein. The materials and information contained herein constitute
confidential information of Applied Materials and Customer shall not disclose or
transfer any of these materials or information to any third party.
PUBLICATION HISTORY
Revision: 001
Date: January 2000
Cleanroom Part Number 0230-00134
Standard Part Number 0230-00133
Applied Materials, the Applied Materials logo, Centura, and Precision 5000
are registered trademarks of Applied Materials, Inc. in the U.S. and other countries;
DARC, DCVD, DxZ, Giga-Fill, GPLIS, µClean, Optima, Precision Liquid Injection System,
Producer, Remote Clean, SACVD, and Twin Chamber
are trademarks of Applied Materials, Inc. in the U.S. and other countries
All rights reserved. No part of this book may be reproduced in any form
without written permission from Applied Materials, Inc.
Trademarks
Name Owner
Table of Contents
Title Page
1 Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.1 Safety Hazard Alerts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.2 Emergency Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3
1.3 Lockout/Tagout (LOTO) Safety Procedure for the Centura System . . . . . . . . . . 1-5
1.3.1 Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
1.3.2 Scope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
1.3.3 Objectives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
1.3.4 Reference Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
1.3.5 Prerequisites . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
1.4 General Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
1.4.1 Notification of Maintenance Activity. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
1.4.2 Use/Availability of Lockout Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
1.4.3 Testing and Verification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
1.4.4 Shift Change Lockout/Tagout Procedure . . . . . . . . . . . . . . . . . . . . . . 1-6
1.4.5 Non-Standard Removal of Lockout/Tagout Equipment . . . . . . . . . . . . 1-7
1.4.6 300mm Ultima HDP-CVD Chamber Lockout Procedure . . . . . . . . . . . 1-7
1.5 Maintenance Task Classifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
1.6 Procedures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-9
1.6.1 Electrical Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-9
1.6.1.1 AC Power Systems. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
1.6.1.2 DC Power Systems. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
1.6.1.3 RF/ASTRON Power Systems (RF Gen-Rack) . . . . . . . . . 1-10
1.6.2 Mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12
1.6.2.1 Robot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12
1.6.2.2 Loadlock Elevators (Cassette Indexer). . . . . . . . . . . . . . . 1-12
1.6.2.3 Slit Valves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12
1.6.2.4 Chemical. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14
1.6.2.5 Thermal. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-14
1.6.3 Specific Activities. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-15
1.6.3.1 Chamber Maintenance (i.e., Wet Cleans, Process
Kit Change, Window Replacement, Etc.) . . . . . . . . . . . . . 1-15
1.7 Gas Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16
1.7.1 Process Gas Lockout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16
1.7.2 Process Gas Introduction Preparations. . . . . . . . . . . . . . . . . . . . . . . . 1-17
1.7.3 Radio Frequency (RF) Lockout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-19
1.7.4 Chamber Heater Lockout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-19
1.7.5 ESC Lockout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-20
1.7.6 Slit Valve Lockout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-20
1.7.7 Transfer Chamber Lockout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-21
1.7.8 Inboard Leak Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-22
1.7.9 Outboard Leak Test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-23
1.7.10 Isoproply Alcohol (IPA) Warning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-23
1.7.11 Interlock Safety . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-24
1.7.12 Hazardous Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-25
C-ii 311-023-02 300mm Ultima HDP-CVD Maintenance Manual CONTENTS C
List of Tables
Title Page
List of Figures
Title Page
1 Safety
The 300mm Ultima HDP-CVD (dielectric chemical vapor deposition) Centura system uses
high voltage electrical power and radio frequency (RF) energy. The system may also be
configured to use reactive gases that require careful handling. These gases can be toxic,
poisonous, pyrofaric, or caustic.
Hardware and software interlocks, hazard alert labels and protective guards are used on
potentially hazardous areas of the HDP-CVD Centura system. These safeguards protect
personnel from exposure to hazards during normal operation and maintenance.
For additional safety information concerning the HDP-CVD Centura system, see the
Applied Materials Centura 300 Safety Manual.
• DANGER indicates immediate hazards that WILL cause severe personal injury
or death.
• WARNING indicates hazards or unsafe practices that COULD cause severe
personal injury or death.
• CAUTION indicates hazardous or unsafe practices that COULD cause minor
personal injury or damage to products or property.
Read and understand the warnings and cautions found in the appropriate manual before
performing any maintenance.
1-2 311-023-02 Safety CHAPTER 1
BACKGROUND
COLOR
SAFETY ALERT SIGNAL WORD
BLACK WHITE SYMBOL PANEL
BORDER BACKGROUND
HAZARDOUS VOLTAGE
Contact may cause electric
shock or burn. Turn off &
lock out system before
servicing.
0060-76128 Rev. B
YELLOW MESSAGE
BACKGROUND PANEL
PART NUMBER
For complete safety information, see the Centura 300 Safety Manual.
CHAPTER 1 Safety 311-023-02 1-3
The EMO buttons are large, red push-buttons. Press one of the EMO buttons when you see
a potential hazard in the system and want to stop the entire system immediately. When any
EMO button is pressed, the EMO circuit will power down the system immediately and place
the whole system in the following safe shutdown condition:
However, the electrical components upstream of the main contactor remain energized, even
when the EMO circuit is activated. These components are all located in the System Controller.
NOTE
The EMO circuit is intended to be used only in emergency situations.
Whenever possible, remove power to the specific component, rather than
using the EMO circuit to power down the entire system.
See Table 1-1 for a description of the interlocks provided in the design and operation of the
300mm Ultima HDP-CVD Chamber.
1-4 311-023-02 Safety CHAPTER 1
1.3.1 Policy
It is the policy of Applied Materials to control and eliminate injury or equipment damage
resulting from the accidental start-up or release of stored energy, and to comply with pertinent
governmental laws and regulations
1.3.2 Scope
This procedure covers all 300mm Centura Service Personnel, Equipment and System
Maintenance Operations.
1.3.3 Objectives
This document is intended to provide specific information, and supplement the
Applied Materials Corporate Safety “Lockout/Tagout” procedure regarding safe installation,
service, and maintenance of the 300mm Centura system.
1.3.5 Prerequisites
All Personnel installing, servicing, and maintaining the 300mm Centura systems must be
trained in regulatory requirements and this procedure.
The following hazards are present on the Applied Materials 300mm Centura system:
• Electrical
• Mechanical
• Hazardous Gases/Liquids
• Thermal
1-6 311-023-02 Safety CHAPTER 1
CAUTION
In compliance with the safety regulations, a software feature is not an acceptable means of
controlling Hazardous Energies. Software feature/command must be backed up with a physical
lock or blocking device with LOTO capability.
After a lockout device is applied, test or verify that the energy source is truly isolated
(i.e., voltage reading at zero with an volt meter).
If service activities continue beyond the shift and includes a change in service personnel, a
complete and accurate passdown must be provided and, the lockouts must be removed and
another lock applied by the new service persons, so that the equipment is not left unlocked
at any time.
CHAPTER 1 Safety 311-023-02 1-7
Type Description
Type 3 Equipment is energized. Live circuits are exposed and accidental contact is
possible. Potential exposures are less than 30 VRMS, 42.2 volts peak,
240 V-amps, and 20 joules.
Type 4 Equipment is energized. Live circuits are exposed and accidental contact is
possible. Voltage potentials are greater than 30 VRMS, 42.2 volts peak,
240 V-amps, 20 joules, or radio frequency (RF) is present.
The 300mm Centura system has been designed to prevent exposure to electrical energy during
most maintenance tasks, which are classified as Type 1 or Type 2. However, some Type 3 and
Type 4 maintenance tasks do exist.
NOTE
There are no Type 5 maintenance tasks associated with the 300mm Centura
system.
Type 3 or Type 4 maintenance tasks are identified in the maintenance manuals. These tasks
include specific instructions on how to avoid the electrical hazards and perform the
maintenance tasks safely. Always follow the maintenance procedures carefully.
Any service that requires the system to be locked out (Type 1 tasks), should only be performed
by trained personnel, who are authorized to perform the lockouts. Service that involves
exposure to electrical hazards (Type 3 and Type 4 tasks), must only be performed by trained
and qualified service personnel, familiar with the hazards of electrical energy.
DO NOT service or adjust the system alone. Always have another person familiar with
hazards of the system within sight in case of an emergency. Some tasks may specifically
require additional personnel.
WARNING
To prevent injury or death, due to possible
hazards, do not service or adjust the system
alone. Make use of other personnel who are
familiar with the system hazards and are
within visual sight in case of an emergency.
1.6 Procedures
NOTE
If the entire system is locked out the RF source need not be locked out.
2. The RF power supply may be locked out with a circuit breaker on the main
AC controller with a lock-out device.
3. Verify the shutdown of electrical with an voltmeter. Ensure that there are no backup
power sources (i.e., UPS batteries, charged capacitors, etc.)
1-12 311-023-02 Safety CHAPTER 1
NOTE
For lockout of the power supplies in any remote frame corridor from within
the clean room: The person performing service and maintenance activities
shall install the lockout and maintain the key within their possession.
WARNING
HEAVY OBJECT
Lifting a heavy part or being in an awkward
position can result in muscle strain or
permanent back injury.
Use proper lifting techniques, mechanical
lifting aids, and assistance (two or more
people) when lifting heavy objects. Use two
people or lifting aids when removing or
installing the ASTRON.
1.6.2 Mechanical
1.6.2.1 Robot
1. Work can safely be performed on the robot by turning off the NSK driver power
at the mainframe controller then disconnecting the power cable at the robot
assembly connection. This does not require a lockout device if it is under your
control (i.e., within reach).
1.6.2.4 Chemical
Pertaining to all HAZARDOUS gases and liquid sources:
1. The area around any hazardous gas bottle change, or open MFC area must be
cordoned off on a 10′ radius. During these activities, Self Contained Breathing
Apparatus (SCBA) or airline respirators must be worn by all service personnel
(minimum of 2) until work is complete.
2. Depending on the need, the gas/liquid delivery system can be locked out by
mechanically locking off the final valve pneumatic supply (all gas/liquid lines) or
by physically removing the final valve pneumatic air line (individual gas/liquid
lines). Customer fab requirements may differ on this requirement.
3. Lockout/tagout (LOTO) of the manual valve.
4. Any hazardous gas or liquid-containing line that is required to be opened must be
cycle purged with Nitrogen or Argon. (Follow the pump and purge procedure).
5. There should be at least two purged shutoff valves between the active gas and the
working area.
6. Before opening any connection to a gas line verify that the gas line is fully
evacuated.
7. After completion of the work, leak check the gas line that was serviced.
8. Before leaving the work area make sure that all components are secured and in a
safe “running” condition.
1.6.2.5 Thermal
1. Extra precaution must be taken when working on the following areas if the
potential thermal hazards exists.
• Dome (150 °C)
CHAPTER 1 Safety 311-023-02 1-15
1.6.3.1 Chamber Maintenance (i.e., Wet Cleans, Process Kit Change, Window
Replacement, Etc.)
1. Service personnel not specifically trained for 300mm CENTURA
MAINTENANCE SHOULD NOT ATTEMPT to access the equipment.
2. Prior to venting a process chamber for a wet clean or venting a chamber for other
maintenance:
• Follow the procedures listed in Section 1.4.1, Notification of Maintenance
Activity.
• Remove sources of power from the mechanical assemblies to be worked on
as described in Section 1.3.2, Procedures.
• Remove source of RF/ASTRON power to the chambers to be worked on as
described in the 300mm Ultima HDP-CVD Startup Manual.
3. Servicing the SMC Heat Exchamger (i.e., DI canister change), ESC, and upper
chamber can cause coolant leakage of Ethylene Glycol. Follow all applicable
safety considerations when handling or disposing of Ethylene Glycol.
For further information Refer to the manufacture’s MSDS.
• ACCIDENTAL RELEASE MEASURES
– Small Spill
Absorb liquid on vermiculite, floor absorbent, or other absorbent
material and transfer to hood.
– Large Spill
Eliminate all ignition sources (flares, flames including pilot
lights, electrical sparks). Persons not wearing protective equipment
should be excluded from area of spill until clean-up has been completed.
Stop spill at source. Prevent from entering drains, sewers, streams or
other bodies of water. Prevent from spreading. If runoff occurs, notify
authorities as required. Pump or vacuum transfer spilled product to clean
containers for recovery. Absorb unrecoverable product. Transfer
contaminated absorbent, soil and other materials to containers for
disposal.
• DISPOSAL CONSIDERATION
– Waste Management Information
1. Turn off all process gas supplies to the chamber using the system software.
2. Isolate all process gas supplies to the chamber by closing the manual gas valve
on each gas stick associated with the chamber being serviced.
The manual gas valves are located at the top of each gas stick in the Centura Gas
Panel.
NOTE
Opening the Gas Panel doors to access the manual gas valves will activate an
interlock which will shut down all process chambers. Finish any wafer
processing before opening the Gas Panel doors to perform lockout, or wafer
damage may occur.
3. Lock the manual gas valves in the OFF position using gas valve lockout devices
and your locks, and also attach lockout tags.
4. After all manual gas valves have been locked out, the Gas Panel doors should be
re-closed.
5. Verify the gas supplies have been properly locked out by attempting to flow gases
to the chamber using the system software.
Residual gas pressure in the gas lines will allow a small amount gas to flow the
chamber. However, once the pressure has dropped, a fault should appear indicating
the gas flow could not be maintained. If no fault appears, the wrong manual gas
valves may have been locked out in step 2 and step 3 above.
6. Cycle purge all of the gas supply lines from the gas panel to the chamber.
CHAPTER 1 Safety 311-023-02 1-17
WARNING
The possibility of an explosion due to
over-pressurization exists. This could be the
result of a chemical reaction.
NOTE
Process gases used in the Ultima HDP-CVD chamber are toxic, flammable,
corrosive, and potentially explosive if improperly handled.
When introducing process gases into the system, be sure to follow all applicable safety
precautions as outlined in the Centura Safety Manual and as required by company and
industry safety guidelines. Consult the customer’s Industrial Hygiene department if
necessary.
After any maintenance or service on positive pressure silane fittings, you must verify the
leak integrity of the connection by conducting inboard and outboard leak checks.
WARNING
TOXIC CHEMICALS may be present in
cooling system. Skin contact may be
hazardous to your health. Use appropriate
skin protection
WARNING
FLAMMABLE MATERIALS may be present.
Some of these may ignite spontaneously
when exposed to air. See specifics in the
WARNING
CORROSIVE CHEMICALS are located
within enclosure. Exposure may result in
severe injury.
1-18 311-023-02 Safety CHAPTER 1
____ 1. Before process gases are introduced, each facility gas line must be checked for
leaks, moisture and particles.
____ 2. Verify that all gas lines meet the requirements shown in Table 1-3.
____ 3. Once the facility gas lines have been tested, the Centura gas panel may be
connected to the facility gas lines.
CAUTION
The filters in the Centura gas panel must remain capped until usage. If any of the filters are
not capped, the filter should be replaced before continuing.
The filters, MFCs, and gas lines absorb moisture and contaminates when exposed to
atmosphere, so the exposure times must be minimized.
CHAPTER 1 Safety 311-023-02 1-19
To protect personnel against these hazards, the robot must be locked out while maintenance
is being performed. Lockout of all of the robot should be performed whenever performing
maintenance inside the transfer chamber, unless the written maintenance procedure
specifically instructs you to not lockout the robot. Refer to the following robot’s lockout
procedure:
NOTE
Ensure that the MFC and upstream valve in the gas panel are open during the
leak check.
NOTE
You should detect less than 1ppm (He).
Prior to introducing process gases to the process chamber, check the gas panel operation.
Verify each gas using house purge N2. During this procedure, the gas names will be configured
into the system software. The information is given at the end of this chapter.
This procedure must be followed whenever servicing any part of the gas delivery system that
uses hazardous gases.
1. Turn off and lock out the manual gas valve inside the facilities valve cabinet.
2. Purge the gas line and the chamber by pumping them to base pressure and cycle
purging them with N2 for at least 15 cycles.
WARNING
To prevent fire, due to IPA (Isoproply Alcohol)
vapors, do not spray IPA onto hot surfaces
during cleaning operations. Allow hot surfaces
to cool and ensure no ignition sources are
present before using IPA. IPA VAPORS are
FLAMMABLE.
WARNING
To prevent possible skin or eye injury, due to
IPA (Isoproply Alcohol), wear suitable skin
and eye protection when using IPA.
IPA IS A SKIN IRRITANT.
1-24 311-023-02 Safety CHAPTER 1
Care must be taken whenever any internal components or wiring are exposed. To prevent
exposure to energized electrical parts, lockout all electrical energy sources supplying energy
to the area being serviced, whenever possible, before performing maintenance.
The equipment consists of locks, tags, multiple lock devices, plug locks, and circuit breaker
locks. See the Applied Materials Lockout/Tagout Parts List, for a description of the various
available devices.
NOTE
In compliance with safety regulations, a software interlock is not an
acceptable lockout device and must be backed up with a physical lock or
blocking device.
Maintenance personnel should be thoroughly familiar with the system’s screens and how to
use them. For additional information, refer to the Operations and Programming Chapter
found in the 300mm Ultima HDP-CVD Chamber Manual.
____ 1. Write down the gas name in the appropriate location for each gas stick.
____ 2. Write down the pressure readings for each gas stick.
____ 3. Verify all pressures are within specification (5 psig–10 psig for MFCs 100 sccm
and smaller and 10 psig–15 psig for MFCs greater than 100 sccm). The NF3 MFC
pressure should be adjusted to 15 psia.
____ 4. Verify no unusual drift over time.
____ 12. Remove the four screws (two on top and two bottom) which prevent the lock bars
from being removed.
____ 13. Remove the lock bars.
____ 14. Remove the gate valve actuator and gate valve for the gate valve body.
____ 15. Remove the gate valve O-ring from the gate valve.
____ 16. Clean the gate valve and gate valve body.
____ 17. Install the new gate valve O-ring (Applied Materials Part No. (not released
25-383)).
____ 18. Install gate valve actuator and gate valve to the gate valve body.
____ 19. Mount the bonnet lock bar and install four screws.
____ 20. Turn the quick bonnet locks to secure the gate valve actuator and gate valve to the
gate valve body.
____ 21. Torque down the screws.
____ 22. Connect the pneumatic line and communication lines.
____ 23. With a screwdriver, turn the red screw of the solenoid to close the gate valve.
____ 24. Install the gate valve actuator cover.
____ 25. Turn of the chamber dry pump. Allow the foreline to pumpdown below 10 Torr.
____ 26. Pumpdown the chamber with the Chamber Pumpdown routine.
Detail A
See Detail A
The checklists indicate the minimum routine maintenance required to keep the equipment
running. They include spaces for the maintenance engineer to indicate when the procedure
is completed. Photocopy these checklists and use them as routine performance checklists, to
be signed and dated when the checks are complete. The lists may be placed in plastic holders
and used at the system as reference charts for maintenance checks. File these checklists to
maintain a permanent record of the maintenance done on each system.
Maintenance personnel should be thoroughly familiar with the system’s screens and how to
use them. For additional information, see Operations and Programming in the
300mm Ultima HDP-CVD Chamber Manual.
Complete the checklist below for each 300mm Ultima HDP-CVD Chamber
Date:
Mon Tues Wed Thurs Fri Sat Sun
1. Check gas line pressure to each Stick Gas
gas stick in the gas panel. 1
2
Specification 3
MFCs <= 100 sccm: 5 psig–10 psig 4
MFCs > 100 sccm: 10 psig–15 psig 5
6
7
8
9
10
2 Verify N2 pressure supplied to the turbo pump.
Specification 7-10 psig. Flow
3 a. Verify facilities N2 press to each Alcatel dry pump.
Specification 30 psi ±5 psi: Pressure
b. Verify facilities H20 flow to each dry pump.
This will prevent pump overheat.
Specification 0.5 gpm. Flow
4. Verify facilities H2O flow to each RF generator.
Specification 4 gpm
5. Process check: 1 wafer for deposition Thickness
thickness, Uniformity, RI and particles. Uniformity
Check versus customer specifications. RI
Particles
6. Check facilities helium pressure to the Independent
Helium Cooling module (IHC).
Specification 5 psi–10 psi: Pressure
7. a. Facilities water flow to the SMC Hot Loop
Heat Exchanger. (if applicable) Flow
Specification 6.5 gpm @ 43 psi Pressure
8. Verify mainframe CDA pressure on digital
SMC gauge under the transfer chamber.
Specification 80 psig ± 5 psig Pressure
9. Initial after completing Daily Preventive Checklist
2-16 311-023-02 Preventative Maintenance Procedures CHAPTER 2
Complete the checklist below for each 300mm Ultima HDP-CVD Chamber
Date:
Week 1 2 3 4 5
1. Verify HDP-CVD Chamber rate of rise using “Leak Up Service” routine.
Specification: < 1 mTorr/minute. Leak Rate
2. Verify Hot Loop Heat Exchanger coolant level. Reservoir should be filled
with a 50/50 DI water/glycol mixture. Check Full
3. On the Configure Heat Exchanger screen, verify SMC
Hot Loop resistivity for the HDP-CVD chamber.
Resistivity specification: > 2 MOhms: Resistivity
4. Verify Remote Clean water flow through the digital
SMC flow gauge.
Specification: =>.7 GPM Flow
5. Verify the chamber wall temperature calibration. Using a thermal
couple, verify that the wall is 70 °C with the Heat Exchanger setpoint
at 70 °C. This measurement must be made 2″ to the right
of the Remote Clean conductance tube.
TC Temperature
6. Initial after completing Daily Preventive Checklist
CHAPTER 2 Preventative Maintenance Procedures 311-023-02 2-17
Complete the checklist below for each 300mm Ultima HDP-CVD Chamber
Date:
Month 1 2 3 4 5 6 7 8 9 10 11 12
1 Complete chamber MFC Line Gas
calibrations. 1
(AFC Cals or MFC Flow Verify) 2
3
4
Log Correction Factor values to 5
track MFC performance. 6
7
MFC Specification: <10% offset 8
9
10
2 Complete Manometer Calibration for 100 mTorr
and 10 Torr Heads.
Initial Complete
3 Calibrate IHC Dump
Specification 2.0 sccm ±.2 @ 5 Torr Inner
Specification 2.0 sccm ±.2 @ 5 Torr Outer
Date:
Month 1 2 3 4 5 6 7 8 9 10 11 12
4 PM the SMC Heat Exchanger (if applicable).
a. Replace the Hot Loop Deionizer Tanks
every 3 months.
3250-01007 Deionizer tank SS qty 2
Initial Complete
b. Replace the Hot Loop Filter every 6 months.
0190-18425 20 Micron Filter qty 1
Initial Complete
2-18 311-023-02 Preventative Maintenance Procedures CHAPTER 2
Complete the checklist below for each 300mm Ultima HDP-CVD Chamber Wafer Count:
1 Chamber Fingerprint
a. Chamber Leak Rate Chamber Leak Rate mTorr/min
b. Chuck-Dechuck Test ESC Voltage Volts
ESC Current mA
IHC Leak Inner sccm
IHC Leak Outer sccm
c. Site specific customer daily qualification Angstroms
Customer Qualification: Thickness
Uniformity %
RI
Particles
d. Sputter Test Sputter Rate Angstroms
Sputter Uniformity %
e. Throttle Valve Check Throttle Closed Position Steps
Pressure mTorr
f. Clean Rate Test A/min A/min
2 Replace Chamber Slit Valve
0040-13883 Slit Valve QTY 1 Initial Complete
3 Verify Turbo N2 Setup for each chamber. The foreline pressure should be 40 mTorr to 50
mTorr above the foreline base pressure
Initial Complete
4 Chamber Recovery
a. Check the dual pressure slit valve under vacuum Spec. 15 psi–20 psi psi
(< 5 Torr)
b. Transfer Chamber Leak Test with Chamber servo Spec. < 5 mTorr/min mTorr/min
3 Torr
c. Process Chamber Leak Test, Transfer Chamber at Spec. < 2 mTorr/min mTorr/min
Atmosphere
d. Process Chamber Leak Test, Chamber at Temperature Spec. < 2 mTorr/min mT/min
e. After Cycle Purge Spec. < 1 mTorr/min mT/min
f. Twenty Wafer Chuck-Dechuck Test (values for wafer 19)
Strike Pressure Spec. 50 - 70 mTorr mTorr
Voltage Spec. 950V or 800V Volts
Current Spec. < 200 µA mA
Inner Spec. < 2 sccm sccm
CHAPTER 2 Preventative Maintenance Procedures 311-023-02 2-19
Complete the checklist below for each 300mm Ultima HDP-CVD Chamber Wafer Count:
Outer Spec. < 4 sccm sccm
Mechanical Spec. < 20
Particles
g. Nine wafer BKM Deposition Test Wafer 8 Thickness Spec. 8000±400 Angstroms
Uniformity Spec. < 2.5% %
Particles Spec. < 50
Pressure Spec. 5.0 - 6.5 mTorr mTorr
Wafer 9 Thickness Spec. 8000 ±400 Angstroms
Uniformity Spec. < 2.5% %
Particles Spec. < 50
Pressure Spec. 5.0 mTorr– 6.5 mTorr
h. Clean Rate Test Clean Rate A/min A/min
i. Site specific customer daily qualification Customer Thickness Angstroms
Qualification:
Uniformity %
RI
Particles
2-20 311-023-02 Preventative Maintenance Procedures CHAPTER 2
Complete the checklist below for each 300mm Ultima HDP-CVD Chamber Wafer Count:
1 Chamber Fingerprint
a. Chamber Leak Rate Chamber Leak Rate mTorr/min
b. Chuck-Dechuck Test ESC Voltage Volts
ESC Current mA
IHC Leak Inner sccm
IHC Leak Outer sccm
c. Site specific customer daily qualification Angstroms
Customer Qualification: Thickness
Uniformity %
RI
Particles
d. Sputter Test Sputter Rate Angstroms
Sputter Uniformity %
e. Throttle Valve Check Throttle Closed Position Steps
Pressure mTorr
f. Clean Rate Test A/min A/min
2 Replace the Gate Valve O-ring.
25-383 O-ring Size (Kalrez) Qty 1 (NOT YET RELEASED) Initial Complete
3 Replace Chamber Slit Valve
0040-13883 Slit Valve QTY 1 Initial Complete
4 Verify Turbo Pump N2 purge for each chamber. The foreline pressure should be
40 mTorr–50 mTorr above the foreline base pressure Initial Complete
5 Verify Lift Pin Height in release position.
Initial Complete
6 Chamber Recovery
a. Check the dual pressure slit valve under vacuum (< 5 Torr) Spec. 15 psi– 20 psi psi
b. Transfer Chamber Leak Test with Chamber servo 3 Torr Spec. < 5 mTorr/min mTorr/min
c. Process Chamber Leak Test, Transfer Chamber at Spec. < 2 mTorr/min mTorr/min
Atmosphere
d. Process Chamber Leak Test, Chamber at Temperature Spec. < 2 mTorr/min mTorr/min
e. After Cycle Purge Spec. < 1 mTorr/min mTorr/min
f. Twenty Wafer Chuck-Dechuck Test (values for wafer 19)
Strike Pressure Spec. 50 - 70 mTorr mTorr
Voltage Spec. 950V or 800V Volts
CHAPTER 2 Preventative Maintenance Procedures 311-023-02 2-21
Complete the checklist below for each 300mm Ultima HDP-CVD Chamber Wafer Count:
Current Spec. < 200 µA mA
Inner Spec. < 2 sccm sccm
Outer Spec. < 4 sccm sccm
Mechanical Spec. < 20
Particles
g. Nine wafer BKM Deposition Test Wafer 8 Thickness Spec. 8000 ± 400 Angstroms
Uniformity Spec. < 2.5% %
Particles Spec. < 50
Pressure Spec. 5.0 - 6.5 mTorr mTorr
Wafer 9 Thickness Spec. 8000 ±400 Angstroms
Uniformity Spec. < 2.5% %
Particles Spec. < 50 mTorr
Pressure Spec. 5.0 mTorr–6.5 mTorr
h. Clean Rate Test Clean Rate A/min A/min
i. Site specific customer daily qualification Customer Qualification: Thickness Angstroms
Uniformity %
RI
Particles
2-22 311-023-02 Preventative Maintenance Procedures CHAPTER 2
Complete the checklist below for each 300mm Ultima HDP-CVD Chamber Wafer Count:
1 Chamber Fingerprint
a. Chamber Leak Rate Chamber Leak Rate mTorr/min
b. Chuck-Dechuck Test ESC Voltage Volts
ESC Current mA
IHC Leak Inner sccm
IHC Leak Outer sccm
c. Site specific customer daily qualification Angstroms
Customer Qualification: Thickness
Uniformity %
RI
Particles
d. Sputter Test Sputter Rate Angstroms
Sputter Uniformity %
e. Throttle Valve Check Throttle Closed Position Steps
Pressure mTorr
f. Clean Rate Test A/min A/min
2 Replace the Turbo Throttle Valve O-rings.
3700-01635 O-ring, qty 3
Initial Complete
3 Replace the ESC O-rings.
3700-01036 O-ring, Viton qty 2 3700-02681 O-ring, Chemraz qty 2
3700-01852 O-ring, Viton qty 2 3700-02678 O-ring, Chemraz qty 1
3700-03026 O-ring, Chemraz qty 3
3700-02183 O-ring, Viton qty 2
3700-02677 O-ring, Chemraz qty 2
3700-02663 O-ring, Chemraz qty 3
Initial Complete
4 Replace the Batron O-ring.
3700-01035 O-ring, Viton qty 1 Initial Complete
5 Replace the Chamber Body O-rings.
3700-02515 O-ring, Chemraz qty 1 3700-02518 O-ring, Teflon qty 1
3700-022329 O-ring, Chemraz qty 2 Initial Complete
6 Replace Chamber Slit Valve.
3700-13883 Slit Valve O-ring. Initial Complete
CHAPTER 2 Preventative Maintenance Procedures 311-023-02 2-23
Complete the checklist below for each 300mm Ultima HDP-CVD Chamber Wafer Count:
7 Verify Turbo N2 Setup for each chamber. the foreline pressure should be 40
to 50mT above foreline base pressure. Initial Complete
8 Verify lift pin height in release position. Initial Complete
9 Chamber Recovery
a. Check the dual pressure slit valve under vacuum (< 5 Torr) Spec. 15 - 20 psi psi
b. Transfer Chamber Leak Test with Chamber servo 3 Torr Spec. < 5 mTorr/min mTorr/min
c. Process Chamber Leak Test, Transfer Chamber at Spec. < 2 mTorr/min mTorr/min
Atmosphere
d. Process Chamber Leak Test, Chamber at Temperature Spec. < 2 mTorr/min mTorr/min
e. After Cycle Purge Spec. < 1 mTorr/min mTorr/min
f. Twenty Wafer Chuck-Dechuck Test (values for wafer 19)
Strike Pressure Spec. 50 mTorr– 70 mTorr mTorr
Voltage Spec. 950V or 800V Volts
Current Spec. < 200µA mA
Inner Spec. < 2 sccm sccm
Outer Spec. < 4 sccm sccm
Mechanical Spec. < 20
Particles
g. Nine wafer BKM Deposition Test Wafer 8 Thickness Spec. 8000 ±400 Angstroms
Uniformity Spec. < 2.5% %
Particles Spec. < 50
Pressure Spec. 5.0 mTorr–6.5 mTorr mTorr
Wafer 9 Thickness Spec. 8000 ±400 Angstroms
Uniformity Spec. < 2.5% %
Particles Spec. < 50 mTorr
Pressure Spec. 5.0 mTorr – 6.5 mTorr
h. Clean Rate Test Clean Rate A/min A/min
i. Site specific customer daily qualification Customer Qualification: Thickness Angstroms
Uniformity %
RI
Particles
2-24 311-023-02 Preventative Maintenance Procedures CHAPTER 2
Complete the checklist below for each 300mm Ultima HDP-CVD Chamber Wafer Count:
1 Chamber Fingerprint
a. Chamber Leak Rate Chamber Leak Rate mTorr/min
b. Chuck-Dechuck Test ESC Voltage Volts
ESC Current mA
IHC Leak Inner sccm
IHC Leak Outer sccm
c. Site specific customer daily qualification Angstroms
Customer Qualification: Thickness
Uniformity %
RI
Particles
d. Sputter Test Sputter Rate Angstroms
Sputter Uniformity %
e. Throttle Valve Check Throttle Closed Position Steps
Pressure mTorr
f. Clean Rate Test A/min A/min
2 Replace the center nozzle assembly orangs.
3700-01725 O-ring Chemraz qty 1 3700- Initial Complete
02025oring, Viton qty 1 0020-18899 Teflon Washer
qty 1
3 Replace the center nozzle assembly O-rings.
3700-01725 O-ring Chemraz qty 1 3700-O-ring, Initial Complete
Viton qty 1
0020-18899 Teflon Washer qty
4 Replace the Turbo Throttle Valve O-rings.
3700-01635 O-ring, qty 3 Initial Complete
5 Replace the Gate Valve O-ring.
25-383 O-ring Size (Kalrez) Qty 1 (NOT YET Initial Complete
RELEASED)
CHAPTER 2 Preventative Maintenance Procedures 311-023-02 2-25
Complete the checklist below for each 300mm Ultima HDP-CVD Chamber Wafer Count:
Initial Complete
7 Replace the Batron O-ring.
3700-01035 O-ring, Viton qty 1 Initial Complete
8 Replace the Chamber Body O-rings.
3700-02515 O-ring, Chemraz qty 1 3700-02518 O-ring, Teflon qty 1
3700-022329 O-ring, Chemraz qty 2 Initial Complete
9 Replace Turbo and Rough Isolation Valve O-rings
3700-01088 O-ring, Chemaz qty 4 Initial Complete
10 Replace Viewport Lenses and O-rings
3700-01037 Saphire Lense Qty 2 3700-02330 O-ring, Chemraz qty 2
Initial Complete
11 Replace Remote Clean O-rings
3700-01953 O-ring Chemraz qty 3 3700-03038 O-ring Chemraz qty 1
Initial Complete
2 Replace Side Nozzle Washers
0020-18899 Teflon Washers qty 30 Initial Complete
13 Replace chamber Slit valve
0040-13883 Slit valve O-ring qty 1 Initial Complete
14 Verify Turbo N2 Setup for each chamber. the foreline pressure should be 40
to 50 mTorr above foreline base pressure. Initial Complete
15 Verify lift pin height in release position. Initial Complete
16 Chamber Recovery
a. Check the dual pressure slit valve under vacuum (< Spec. 15 psi– 20 psi psi
5 Torr)
b. Transfer Chamber Leak Test with Chamber servo 3 Spec. < 5 mTorr/min mTorr/min
Torr
c. Process Chamber Leak Test, Transfer Chamber Spec. < 2 mTorr/min mTorr/min
at Atmosphere
2-26 311-023-02 Preventative Maintenance Procedures CHAPTER 2
Complete the checklist below for each 300mm Ultima HDP-CVD Chamber Wafer Count:
WARNING
Materials are present that may be hazardous
upon contact with the skin or eyes. Contact
your safety department for appropriate
personal protective equipment.
• Always do cleaning under Class 100 conditions or better. Transport parts outside
a controlled environment only if the parts are dried and packaged in cleanroom-
quality bagging material.
• Use dustless gloves and vapor masks when cleaning the process chamber.
Barehands are not permitted in cleaning or handling of process kit hardware.
• Use disposable cleanroom wipes and Isoproply alcohol to wipe tools (such as
screwdrivers and allen wrenches) before using them.
• Make sure all parts are stored in a cleanroom area such as a laminar flow unit or
desiccator.
• Be careful not to scratch or apply solvent to electrical or optical components of
the chamber or the system.
• Never use wire brushes or other sharp instruments to clean a process chamber.
CAUTION
Double gloves must be used to prevent possible sodium contamination of the process kit parts.
CHAPTER 2 Preventative Maintenance Procedures 311-023-02 2-29
WARNING
Hazardous gases or fumes may be present.
Contact your safety department for
appropriate personnel protective equipment
and ventilation requirements.
WARNING
Materials are present that may be hazardous
upon contact with the skin or eyes. Contact
your safety department for appropriate
personal protective equipment.
2-30 311-023-02 Preventative Maintenance Procedures CHAPTER 2
WARNING
Hot surfaces are present which could cause
severe skin burns upon contact.
Start Time
Ending Time
CHAPTER 2 Preventative Maintenance Procedures 311-023-02 2-31
Skip to Section 2.3.4.5, Wipe Down Surfaces (Approximately 15 minutes) if not performing
Maintenance (This section equals the time it takes to complete maintenance)
3 Calibration Procedures
This chapter contains step by step procedures for major calibrations on the
300mm Ultima HDP-CVD chamber. Only qualified personnel trained in the operation and
programming of the Ultima HDP-CVD should perform these procedures. Familiarity with
all operating and programming routines is required to perform these procedures safely and
correctly. In addition, only personnel experienced with process chamber component and
assembly should perform these procedures
In this procedure, first verify the functioning of the supply system, and then check the leak
rate of the IHC lines. Study the Figure 3-1 before proceeding. This procedure should be
followed step by step to ensure that valves are opened and closed at the proper point within
the tests.
Monitor Chamber C
0.00slm Fnl
RF Poweroff/Poweroff
0.00slm 2nd Under Vacuum
0.00slm 3rd Name Top Side Bias
Gen 0W 0W 0W
0.00slm 4th (Offset 0.0 mTorr) 0W 0W 0W
Sp
0.00slm 5th 0W 1W 1W
FWD
Wafer Lift RLSE REFL 2W 2W 3W
Match Off
Vent N2
MW
ASTRON IDLE
PWR OFF Gen OFF
Turbo TV Rough TV SP 0W Coeff 0.0
800,800 Step 800,800 Step FWD/REFL 13W/ 1W
OPEN CMD OPEN CMD
Dome Heater
Turbo GV RoughV Contactor: OFF SP: 0 C
Zone SP: 0 0 0 0
Turbo-ON Zone TC: 62 59 54 60
N2 IHC PIDs ST: ON ON ON ON
Slow Name Inner Outer
Turbo ISO SP 5.0T 10.0T E-Chuck ST. Off
Press 2.8T 5.4T ACT Off Vol 0 V
Pump-ON Flow 0.0 0.0 PROT No Cur 0 uA
Pump OK Fl 24.367 mT He
Monitor Handler Gas Panel Monitor Process Chamber Service Previous Screen
Chamber A ________mTorr/min
Chamber B ________mTorr/min
Chamber C ________mTorr/min
Chamber D ________mTorr/min
____ 1. Verify that the helium supply pressure is 5 psi–10 psi on the regulator in the
mainframe center tray.
____ 2. Select the Monitor Chamber screen, and open the Inner and the Outer helium purge
valves.
____ 3. Set the inner and the outer pressure set points to 10 Torr.
____ 4. Check that the pressures stabilize after 10 seconds. If the pressures do not stabilize,
check the following, and correct where necessary:
• Supply and purge valve pneumatic lines are connected and actuating
• Manual supply valve is open
• Control cables are connected to the baratron and MFC
• Vacuum leak
____ 5. Open the Inner and Outer helium wafer valves.
____ 6. Close the manual supply valve for the appropriate chamber, and wait 5 minutes.
____ 7. Check the flow rates and pressures for the inner and outer lines. The rates and
pressures should begin to decrease and zero in about 5 minutes.
____ 8. Allow the turbo pump to pump on the IHC lines for 2 hours.
____ 9. Verify that the flow rates and pressures for the inner and outer lines are 0 sccm
and 0 Torr.
3-4 311-023-02 Calibration Procedures CHAPTER 3
____ 10. Enter the chamber leak rates from Table 3-1 into Table 3-2.
____ 11. Check the chamber leak up rate with the routine on the Chamber Service screen.
This rate includes that of the IHC lines. If there is a line leak, pumping may take
a long time. Enter the results in Table 3-2.
____ 12. Check that the IHC leak up rate < 0.2 mTorr/min.
____ 13. Pump the chamber to base pressure. This may require more than two hours if the
leak rate is high.
____ 14. Close both wafer valves (for the verification that follows).
NOTE
This procedure verifies the needle valve adjustment.
____ 5. Check that the flows are within the specification of 1.8 sccm−2.2 sccm.
CHAPTER 3 Calibration Procedures 311-023-02 3-5
NOTE
This procedures verifies Helium flow through the ESC
This checks the helium flow at different pressures for two valving conditions:
NOTE
When changing set points during this verification, be sure to close both wafer
valves.
____ 1. Set the wafer valves for Condition 1, and record the flow rates after 10 seconds
for the following pressures.
.
____ 13. Move the lift to all three positions, and verify that the lift moves to each position
in 2 seconds–4 seconds. The actual time should be such that the wafer does not
vibrate and a time-out fault is not made. Adjust, if necessary, with the needle valves
on the pneumatic cylinder.
PROCESS
LIFT
RELEASE
____ 14. Select the Chamber Service screen, and re-verify that the optical sensors for the
LIFT, PROCESS, and RELEASE positions are operating properly.
____ 15. Vent the Chamber to remove the clear lid.
____ 16. Carefully wipe the chuck with a cleanroom wipe and IPA after removing the clear
lid.
____ 17. Verify that there are no visible particles on the ESC.
CH A_____ CH B_____ CH C_____ CH D_____
____ 18. Put the lift in the PROCESS position.
CHAPTER 3 Calibration Procedures 311-023-02 3-7
3.3.1 Preliminaries:
____ 1. Check that the chamber volume is configured to xxx cc.
____ 2. Set the MFC correction factors to 1.0 or to the value recommended by the
manufacturer. (All manufacturers do not use the same correction factors.)
____ 3. Check that the MFC size selection in the Configure Gas Names screen corresponds
to the actual MFC size.
____ 4. Run the chamber Leak-up test to verify the vacuum integrity of the chamber before
performing this procedure
NOTE
Calibrations at high flows are affected by the actuation time for the gate valve
and for the gas valves. Minimize the effect of the valve actuation time by
increasing the time for calculation (increasing system constant #373, the
maximum pressure for RF power on).
____ 7. Repeat the procedure at 50% and 90% of maximum flow setpoints for each MFC.
NOTE
If any flow deviates more than 10% from the setpoint, replace the MFC.
Option SiH4-TOP 10
O2 135 Ar-TOP 15
Ar 110 O2-TOP 25
CHAPTER 3 Calibration Procedures 311-023-02 3-9
SiF4 40 SiH4-TOP 5
O2 120 Ar-TOP 5
Ar-MW 1000
Ar 60 O2-TOP 10
SiH4 45 O2-TOP 20
PH3 55 AR 60
SiH4-TOP 5 Ar-TOP 10
PH3-TOP 5 O2 160
____ 2. Run the Service program calibrations three times to verify MFC repeatability, and
record the new factor. After the first run, enter the correction factor into the MFC
calibration page. The following calibrations must be remain at the same value.
____ 3. Verify repeatability of the factors and enter the value as the correction factor. This
is the final correction factor setpoint for the MFC. Do not change the setpoint until
the MFC is replaced.
3-10 311-023-02 Calibration Procedures CHAPTER 3
Repeatability should be within ±1%. Before replacing a suspect MFC, verify that the facilities
and system hardware conditions are stable. While the gas flows are being calibrated, inspect
the following:
• Regulator
• Flow restrictor
• Chamber temperature
• Stable gas line ambient temperature
• Lid temperature control
• Pre-Startup Procedures,
• Running Flow Verification,
NOTE
Make sure that the fluke meter has a 1000 V capacity.
WARNING
Hazardous Voltage. Potentially lethal
electrical voltages and currents are present
which could cause shock, burns, or death.
Type 4 Electrical “Hot Work”.
CAUTION
HIGH VOLTAGE DC is exposed during this procedure.
CHAPTER 3 Calibration Procedures 311-023-02 3-13
SELECT 1
SELECT 2
OFF ON POSITIVE
ON OFF NEGATIVE
ON ON GROUND
9. Measure the voltage at the output of the BIAS MATCH. The output should be
0 VDC at this time.
3-14 311-023-02 Calibration Procedures CHAPTER 3
NOTE
The positive voltage setting is dependent on wafer size. See Table 3-12 in
STEP11 for correct values.
NOTE
All High Voltages should be viewed on the “Monitor Chamber” screen.
1. Verify that the following LEDs are on +24 V, +15 V, −15 V, +12 V, I OK,
SELECT 1, SELECT 2, GEN/CHUCK INTERLOCK, and CHUCK ENABLE.
The V OK LED should be OFF at this time.
WARNING
Hazardous Voltage. Potentially lethal
electrical voltages and currents are present
which could cause shock, burns, or death.
Type 4 Electrical “Hot Work”.
2. Connect the DMM to TP10 24VCOM (−) and TP7(+). Adjust R22 on the power
supply PCB until 7.2 VDC is measured at TP7.
3. Adjust R23 per Table 3-12 below. (TP8 Referenced to 24 Com TP10):
4. From the DI/O screen, turn SELECT 1 OFF and SELECT 2 ON. Measure the
output of the BIAS MATCH using a DMM. The output should be close to the
appropriate value for 6″ or 8″ wafer size per Table 3-12 above. Adjust R23 until
output reads the correct value according TABLE 3 ±10 VDC.
5. From the DI/O screen, turn SELECT 1 OFF and SELECT 2 OFF. The BIAS
MATCH output should now read 0 VDC.
CHAPTER 3 Calibration Procedures 311-023-02 3-15
NOTE
All high voltages should viewed on the Monitor Chamber screen.
1. Connect the DMM to TP11 common (−) and TP4 (+). Adjust R25
until −3.25 VDC ±0.1 VDC is measured. This adjusts the upper limit for the V
OK signal to −1300 VDC.
2. Connect the DMM to TP11 common (−) and TP5 (+). Adjust R24
until −2.75 VDC ±0.1 VDC is measured. This adjusts the lower limit for the V
OK signal to −1100 VDC.
NOTE
All high voltages should be viewed on Monitor Chamber screen.
1. Connect the DMM to TP11 common (−) and TP1 (+). Adjust R31 until −4.00
VDC ± 0.1 VDC is measured at TP1. This adjusts the negative output current limit
for the I OK signal to −400 µA.
2. Connect the DMM to TP11 common (−) and TP2 (+). Adjust R30 until + 4.00
VDC ± 0.1 VDC is measured at TP2. This adjusts the positive output current limit
for the I OK signal to +400 µA.
3. Turn SELECT 1 OFF and SELECT 2 ON. Verify DC output voltage per Table 3-13
below. The I OK LED should be ON.
4. Connect the DMM to TP11 common(−) and TP3(+). Verify voltage per Table 3-13
below:
____ 1. Turn OFF and Lock Out the main CB on the front panel of the RF generator.
____ 2. Connect an RF Watt meter and power sensor head to the dummy load.
____ 3. Disconnect the TOP source RF cable from the RF bulkhead. Connect it to the
power sensor.
____ 4. Defeat the RF bulkhead interlocks. Interlock found on the RF bulkhead.
____ 5. Turn ON the CB on the front of the RF generator.
CHAPTER 3 Calibration Procedures 311-023-02 3-17
____ 6. Flow 100 sccm Ar from the MONITOR GAS PANEL. Give the turbo throttle
valve a CLOSE command. The chamber pressure should read >50 mTorr. If not,
adjust the turbo throttle valve to get a chamber pressure above 50 mTorr.
____ 7. Turn ON the TOP RF generators on the MONITOR CHAMBER screen.
____ 8. Set the TOP FORWARD POWER SETPOINT to 3000 W.
____ 9. If the Watt meter reads 3000 W ±5 W skip to step 12.
____ 10. Turn OFF the TOP RF generator, from the monitor chamber screen. (This step is
important because it allows the system to reset the calibration factor in the
RF generator)
____ 11. Adjust the 10 V SETPOINT EQUIVALENT, (This can be found on the RF cal
page, MISC> PROCESS CHAMBER PARAMETERS> RF CALIBRATIONS.)
____ 12. Set the TOP FORWARD POWER SETPOINT to 3000 W. Repeat steps 9 to 12
until the power meter reads 3000 W ±5 W.
____ 13. From the same page adjust the 10 V FORWARD EQUVALENT until the display
the MONITOR CHAMBER screen displays 3000 W ±5 W.
____ 14. From the MONITOR CHAMBER screen turn OFF the Top RF generator.
____ 15. Shut off the gas flow to the chamber.
____ 16. Switch OFF the CB on the front of the RF generator.
____ 17. Reconnect the RF cable to the RF bulkhead on the system mainframe. Re-enable
the interlock on the bulkhead.
____ 18. Turn ON the CB.
____ 1. Turn OFF and Lock Out the main CB on the front panel of the SIDE RF generator.
____ 2. Connect an RF Watt meter and power sensor head to the dummy load.
____ 3. Disconnect the SIDE source RF cable from the RF bulkhead. Connect it to the
power sensor.
____ 4. Defeat the RF bulkhead interlocks. Interlock found on the RF bulkhead.
____ 5. Turn ON the CB on the front of the SIDE RF generator.
____ 6. Flow 100 sccm Ar from the MONITOR GAS PANEL. Give the turbo throttle
valve a CLOSE command. The chamber pressure should read >50 mTorr. If not,
adjust the turbo throttle valve to get a chamber pressure above 50 mTorr.
____ 7. Turn ON the SIDE RF generators on the MONITOR CHAMBER screen.
____ 8. Set the SIDE FORWARD POWER SETPOINT to 3000 W.
3-18 311-023-02 Calibration Procedures CHAPTER 3
____ 1. Turn OFF and Lock Out the main CB on the front panel of the BIAS RF generator.
____ 2. Connect an RF Watt meter and power sensor head to the dummy load.
____ 3. Disconnect the BIAS source RF cable from the RF bulkhead. Connect it to the
power sensor.
____ 4. Defeat the RF bulkhead interlocks. Interlock found on the RF bulkhead.
____ 5. Turn ON the CB on the front of the BIAS RF generator.
____ 6. Flow 100 sccm Ar from the MONITOR GAS PANEL. Give the turbo throttle
valve a CLOSE command. The chamber pressure should read >50 mTorr. If not,
adjust the turbo throttle valve to get a chamber pressure above 50 mTorr.
____ 7. Turn ON the BIAS RF generators on the MONITOR CHAMBER screen.
____ 8. Set the BIAS FORWARD POWER SETPOINT to 3000 W.
____ 9. If the Watt meter reads 3000 W ±5 W skip to step 12.
____ 10. Turn OFF the BIAS RF generator, from the monitor chamber screen.(This step is
important because it allows the system to reset the calibration factor in the
RF generator)
____ 11. Adjust the 10 V SETPOINT EQUIVALENT, (This can be found on the RF cal
page, MISC> PROCESS CHAMBER PARAMETERS> RF CALIBRATIONS.)
CHAPTER 3 Calibration Procedures 311-023-02 3-19
____ 12. Set the SIDE FORWARD POWER SETPOINT to 3000 Watts. Repeat step 9 to
step 12 until the power meter reads 3000 W ±5 W.
____ 13. From the same page adjust the 10 V FORWARD EQUVALENT until the display
the MONITOR CHAMBER screen displays 3000 W ±5 W.
____ 14. From the MONITOR CHAMBER screen turn OFF the BIAS RF generator.
____ 15. Shut off the gas flow to the chamber.
____ 16. Switch OFF the CB on the front of the RF generator.
____ 17. Reconnect the RF cable to the RF bulkhead on the system mainframe. Re-enable
the interlock on the bulkhead.
____ 18. Turn ON the CB.
The following procedure is for setting the frequency for the TOP and SIDe RF generators.
Verify Astron power up when interlocks are satisfied. See Chapter 11, Interlock Verification
in the Startup Manual. Verify LCD screen displays READY.
____ 1. Verify the chamber has a good leakup rate <2 mTorr/min.
____ 2. Verify all interlocks are satisfied. See Chapter 11, Interlock Verification in the
Startup Manual, to verify all interlocks.
____ 3. Isolate the chamber by closing the turbo gate valve and turbo isolation valve.
____ 4. Open the rough isolation valve.
____ 5. Flow 1000 sccm of Ar through the ASTRON.
____ 6. Pressurize the chamber between 1 Torr–4 Torr. This can be done by servoing the
pressure on the Throttle service screen.
____ 7. Turn ON the Astron from the monitor chamber screen.
____ 8. Verify the Astron displays Plasma OK on the LCD display.
____ 9. Turn OFF the astron and open the rough throttle valve.
____ 10. Turn off all gases flowing into the chamber.
RS232 Assignment
8 9 10 11
** If the condition is “Disable”, the next line on Dual Zone TC does not appear.
____ 6. Verify that the vacuum pressure switch on the source signal conditioning box is
operational and that the vacuum is between 600 mmHg and 690 mmHg.
____ 7. Remove the stainless steel chamber top cover, and defeat the cover interlock. Tie
it closed with a tie wrap.
____ 8. Remove the Teflon vacuum line to the center gas feed assembly.
____ 9. Verify that the vacuum reading decreases to approximately 40 mmHg.
____ 10. Place thumb over exposed end of the teflon hose to create a vacuum. Vacuum
pressure should be > 650 mmHg.
____ 11. Replace the vacuum line.
____ 12. Select Monitor Chamber, and set the heat exchanger temperature to 70 °C. Proceed
with the next steps while the heat exchanger temperature is ramping up.
____ 13. Individually remove each thermocouple connector from the source signal
conditioning box, except for the side TCs.
____ 14. Measure the resistance to chassis ground of each lead with a DMM. Each lead
must read infinite resistance.
____ 15. Replace the connectors to their original positions (T1, T2, and T3 for the two
TC sets). The zone temperatures at the system display should read 0 °C when the
TC is disconnected.
____ 16. Verify that the TCs are reconnected as shown in the following table.
NOTE
The brown plastic nut securing the top TC should not be screwed in all the
way. Half of a thread is sufficient for the TC to make good contact.
____ 17. Turn on the heater CB. The dome temperature setpoint, as read in the Monitor
Chamber screen, should still be 0 °C.
____ 18. Wait for the heat exchanger to reach the 70 °C setpoint. Verify that the chamber
body temperature has stabilized at 70 °C. Check the temperature with the surface
probe just below the chamber viewport.
3-24 311-023-02 Calibration Procedures CHAPTER 3
____ 19. Select Monitor Chamber, and check the T1, T2, T3 and T4 dome thermocouples.
They should match the heat exchanger setpoints to within ± 2 °C. The side infrared
temperature sensor will read higher due to its non-linearity at lower temperatures.
Correct any problems before proceeding.
WARNING
Hazardous Voltage. Potentially lethal
electrical voltages and currents are present
which could cause shock, burns, or death.
Type 3 energized electrical “Hot Work”.
CAUTION
208 VAC is exposed at the heater terminal blocks
____ 14. Place thumb over exposed end of the teflon hose to create a vacuum. Vacuum
pressure should be > 650 mmHg.
____ 15. Replace the vacuum line.
____ 16. Select Monitor Chamber, and set the heat exchanger temperature to 70 °C. Proceed
with the next steps while the heat exchanger temperature is ramping up.
____ 17. Individually remove each thermocouple connector from the source signal
conditioning box, except for the side TCs.
____ 18. Measure the resistance to chassis ground of each lead with a DMM. Each lead
must read infinite resistance.
____ 19. Replace the connectors to their original positions (T1, T2, and T3 for the two
TC sets). The zone temperatures at the system display should read 0 °C when the
TC is disconnected.
____ 20. Verify that the TCs are reconnected as shown in the following table.
NOTE
The brown plastic nut securing the top TC should not be screwed in all the
way. Half of a thread is sufficient for the TC to make good contact.
____ 21. Turn on the chamber tray and heater CBs. The dome temperature setpoint, as read
in the Monitor Chamber screen, should still be 0 °C.
____ 22. Wait for the heat exchanger to reach the 70 °C setpoint. Verify that the chamber
body temperature has stabilized at 70 °C. Check the temperature with the surface
probe just below the chamber viewport.
____ 23. Select Monitor Chamber, and check the T1, T2, T3 and T4 dome thermocouples.
They should match the heat exchanger setpoints to within ± 2 °C. The side infrared
temperature sensor will read higher due to its non-linearity at lower temperatures.
Correct any problems before proceeding.
3-26 311-023-02 Calibration Procedures CHAPTER 3
WARNING
Hazardous Voltage. Potentially lethal
electrical voltages and currents are present
which could cause shock, burns, or death.
Type 3 energized electrical “Hot Work”.
CAUTION
208 VAC is exposed at the heater terminal blocks
____ 1. Refer to the Monitor Chamber screen to ensure that the chamber is at base pressure
and that the turbo is pumping.
____ 2. Adjust the zeroing potentiometer on the manometer to read between 0 V and
0.002 V on the AI screen. The voltages and their locations are shown in Table 3-16
and Table 3-17. DO NOT adjust the SPAN potentiometer.
10 Torr 0.002–0.005 V
____ 3. Verify that the chamber pressure is between 0.20 mTorr and 0.80 mTorr. If the
pressure is not in this range, adjust the manometer until it is.
3-28 311-023-02 Calibration Procedures CHAPTER 3
____ 1. Measure the DC voltage at TP2 of the Chamber Dual Manometer switch box. Set
to 9.5 V by adjusting the potentiometer. This corresponds to 9.5 Torr pressure trip
point.
____ 2. To verify the setting, perform the following steps.
____ 3. Flow 1000 sccm of Ar to the chamber.
____ 4. Close the Gate Valve and make sure that the foreline isolation valve is closed.
____ 5. Confirm that the gas flow stops and the Chamber Cover Interlock trips at 9.5 Torr.
____ 6. Open the Foreline Isolation Valve and pump the chamber to below the 200 mTorr.
____ 7. Close the Foreline Isolation Valve and open the Gate Valve
____ 8. Measure the DC voltage at TP2 of the Foreline Manometer switch box. Set to
9.5 V by adjusting the potentiometer. This corresponds to 9.5 Torr pressure trip
point.
____ 9. To verify the setting, perform the following steps.
____ 10. Isolate the Turbo Pump by closing the Gate Valve and Turbo Isolation Valve
____ 11. With all interlocks satisfied, unplug the Foreline manometer.
____ 12. Verify that the Chamber Cover Interlock trips.
____ 13. Plug the Foreline manometer back in.
Measure Point
See Detail A
DETAIL A
ESC
3.10.3 Preparation
NOTE
Prior to completing calibration, 25 deposition wafers should be run to season
the Sapphire Light Probe
____ 1. Cool the process chamber to be calibrated to 25 °C and vent the chamber.
____ 2. Power up the Radiometer and Temperature Match and let them warm up for
30 minutes.
____ 3. Open process chamber.
____ 4. Put lift pins in process position (it makes calibration easier).
____ 5. Connect the Radiometer RS232 cable (0620-01754) to the Temp Match Tool.
3.10.4 Calibration
____ 1. At the rear of Radiometer, install the Optical Fiber Transmission Cable of the
channel to be calibrated into the fourth port (lowest port). The fourth port is the
calibration port. (Refer to Figure 3-5)
CALIBRATION PORT
____ 2. On the Radiometer, scroll through the Channel Menu by pressing the CH button
to get to the ZERO CAL display. Press ENTER to initiate the zero calibration.
(Refer to Figure 3-6)
CHAPTER 3 Calibration Procedures 311-023-02 3-33
____ 3. Scroll through the Channel Menu to get to the CH #4 display. Press enter. If CH
#4 is not on, scroll through the Input Menu by pressing the INPUT button to get
to the OFF display. Press the up arrow to turn on CH #4. Press ENTER.
____ 4. Scroll through the Input Menu and verify that the Emissivity and Sensor Factor
during calibration is 1.0. If not, change the values as needed.
____ 5. Scroll through the Input Menu to get to the TEMP display for the CH #4. Press
enter. The display should now be reading a temperature in the 300 °C–500 °C
range. This temperature is based on the ambient light being picked up by the
Sapphire Light Probe at the ESC.
____ 6. For the Temperature Match Plate, leave the Delrin Pin in place for the type of ESC
the plate has to mount on to. Remove the two Delrin Pins for the other two ESC
types. Mount the plate on to the ESC. (See Figure 3-7)
3-34 311-023-02 Calibration Procedures CHAPTER 3
DELRIN
PIN
DELRIN
PIN
DELRIN
PIN
____ 7. Fit the Temperature Match into the Temperature Match Plate over the Sapphire
Light Probe on the ESC. Refer to Figure 3-4 Adjust the position of the Temperature
Match over the Sapphire Light Probe until you get the maximum temperature
reading on the Radiometer. This temperature is based on the light being emitted
by the Temperature Match.
____ 8. Scroll through the Input Menu to get to the TEMP display. Press ENTER. Change
the temperature displayed on the Radiometer to the temperature rating of the
Temperature Match Tool. The temperature will be on the side of the Temp Match
Tool. Use the ∧ and ∨ arrow buttons of the Radiometer to change temperature reading.
Press ENTER.
____ 9. Scroll through the Input Menu to get to the SENSOR display.
____ 10. Record the sensor factor displayed. Chamber ________ Sensor
Factor___________.
____ 11. Multiply the sensor factor by 0.781. The product is the corrected sensor factor for
the 1020nm wavelength. 0.781 is the correction factor provided by Sekidenko.
____ 12. Record the corrected sensor factor for the respective chamber. Corrected Sensor
Factor ____________. For reference, the corrected sensor factor should fall
between 0.4 and 0.7.
____ 13. Remove the Optical Fiber Transmission Cable from the calibration port and
connect it to the respective port of the channel to be used. Record channel number.
Channel ___________.
____ 14. Install the process kit.
____ 15. Repeat this calibration procedure for the other 300mm Chambers equipped with
the Wafer Temperature Monitor on the platform.
CHAPTER 3 Calibration Procedures 311-023-02 3-35
4.1.3 Preparation
____ 1. Put the turbo throttle valve in the closed position.
____ 2. Follow prescribed procedures to vent the process chamber.
____ 3. Turn off the generator rack circuit breaker and lockout/tagout the generator rack.
____ 4. Disconnect the connector on the throttle valve drive motor.
NOTE
Do not use any kind of lubricating material on the seals as this may result in
particle contamination in the chamber.
NOTE
To assure proper positioning of the flange blades they must be held in the fully
closed position while tightening the set screws in the hub clamps.
____ 1. Set the Argon flows as follows: Side Flow 100 sccm, Top Flow 20 sccm
____ 2. Home the Turbo Throttle Valve.
____ 3. Verify that the Turbo throttle valve is closed at the zero step count.
____ 4. Loosen the two set screws that hold (couple) the throttle valve drive gear to the
butterfly-shaft.
CHAPTER 4 Corrective Maintenance Procedures 311-023-02 4-7
____ 5. Turn the shaft to the closed position with a screwdriver inserted in the end of the
butterfly-shaft. The pressure should be >70 Torr and the Closed flag sensor should
still be on. Adjust to maximum pressure attainable.
____ 6. Tighten the set screws.
____ 7. Open and close the valve two times to verify that the chamber pressure returns to
above 70 mTorr each time the valve is closed. Readjust if necessary.
____ 8. Set the position to step 0 then increase the step position one step at a time until
the chamber pressure is between 60 mTorr and 70 mTorr.
____ 9. Insert the step position to the Throttle Valve Closed Position for the Turbo Throttle
Valve on the Throttle Control Screen.
____ 10. Command the Throttle Valve to OPEN then to CLOSED and verify pressure is
between 60 mTorr and 70 mTorr. Re-adjust until repeatable three times.
____ 11. Install the 2 push pin tools opposite of each other in the 1/4″ mounting hole. Take
a wrench and slowly tighten each bolt until the cathode assembly raises up slightly.
This will break the seal between the cathode and chamber.
____ 12. Remove the 2 push pin tool.
____ 13. Install the cathode assembly tool. Mount it in the remaining four 1/4″ holes.
Tighten all bolts onto the cathode assembly.
____ 14. Slowly lift the cathode assembly up above the alignment pins with the help of
others.
____ 15. Once the assembly is above the pins, slightly move it towards the opposite side
of the bias match and up. Ensure that the water lines, RF strip and WTM cable
are sliding out of the opening of the chamber. Be careful as the RF strip and cables
may break. It is suggested that one person will guide the water lines, RF strip and
WTM cable through while the others are lifting.
____ 16. Place assembly on stand.
____ 12. Remove the insulator (item #14) also ensuring not to bend the bias conductor.
Remove the delrin pins from the insulator or ESC. Take note which side of the
insulator is mounted to the ESC.
____ 13. Remove the lift pin guides (item #13).
____ 14. Remove the O-ring (item #25) from the ESC.
____ 15. Remove the bias conductor (item #8) from the ESC.
____ 16. Remove the water blocks (item #2), take note of the orientation of the holes. The
most outer holes are towards the outside of the ESC.
____ 17. Remove the He feedthrough flange (item #4), if He cooling is used. The thread
(item #5) is actually installed into the feedthrough.
____ 18. Remove all the remaining o-rings (item #23 and #29).
____ 19. Replace all O-rings or parts as required.
CHAPTER 4 Corrective Maintenance Procedures 311-023-02 4-11
300mm Ultima HDP-CVD Cathode Assembly
Figure 4-4.
4-12 311-023-02 Corrective Maintenance Procedures CHAPTER 4
Bias Match and RF Feedthrough
Figure 4-5.
CHAPTER 4 Corrective Maintenance Procedures 311-023-02 4-13
BIAS RF
FEED PORT
WTM FIBER-OPTIC
PORT
HEAT EXCHANGER
HOSE PORTS
NOTE
If using a new ESC assembly refer to step a and step b.
a. Use a No. 4 screw to remove the two water plugs used to seal in the cooling
water.
b. Use a No. 4 screw to remove the two helium plugs used to seal in the helium.
____ 20. Clean all parts with IPA before installing.
____ 21. Inspect all O-ring grooves and ESC surface for defects.
____ 22. Install O-rings (item #23, #25 and #29) onto ESC.
____ 23. Install the two water block (item #2) onto ESC. Ensure the correct orientation as
shown in detail A. Have the outer mounting holes towards the edge of the ESC.
Make sure to have the water spiral (item #35) installed on the water block.
____ 24. Install the bias conductor (item #8) as shown in detail B.
____ 25. Install the three lift pin guides into ESC.
____ 26. Install the two delrin pins (item #1) onto ESC.
____ 27. Install the two He feedthrough flanges onto ESC. Ensure the thread (item #5) is
installed.
____ 28. Ensure to have the six spacer rings (item #31) installed on the insulator (item #14).
____ 29. Install the insulator onto ESC by sliding bias conductor thorough the center hole.
Ensure the delrin pins line up.
____ 30. Take the cathode base (item #11) and install two delrin pins (item #1). With a IPA
install the two O-rings (item #39) into base.
____ 31. Install the O-ring (item #25) onto the cathode base.
____ 32. Install the cathode base onto ESC by sliding the bias conductor thorough and line
up the delrin pins.
____ 33. Install six bushings (item #3) with 1/4″ bolts. Ensure to tighten evenly and torque
them to 35 lbs–40 lbs.
____ 34. Install the O-rings (item #20 and #22) onto two water feed blocks (item #12). It
should align with the water block (item #2).
____ 35. Install the two hose assembly (item #37) onto cathode base.
____ 36. Install WTM fiber optic cable (if applicable) onto cathode base with the
installation tool. Ensure to have the O-ring (3700-02678) installed on the quartz
side of cable and the washer on the other side. Carefully place cable into cathode
base and align. Ensure cable is snug. (Not shown).
CHAPTER 4 Corrective Maintenance Procedures 311-023-02 4-15
____ 37. Route the cable into the guide block and mount of cathode base.
____ 38. Carefully turn over cathode assembly and place on stand.
____ 39. Test the cathode assembly for water leaks by pressure or by connecting the heat
exchanger hoses.
____ 1. Install the two bushings in the same position when cathode assembly was removed.
The two locating pins should be still installed in the chamber. If not, ensure that
the pins and bushings are in the same position. This will help guide the cathode
assembly into the chamber without breaking the lift pin guides.
____ 2. Install the cathode assembly tool, Part No. 0270-00690. Mount it in the remaining
four 1/4″ holes. Tighten all bolts onto the cathode assembly.
____ 3. Slowly lift the cathode assembly from the stand and align the bushings and the
locating pins on the chamber. At the same time, with the help of someone else,
guide the bias conductor, water hoses and WTM cable through the opening of the
hole.
____ 4. Remove the cathode assembly tool, bushings and locating pins.
____ 5. Install the six 1/4″ mounting screws in a star pattern.
____ 6. Install the six covers.
____ 7. Install the process kit. For the collar use the tool, Part No, 0270-00689. Lift pins
and cover.
____ 8. Install the white teflon insulator over the bias conductor and install the RF rod
onto it. Install the insulator over the rod.
____ 9. Install the bias match and components onto the chamber.
____ 10. Connect the heat exchanger hose and WTM fiber optic cable (if applicable).
____ 11. Follow the prescribed procedures for recovery.
4-16 311-023-02 Corrective Maintenance Procedures CHAPTER 4
____ 1. Verify that system constants 3678 through 3689 are all set to the value 100. These
system constants control the temperature ramp down of the top, side, and ground
shield heaters. These values are taken from the lab tool.
____ 2. Verify that all chambers using a contact TC have the correct Thermologic
Controller settings. These values are found by selecting the Dome Heater Detail
screen from the Chamber Service screen of each chamber with a contact TC. The
values should be as follows:
Bandwidth 2 2 5 2
Reset Factor .05 .05 .05 1.56
Rate Factor 2 2 2 2
Offset 0 0 0 0
Duty Cycle 100 100 100 100
____ 3. Confirm that the lid is getting at least 1 GPM of water flow with an external water
flow meter. Also, verify that the water flow is in the correct direction. Water should
flow from the chamber body to the lid. Water flow in the lid moves in the following
order: base → top cooling plate → ground shield → side coil.
CHAPTER 4 Corrective Maintenance Procedures 311-023-02 4-17
____ 4. Verify the resistivity of the side coil is greater than 2 MΩ using the Section 4.4,
Side Coil Inspection Procedure. Side coils which have less than
2 MΩ resistivity should be replaced.
____ 5. Verify that the side coil has been installed correctly. Gaps between the dome and
the side coil create “hot spots” which will eventually cause cracks in the side coil.
WARNING
Hazardous Voltage. Potentially lethal
electrical voltages and currents are present
which could cause shock, burns, or death.
Turn off, lockout and tagout.
____ 6. Using Phillips or flat head screw driver – remove screws fastening down heater
terminals.
____ 7. Connect the heater terminal lugs to the red lead (positive side) of the megger meter
and CONNECT THE BLACK LEAD (COMMON) TO THE GROUNDING
LEG OR COPPER TUBE OF THE SIDE COIL. See Figure 4-8.
CHAPTER 4 Corrective Maintenance Procedures 311-023-02 4-19
Black Clip
Red Clip
____ 8. Ensure no part of your body is part of the circuit and then apply 1000 volts. If
heater dielectric resistance is less than 2 MΩ replace the side coil. If heater
dielectric resistance is greater than 2 MΩ the side coil is within operating
specifications and should be returned to operating condition again
____ 9. Remove Megger Alligator clips from ground and heater terminals.
____ 10. Reattach heater leads to terminal block
____ 11. Reattach Plexiglas cover on terminal block.
____ 12. Reinstall chamber lid cover.
____ 13. Remove LOTO from heater circuit breaker and RF generators
____ 14. Verify dome heater heats to temperature.
____ 15. Verify proper operation of heaters and source RF components
4.5.2.1 Preparation
____ 1. Turn Dome heating system off and allow dome to cool.
____ 2. Turn Heat Exchanger temperature down to 30° and allow system to cool.
____ 3. Turn Heat Exchanger off and close shutoff valves.
____ 4. Disconnect both the feed and return cooling water hose lines going to the lid.
____ 5. Turn the Turbo-pump off and vent the chamber.
____ 6. Turn breaker for Dome heaters off and LOTO.
____ 7. If procedure is done with lid installed on chamber, protect ESC and upper gas feed
lines from falling debris. (Clean wipes may be used as protective coverings)
____ 8. Drain the excess fluid out of the coolant hoses into a container.
NOTE
Be careful not to tilt the assembly to the side while removing it or the
top nozzle will break. (Item 103 on Figure 4-12).
____ 6. Using a 9/64″ allen wrench, disconnect both RF connecting straps by loosening
the clamps that grasps on to the posts. (Figure 4-12)
____ 7. Using a 5/16″ wrench, disconnect the AC wires to top heater plate. (Figure 4-12)
____ 8. Remove ground shield AC wires using an 11/32″ wrench. (E6 and E7 on
Figure 4-10)
____ 9. Remove TCs off ground shield using a flathead screwdriver. (Item 89 on
Figure 4-10)
4-22 311-023-02 Corrective Maintenance Procedures CHAPTER 4
____ 10. Disconnect cooling water lines to cooling plate and put plugs on the female side
and caps on the male side to prevent fluid from leaking out.
____ 11. Insert two 5/16-18 x 1-1/4″ bolts into top stack assembly where marked.
____ 12. Using a 5/32″ allen wrench, remove the four top stack assembly clamping screws.
____ 13. Using a 5/32″ allen wrench remove all six retaining bolts for top stack cooling
plate. (Item 78 on Figure 4-12)
____ 14. Remove cooling plate/heater assembly. (Aluminum Nitride Plate remains on the
dome)
____ 15. Remove TCs from sides. (Item 99 on Figure 4-11)
____ 16. Remove the ground shield by lifting it off of dome. (make sure the dried heat sink
compound does not get into gas feed hose or into chamber)
____ 17. Remove AC wires to side coil.
____ 18. Using a 5/32″ allen wrench, remove the six bolts and six side clamps on the coil.
Pay close attention to how the Vespell clamps are oriented, top and bottom so they
are reinstalled properly with the new side coil. Item 90, 91 and 135 on Figure 4-10)
____ 19. Remove water lines and RF lines.
____ 20. Using a 5/32″ allen wrench, remove clamping plates on tensioning blocks (Item
18 and 22 on Figure 4-9) and remove side coil (Item 34 on Figure 4-9).
____ 21. Clean the dome, graphite shield, and lid assembly with IPA using clean wipes.
NOTE
Compress tensioning spring and insert block device to keep it compressed
prior to installing coil. The spring should be fully compressed or as close to
full compression as possible. (See Figure 4-16).
____ 3. Install six (6) Vespell spacer and six (6) clamps but do not tighten them. Ensure
Vespell spacers are pushed down so that the bottom of the Vespell spacer sits on
top of the ceramic flange of the dome (See Figure 4-13). Also make sure they are
properly oriented, top and bottom.
CHAPTER 4 Corrective Maintenance Procedures 311-023-02 4-23
____ 4. Insert spacer block device (See Figure 4-14) and ensure spring is fully compressed.
Push left and right insulators against center tensioning wedge. Fasten both ground
and insulator caps which clamp the ends of the copper tube.
____ 5. Remove the blocking device holding the spring mechanism tensioned and using
Cap pliers — Gently but firmly — tighten the side coil around the dome to
eliminate any gaps. (See Figure 4-15)
____ 6. Using a 5/32″ allen wrench, tighten side clamps in a star pattern.
CAUTION
DO NOT over tighten. There should be some collapsing of the slot in the back of the
Vespell clamps to indicate clamp is being pushed against the coil and dome.
____ 7. Compress tensioning spring again you will notice there are gaps between the left
and right insulators and the tensioning wedge. Loosen the grounding clamp and
push the insulator towards the tensioning wedge — make sure the tube end does
not move. Eliminate the gap between the wedge & spring support and retighten
the ground clamp. Repeat process for insulator clamp.
____ 8. Loosen side clamps. Remove block from tensioning mechanism again. The
tensioning spring should be fully compressed (See Figure 4-16). Check side coil
for gaps if any are greater than 0.007″. If gaps are eliminated and tension spring
is fully compressed tighten side clamps in a star pattern. If gaps remain or spring
is loose repeat step 8.3.5 through step 8.3.8. The end goal is to end up with the
tensioning spring being as fully compressed as possible with the least amount of
gaps between the coil and dome.
____ 9. Install ground strap to tensioning block. (Item 18 on Figure 4-9)
____ 10. Reinstall cooling lines for the side coil.
____ 11. Apply fresh coat of thermal compound (approximately 0.020″ to 0.030″ thick) to
the ground shield graphite blocks.
____ 12. Reinstall ground shield by applying even pressure downwards and turning counter
clockwise. Ensure that the ground shield is not touching the side coil where the
ends come out.
____ 13. Reinstall graphfoil sheet taking precaution as to not misalign holes, especially on
the RF feeds. (RF feeds may be used as guides for this process)
____ 14. Reinstall heater stack assembly by using a 5/32″ allen wrench to tightening the
six bolts. (Item 78 on Figure 4-12)
____ 15. Reinstall the cooling lines for the cooling plate.
____ 16. Reinstall top RF insulators.
4-24 311-023-02 Corrective Maintenance Procedures CHAPTER 4
____ 17. Reinstall center nozzle assembly by using a 1/8″ allen wrench to tighten the three
bolts. (Item 103 on Figure 4-12)
____ 18. Reinstall AC wires to top heater plate by using a 5/16″ wrench to tighten the hex
nuts on the posts. (Item 160 and 161 on Figure 4-12)
____ 19. Reinstall RF connecting straps. (Figure 4-12)
____ 20. Reinstall gas lines and TCs. (Figure 4-12)
____ 21. Thread the plunger (Item 44 on Figure 4-12) in until the tip rests on the ground
shield. Then turn the plunger in ¼ turn.
____ 22. Using a 15/16″ wrench, tighten the hex nut (Item 69 on Figure 4-12) onto the
plunger to provide tension between the heater stack assembly and the ground
shield.
____ 23. Turn on SMC Heat Exchanger, verify that there are no fluid leaks after it has been
running for a few minutes. Fill the reservoir with 50% Glycol and 50% DI water.
Set heat exchanger setpoint to 65 °C.
____ 24. Remove clean wipes from chamber. Close chamber lid and pump down chamber.
____ 25. Remove LOTO from heater circuit breaker. Turn on heaters.
____ 26. Verify proper operation of heaters and source RF components.
CHAPTER 4 Corrective Maintenance Procedures 311-023-02 4-25
Ground Cap
Insulator Cap
Tensioner Wedge
Insulator, Left
Compression Spring
Insulator, Right
Spring Support
CAP PLIERS
NOTE
FOR NON STANDARD PARTS PLEASE CONTACT HDP-CVD TECHNICAL
SUPPORT
To order spare parts for any Applied Materials product, contact the Applied Materials Spare
Parts Department. The phone number is 1-800-468-8888 option 3.
5
5CHAPTER
Spare Parts Identifier
311-023-02
Figure 5-6. 0010-18255 Lower Chamber Assembly (2 of 7)
5-13
5-14
311-023-02
Spare Parts Identifier
CHAPTER
Figure 5-7. 0010-18255 Lower Chamber Assembly (3 of 7)
5
5CHAPTER
Spare Parts Identifier
311-023-02
5-15
Figure 5-8. 0010-18255 Lower Chamber Assembly (4 of 7)
5CHAPTER
Spare Parts Identifier
311-023-02
Figure 5-9. 0010-18255 Lower Chamber Assembly (5 of 7)
5-16
5CHAPTER
Spare Parts Identifier
311-023-02
5-17
Figure 5-10. 0010-18255 Lower Chamber Assembly (6 of 7)
5CHAPTER
Spare Parts Identifier
311-023-02
5-18
Figure 5-11. 0010-18255 Lower Chamber Assembly (7 of 7)
CHAPTER 5 Spare Parts Identifier 311-023-02 5-19
32
5-27
5-28 311-023-02 Spare Parts Identifier CHAPTER 5
5-31
5-32 311-023-02 Spare Parts Identifier CHAPTER 5
APPENDIX A Equipment Decontamination 311-023-02 A-1
A Equipment Decontamination
The following decontamination procedure and reference material has been taken from the
Applied Materials Corporate Safety Manual. Make sure to have the entire manual to fully
understand and utilize all safety concerns associated with the tool that is being used. If the
Safety Manual is not available please contact the regional and/or customer service
representative for a copy.
A.2 Policy
1. It is the policy of Applied Materials that parts and equipment are shipped to or
received from internal or external customers free from hazardous contamination.
A.3 Scope
1. This document establishes guidelines for decontamination, identifies the
responsible parties, and defines a process for notification, testing, and providing
documentation for parts and equipment that have been exposed to hazardous
materials before shipment.
2. This Standard applies to all Applied Materials locations and operations,
world-wide. Where governmental agencies provide more stringent regulations,
the more stringent requirements shall apply.
3. All Officers, Directors, Managers and Supervisors are responsible, within their
areas of responsibility, for implementation of and adherence to this Standard.
4. Customers, Contractors, Applied Materials Customer Engineers, and other
personnel who ship components, parts, systems, or equipment to or from
Applied Materials are required to conform to this standard.
A-2 311-023-02 Equipment Decontamination APPENDIX A
A.4 Definitions
1. Contaminated Parts — is any component, part, system, or equipment which has
been exposed to or operated with hazardous gas, liquid, or solid chemicals during
semiconductor processing and which could pose risks or hazards to human health
or the environment.
2. Decontamination — the removal of risks or hazards to human health or the
environment resulting from the presence of hazardous materials in or on the
equipment.
3. Hazardous Material — any chemical, substance, or compound which is defined
or interpreted to pose risks or hazards to human health or the environment by
applicable international, national, regional, or local laws or regulations.
4. Local Safety Department — The safety department which provides services to
Applied Materials management at the local level.
A.4.1 Limitations
1. It is recognized that, in some cases, complete chemical contamination can not or
will not be achieved nor desired, e.g., because it would destroy the part
(i.e., Pumps), the part needs failure analysis, etc. In these cases, the shipper must
ensure that any remaining potential hazards are clearly identified to all those
handling and receiving these parts, and that all other requirements of this Standard
are followed. In addition, these parts may require classification and shipping as
hazardous material according to the laws and regulations of the site and region.
2. The documentation required by this Standard is supplemental to applicable
documentation required by local state, national, and international regulations.
3. This standard applies to parts and equipment that have been exposed to hazardous
materials during semiconductor processing and does not include facilities
equipment such as scrubbers, tanks, etc. which would be covered by other
environmental standards.
A.5.1 Responsibility
WARNING
These parts have been exposed to various
hazardous and toxic gases and liquid sources
which may be contained in or have deposited
residues on them. Always wear protective
gloves, eye protection, clothing, and provide
adequate ventilation or a respirator while
performing these procedures as applicable to
the type of process exposure.
1. Follow established procedures for wet cleans and removal of the used parts. Be
sure to wear proper protective gloves (not lightweight cleanroom type) when
handling these parts as they may have corrosive or toxic residues on the surface.
2. Wipe down all surfaces of the returning parts with a wipe or cloth containing
de-ionized water.
3. Test all surfaces of the parts with a wetted piece of pH paper. Range of pH should
be between 5 pH and 10 pH. If not, redo wipe down.
APPENDIX A Equipment Decontamination 311-023-02 A-5
4. Follow this with a wipe down of all surfaces with a wipe or cloth containing
isopropanol.
5. Dispose of all used wipes as hazardous waste at the Customer site.
6. Place the parts into the Applied Materials approved clear polyethylene bag (See
Section A.5.2 for part numbers) or bag of similar design and SEAL the bag.
A.6.1 Labeling
1. Fill out the information required on the Applied Materials Returned Part
Information Form or Field Report/Traveler. Ensure information is provided on the
chemicals used in the equipment these parts were removed from.
2. All parts must be accompanied by an RMA number and the Returned Part
Information Form or Field Report/Traveler. Attach copies of all paperwork to the
outside of the shipping container. The parts are now ready for shipment.
Following are the procedures for the decontamination and packaging of all contaminated
gas and liquid source handling system parts prior to shipping and handling. These parts
include flow controllers (AFCs and MFCs), gas lines, valves, vacuum components, Neslabs,
cooling lines/reservoirs, etc. but DOES NOT refer to pumps, implant parts, or susceptors.
More detailed procedures may be required for your location.
WARNING
These parts have been exposed to various
hazardous and toxic gases and liquid sources
which may be contained in or have deposited
residues on them. Always wear protective
gloves, eye protection, clothing, and provide
adequate ventilation or a respirator while
performing these procedures as applicable to
the type of process exposure.
A-6 311-023-02 Equipment Decontamination APPENDIX A
A.6.2 Purging
Before removing parts for handling or shipment, the gas and liquid source handling system
must be purged with an inert gas and drained of all liquids to remove hazardous and toxic
gases and/or free liquids. IF THE PARTS CANNOT BE PURGED OR DRAINED
COMPLETELY FOR ANY REASON, AND RESIDUAL HAZARDOUS GAS OR LIQUID MAY
REMAIN INSIDE, THIS PARTS SHOULD BE SCRAPPED ON SITE AND NOT RETURNED
TO APPLIED MATERIALS OR ITS VENDORS.
1. Ensure that the process gas or liquid is shut off at the source.
2. Pump out the lines to be serviced to the source. Drain all coolant lines and
reservoirs completely.
3. Perform cycle purges with inert gas at least 20 times for non-toxic gases
(ex. Freons), at least 60 times for toxics before removing any parts from the system.
(Liquid sources such as BCl3, TMB, TMP, and TEOS may require additional cycle
purges as indicated in Applied Materials maintenance manuals. NO LIQUID/GAS
RESIDUES WITHIN GAS OR LIQUID SOURCE HANDLING SYSTEMS WILL
BE ACCEPTABLE) NOTE: IF THE PART CANNOT BE COMPLETELY
PURGED OF GAS OR LIQUID, DO NOT RETURN IT!
4. Once the system is completely purged or drained, you may proceed in removing
flow controllers, valves, gas lines, etc. from the system. COVER ALL OPENINGS
with the proper fittings preferably or caps, including flow controllers, valves,
Neslabs, cooling lines, etc. that are being returned.
5. Place the parts into the Applied Materials approved clear polyethylene bag (See
Section 5.0 for part numbers) or bag of similar design and SEAL the bag.
A.6.3 Labeling
1. Fill out the information required on the Applied Materials Returned Part
Information Form or Field Report/Traveler. Ensure information is provided on the
chemicals used in the equipment these parts were removed from.
2. All parts must be accompanied by an RMA number. Securely attach copies of all
paperwork to the outside of the returning part. The parts are now ready for
shipment.
APPENDIX A Equipment Decontamination 311-023-02 A-7
A.7 Pumps
WARNING
Most of Applied Materials equipment pumps
have been exposed to various corrosive and
toxic gases which could have contaminated
pumps and pump fluids. Always wear
protective gloves, eye wear, and clothing and
provide adequate ventilation or wear an air
purifying respirator when performing this
procedure as applicable to the type of
process exposure.
All pumps (including turbopumps) that have been removed from service must be properly
prepared before being transported since they may contain hazardous materials. Strict
transportation and environmental laws, as well as the safety of our employees and vendors,
make this essential. Global Environmental Safety and Health has researched this issue and
recommends the following procedure. More detailed procedures may be required for your
location.
.
NOTE
“Wet” pumps refer to oil-lubricated pumps, whereas “dry” pumps refer
to oil-free pumps
6. Label the bag with the following information: contents, date and name of the
person generating the waste. The waste materials generated during the pump
decontamination (oil, coolant, filters, cartridges and wipes) must be handled and
disposed of by the site Safety or Environmental Representative according to local
waste disposal requirements.
7. If possible, place the pump in an Applied Materials approved clear polyethylene
bag (see Section A.5.2 for part numbers) and seal the bag. If the pump is too large
to fit into the bags, wrap the exterior of the pump with clear plastic or poly and
secure with tape. Secure the pump in a (DOT or other agency) approved wooden
or strong fiberboard box, or sealable polyethylene container for easy handling.
Ship only one pump per container.
A.7.1 Labeling/Marking
1. When possible, ship pumps directly to your local pump vendor, with any additional
paperwork required by that vendor.
2. If the pump is to be shipped to Applied Materials, obtain an RMA (Return Material
Authorization) number and complete an Applied Materials Returned Part
Information Form, Field Report/Traveler, or other acceptable customer/vendor
form which provide the same information. Ensure that information is provided
about the chemicals used in the system/chamber from which the pump was
removed. Securely attach copies of all paperwork to the outside of the pump and
the shipping container.
3. Pumps containing residues of hazardous materials must be labeled, packaged, and
shipped according to regional shipping regulations (DOT, IATA, etc.). A
recommended UN/NA shipping classification for each process is provided on the
Process Reference Sheet but THE CORRECT CLASSIFICATION AND
LABELING IS THE RESPONSIBILITY OF THE SITE SAFETY/
ENVIRONMENTAL OR SHIPPING ORGANIZATION.
4. Shipping papers (waybills, etc.) must be filled out and hazardous materials labels
must be applied by the SITE SAFETY/ENVIRONMENTAL OR SHIPPING
ORGANIZATION who have training and certification in the applicable regional
transportation requirements.
NOTE
Applied Materials Customer Engineers must not fill out the above legal
shipping documentation for their Customers!
Applied Materials, Inc. 1999. All rights reserved. Printed in U.S.A. 12/1199 IBSS