This document provides instructions for adjusting the lead edge and side edge registration of printed pages through modifying non-volatile memory (NVM) values. It describes measuring the lead and side edges of a printed test pattern and checking if they fall within specification ranges. If not, the appropriate NVM value should be increased or decreased to adjust the registration until the measurements are within specifications. A table lists the relevant NVM chains and their adjustment ranges that can be modified to align the image position on the drum with the paper edges.
This document provides instructions for adjusting the lead edge and side edge registration of printed pages through modifying non-volatile memory (NVM) values. It describes measuring the lead and side edges of a printed test pattern and checking if they fall within specification ranges. If not, the appropriate NVM value should be increased or decreased to adjust the registration until the measurements are within specifications. A table lists the relevant NVM chains and their adjustment ranges that can be modified to align the image position on the drum with the paper edges.
This document provides instructions for adjusting the lead edge and side edge registration of printed pages through modifying non-volatile memory (NVM) values. It describes measuring the lead and side edges of a printed test pattern and checking if they fall within specification ranges. If not, the appropriate NVM value should be increased or decreased to adjust the registration until the measurements are within specifications. A table lists the relevant NVM chains and their adjustment ranges that can be modified to align the image position on the drum with the paper edges.
This document provides instructions for adjusting the lead edge and side edge registration of printed pages through modifying non-volatile memory (NVM) values. It describes measuring the lead and side edges of a printed test pattern and checking if they fall within specification ranges. If not, the appropriate NVM value should be increased or decreased to adjust the registration until the measurements are within specifications. A table lists the relevant NVM chains and their adjustment ranges that can be modified to align the image position on the drum with the paper edges.
1 IOT Lead Edge/Side Edge Registration If the measured value is longer than the above Spec value: Decrease the setup value.
Purpose Table 2 NVM List
To align the image on the drum with the proper position (Lead/Side Edge) of the paper. Chain Link Name Min Initial Max Increment Check 742-027 LEAD REGI ADJUSTMENT - ALL TRAY 0 33 66 0.2175mm 1. Enter the Diag Mode, then execute [Print Test Pattern]. 749-001 ALL TRAY-LASER SIDE REGI ADJUSTMENT 1 50 99 0.254mm 2. Select the following pattern and print it on A3 paper. 749-002 TRAY1-LASER SIDE REGI ADJUSTMENT 1 50 99 0.254mm 052-1 (Total Chart) 749-003 TRAY2-LASER SIDE REGI ADJUSTMENT 1 50 99 0.254mm 3. Measure the Lead and Side Edges of the print pattern. (Figure 1) 749-004 TRAY3-LASER SIDE REGI ADJUSTMENT 1 50 99 0.254mm Lead Edge: Part A in the figure 749-005 TRAY4-LASER SIDE REGI ADJUSTMENT 1 50 99 0.254mm Side Edge: Part B in the figure 749-007 MSI-LASER SIDE REGI ADJUSTMENT 1 50 99 0.254mm 749-009 DUP ALL TRAY-LASER SIDE REGI 1 50 99 0.254mm ADJUSTMENT 749-010 DUP TRAY1-LASER SIDE REGI 1 50 99 0.254mm ADJUSTMENT 749-011 DUP TRAY2-LASER SIDE REGI 1 50 99 0.254mm ADJUSTMENT 749-012 DUP TRAY3-LASER SIDE REGI 1 50 99 0.254mm ADJUSTMENT 749-013 DUP TRAY4-LASER SIDE REGI 1 50 99 0.254mm ADJUSTMENT 749-015 DUP MSI-LASER SIDE REGI ADJUSTMENT 1 50 99 0.254mm 760-001 TRAY1 for Normal Paper - LEAD REGI 0 33 66 0.2175mm ADJUSTMENT 760-002 TRAY2-4 HCF for Normal Paper - LEAD REGI 0 33 66 0.2175mm ADJUSTMENT Figure 1 IOT Registration (j0st40950) 760-003 SMH for Normal Paper - LEAD REGI 0 33 66 0.2175mm ADJUSTMENT 4. Check that the measured values of the Lead Edge (A) and Side Edge (B) fall within the specifications of the supporting mode. 760-005 DUP ALL SIZE for Normal Paper - LEAD REGI 0 33 66 0.2175mm ADJUSTMENT Table 1 Specification 760-013 DUP A3 Group - LEAD REGI ADJUSTMENT 0 10 16 0.2175mm Item Simplex Duplex MSI 760-014 DUP A4S Group - LEAD REGI ADJUSTMENT 0 10 16 0.2175mm 760-015 DUP A4L Group - LEAD REGI ADJUSTMENT 0 10 16 0.2175mm Lead Edge (A) 15±1.3mm 15±1.7mm 15±2.0mm 760-016 TRAY1 for Thick-1 Paper - LEAD REGI 0 33 66 0.2175mm Side Edge (B) 148±1.8mm 148.5±2.2mm 148.5±2.5mm ADJUSTMENT 760-017 TRAY1 for Thick-2 Paper - LEAD REGI 0 33 66 0.2175mm Adjustment ADJUSTMENT 1. Enter the CE Diag and execute [Maintenance/Diagnostics] and then [NVM Read/Write]. 760-018 TRAY2-4, HCF for Thick-1 Paper - LEAD REGI 0 33 66 0.2175mm 2. Adjust the measured values of the Lead Edge (A) and Side Edge (B) using the following NVM so that the ADJUSTMENT measured values fall within the specifications of the respective supporting modes. 760-019 TRAY2-4, HCF for Thick-2 Paper - LEAD REGI 0 33 66 0.2175mm If the measured value is shorter than the above Spec value: Increase the setup value. ADJUSTMENT 760-020 SMH for Thick-1 Paper - LEAD REGI 0 33 66 0.2175mm ADJUSTMENT
Version 2.1 2007/10/01 9. ELECTRICAL
4-159 AP-II 5010G/DC-II 5010G, AP 550 IG/DC 550 IG Disassembly/Assembly and Adjustment Disassembly/Assembly and Adjustment 2007/10/01 AP-II 5010G/DC-II 5010G, AP 550 IG/DC 550 IG 9. ELECTRICAL 4-160 Version 2.1
Table 2 NVM List
Chain Link Name Min Initial Max Increment 760-021 SMH for Thick-2 Paper - LEAD REGI 0 33 66 0.2175mm ADJUSTMENT 760-022 DUP ALL SIZE for Thick-1 Paper - LEAD REGI 0 33 66 0.2175mm ADJUSTMENT 760-023 DUP ALL SIZE for Thick-2 Paper - LEAD REGI 0 33 66 0.2175mm ADJUSTMENT 760-031 TRAY1 for Thick-4 Paper - LEAD REGI 0 33 66 0.2175mm ADJUSTMENT 760-032 TRAY2-4 for Thick-4 Paper - LEAD REGI 0 33 66 0.2175mm ADJUSTMENT 760-033 SMH for Thick-4 Paper - LEAD REGI 0 33 66 0.2175mm ADJUSTMENT 760-034 DUP ALL SIZE for Thick-4 Paper - LEAD REGI 0 33 66 0.2175mm ADJUSTMENT
3. After adjustment, print the pattern in the same mode again.
4. Repeat the procedure until the measured values of the Lead Edge (A) and Side Edge (B) fall within the specifications.