Product Sample & Technical Tools & Support &

Folder Buy Documents Software Community

TFP410
SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014

TFP410 TI PanelBus™ Digital Transmitter

1 Features 3 Description
•
1 Digital Visual Interface (DVI) Compliant (1) The TFP410 device is a Texas Instruments
PanelBus™ flat-panel display product, part of a
• Supports Pixel Rates up to 165 MHz (Including comprehensive family of end-to-end DVI 1.0-
1080 p and WUXGA at 60 Hz) compliant solutions, targeted at the PC and consumer
• Universal Graphics Controller Interface electronics industry.
– 12-Bit, Dual-Edge and 24-Bit, Single-Edge The TFP410 device provides a universal interface to
Input Modes allow a glueless connection to most commonly
– Adjustable 1.1 V to 1.8 V and Standard 3.3 V available graphics controllers. Some of the
CMOS Input Signal Levels advantages of this universal interface include
selectable bus widths, adjustable signal levels, and
– Fully Differential and Single-Ended Input
differential and single-ended clocking. The adjustable
Clocking Modes 1.1-V to 1.8-V digital interface provides a low-EMI,
– Standard Intel 12-Bit Digital Video Port high-speed bus that connects seamlessly with 12-bit
Compatible as on Intel™ 81x Chipsets or 24-bit interfaces. The DVI interface supports flat-
• Enhanced PLL Noise Immunity panel display resolutions up to UXGA at 165 MHz in
24-bit true color pixel format.
– On-Chip Regulators and Bypass Capacitors for
Reducing System Costs The TFP410 device combines PanelBus circuit
innovation with TI’s advanced 0.18 μm EPIC-5 CMOS
• Enhanced Jitter Performance
process technology and TI’s ultralow ground
– No HSYNC Jitter Anomaly inductance PowerPAD package. The result is a
– Negligible Data-Dependent Jitter compact 64-pin TQFP package providing a reliable,
• Programmable Using I2C Serial Interface low-current, low-noise, high-speed digital interface
solution.
• Monitor Detection Through Hot-Plug and Receiver
Detection Device Information(1)
• Single 3.3-V Supply Operation PART NUMBER PACKAGE BODY SIZE (NOM)
• 64-Pin TQFP Using TI’s PowerPAD™ Package TFP410 HTQFP (64) 10.00 mm × 10.00 mm
• TI’s Advanced 0.18-µm EPIC-5™ CMOS Process (1) For all available packages, see the orderable addendum at
Technology the end of the data sheet.
• Pin Compatible With SiI164 DVI Transmitter
(1)
Typical HDMI Interface
The digital visual interface (DVI) specification is an industry
standard developed by the digital display working group
(DDWG) for high-speed digital connection to digital displays
and has been adopted by industry-leading PC and consumer
electronics manufacturers. The TFP410 is compliant to the
DVI Revision 1.0 specification.

2 Applications
• DVD
• Blu-ray
• HD Projectors
• DVI/HDMI Transmitter(2)
(2)
HDMI video-only

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TFP410
SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014 www.ti.com

Table of Contents
1 Features .................................................................. 1 7.5 Programming........................................................... 17
2 Applications ........................................................... 1 7.6 Register Maps ........................................................ 18
3 Description ............................................................. 1 8 Application and Implementation ........................ 25
4 Revision History..................................................... 2 8.1 Application Information............................................ 25
8.2 Typical Application ................................................. 25
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 6 9 Power Supply Recommendations...................... 28
9.1 DVDD ...................................................................... 28
6.1 Absolute Maximum Ratings ...................................... 6
9.2 TVDD ...................................................................... 28
6.2 ESD Ratings ............................................................ 6
9.3 PVDD ...................................................................... 28
6.3 Recommended Operating Conditions....................... 6
6.4 Thermal Information .................................................. 6 10 Layout................................................................... 29
6.5 Electrical Characteristics........................................... 7 10.1 Layout Guidelines ................................................. 29
6.6 Timing Requirements ................................................ 7 10.2 Layout Example .................................................... 30
6.7 Typical Characteristics .............................................. 9 10.3 TI PowerPAD 64-Pin HTQFP Package................. 33
7 Detailed Description ............................................ 10 11 Device and Documentation Support ................. 34
7.1 Overview ................................................................. 10 11.1 Trademarks ........................................................... 34
7.2 Functional Block Diagram ....................................... 11 11.2 Electrostatic Discharge Caution ............................ 34
7.3 Feature Description................................................. 11 11.3 Glossary ................................................................ 34
7.4 Device Functional Modes........................................ 12 12 Mechanical, Packaging, and Orderable
Information ........................................................... 34

4 Revision History
Changes from Revision B (May 2011) to Revision C Page

• Added ESD Ratings table, Thermal Information table, Typical Characteristics section, Feature Description section,
Device Functional Modes, Application and Implementation section, Power Supply Recommendations section,
Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information
section. .................................................................................................................................................................................. 1

2 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated

Product Folder Links: TFP410

TFP410
www.ti.com SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014

5 Pin Configuration and Functions

PAP Package
64 Pin HTQFP
Top View

RESERVED
DATA12
DATA13
DATA14
DATA15
DATA16
DATA17
DATA18
DATA19
DATA20
DATA21
DATA22
DATA23
DGND

DKEN

DVDD
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33

NC 49 32 TGND
DATA11 50 31 TX2+
DATA10 51 30 TX2-
DATA9 52 29 TVDD
DATA8 53 28 TX1+
DATA7 54 27 TX1-
DATA6 55 26 TGND
IDCK- 56 25 TX0+
IDCK+ 57 24 TX0-
DATA5 58 23 TVDD
DATA4 59 22 TVC+
DATA3 60 21 TXC-
DATA2 61 20 TGND
DATA1 62 19 TFADJ
DATA0 63 18 PVDD
DGND 64 17 PGND

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
DVDD
DE
VREF
HSYNC
VSYNC
CTL3/A3/DK3
CTL2/A2/DK2
CTL1/A1/DK1
EDGE/HTPLG
PD
MSEN/PO1
DVDD
ISEL/RST
DSEL/SDA
BSEL/SCL
DGND

Pin Functions
PIN
TYPE DESCRIPTION
NAME NO.
INPUT
The upper 12 bits of the 24-bit pixel bus
In 24-bit, single-edge input mode (BSEL = high), this bus inputs the top half of the 24-bit pixel bus. In
DATA[23:12] 36−47 I 12-bit, dual-edge input mode (BSEL = low), these bits are not used to input pixel data. In this mode,
the state of DATA[23:16] is input to the I2C register CFG. This allows 8 bits of user configuration data
to be read by the graphics controller through the I2C interface (see the Register Maps section).
Note: All unused data inputs should be tied to GND or VDD.
The lower 12 bits of the 24-bit pixel bus/12-bit pixel bus input
50−55, In 24-bit, single-edge input mode (BSEL = high), this bus inputs the bottom half of the 24-bit pixel
DATA[11:0] I
58−63 bus. In 12-bit, dual-edge input mode (BSEL = low), this bus inputs 1/2 a pixel (12 bits) at every latch
edge (both rising and falling) of the clock.

Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 3

Product Folder Links: TFP410
TFP410
SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014 www.ti.com

Pin Functions (continued)

PIN
TYPE DESCRIPTION
NAME NO.
Differential clock input. The TFP410 supports both single-ended and fully differential clock input
modes. In the single-ended clock input mode, the IDCK+ input (pin 57) should be connected to the
IDCK– 56 single-ended clock source and the IDCK− input (pin 56) should be tied to GND. In the differential
I
IDCK+ 57 clock input mode, the TFP410 uses the crossover point between the IDCK+ and IDCK– signals as
the timing reference for latching incoming data DATA[23:0], DE, HSYNC, and VSYNC. The
differential clock input mode is only available in the low signal swing mode.
Data enable. As defined in DVI 1.0 specification, the DE signal allows the transmitter to encode pixel
data or control data on any given input clock cycle. During active video (DE = high), the transmitter
DE 2 I
encodes pixel data, DATA[23:0]. During the blanking interval (DE = low), the transmitter encodes
HSYNC, VSYNC and CTL[3:1].
HSYNC 4 I Horizontal sync input
VSYNC 5 I Vertical sync input
The operation of these three multifunction inputs depends on the settings of the ISEL (pin 13) and
DKEN (pin 35) inputs. All three inputs support 3.3-V CMOS signal levels and contain weak pulldown
resistors so that if left unconnected they default to all low.
When the I2C bus is disabled (ISEL = low) and the de-skew mode is disabled (DKEN = low), these
three inputs become the control inputs, CTL[3:1], which can be used to send additional information
CTL3/A3/DK3 6 across the DVI link during the blanking interval (DE = low). The CTL3 input is reserved for HDCP
CTL2/A2/DK2 7 I compliant DVI TXs (TFP510) and the CTL[2:1] inputs are reserved for future use.
CTL1/A1/DK1 8
When the I2C bus is disabled (ISEL = low) and the de-skew mode is enabled (DKEN = high), these
three inputs become the de-skew inputs DK[3:1], used to adjust the setup and hold times of the pixel
data inputs DATA[23:0], relative to the clock input IDCK±.
When the I2C bus is enabled (ISEL = high), these three inputs become the 3 LSBs of the I2C slave
address, A[3:1].
CONFIGURATION/PROGRAMMING
Monitor sense/programmable output 1. The operation of this pin depends on whether the I2C
interface is enabled or disabled. This pin has an open-drain output and is only 3.3-V tolerant. An
external 5-kΩ pullup resistor connected to VDD is required on this pin.
When I2C is disabled (ISEL = low), a low level indicates a powered on receiver is detected at the
MSEN/PO1 11 O
differential outputs. A high level indicates a powered on receiver is not detected. This function is only
valid in dc-coupled systems.
When I2C is enabled (ISEL = high), this output is programmable through the I2C interface (see the
I2C register descriptions section).
I2C interface select/I2C RESET (active low, asynchronous)
If ISEL is high, then the I2C interface is active. Default values for the I2C registers can be found in
the Register Maps section.
ISEL/RST 13 I If ISEL is low, then I2C is disabled and the chip configuration is specified by the configuration pins
(BSEL, DSEL, EDGE, VREF) and state pins (PD, DKEN).
If ISEL is brought low and then back high, the I2C state machine is reset. The register values are
changed to their default values and are not preserved from before the reset.
Input bus select/I2C clock input. The operation of this pin depends on whether the I2C interface is
enabled or disabled. This pin is only 3.3-V tolerant.
When I2C is disabled (ISEL = low), a high level selects 24-bit input, single-edge input mode. A low
BSEL/SCL 15 I level selects 12-bit input, dual-edge input mode.
When I2C is enabled (ISEL = high), this pin functions as the I2C clock input (see the Register Maps
section). In this configuration, this pin has an open-drain output that requires an external 5-kΩ pullup
resistor connected to VDD.
DSEL/I2C data. The operation of this pin depends on whether the I2C interface is enabled or
disabled. This pin is only 3.3-V tolerant.
When I2C is disabled (ISEL = low), this pin is used with BSEL and VREF to select the single-ended or
DSEL/SDA 14 I/O differential input clock mode (see Table 1).
When I2C is enabled (ISEL = high), this pin functions as the I2C bidirectional data line. In this
configuration, this pin has an open-drain output that requires an external 5-kΩ pullup resistor
connected to VDD.

4 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated

Product Folder Links: TFP410

TFP410
www.ti.com SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014

Pin Functions (continued)

PIN
TYPE DESCRIPTION
NAME NO.
Edge select/hot plug input. The operation of this pin depends on whether the I2C interface is enabled
or disabled. This input is 3.3-V tolerant only.
When I2C is disabled (ISEL = low), a high level selects the primary latch to occur on the rising edge
of the input clock IDCK+. A low level selects the primary latch to occur on the falling edge of the
EDGE/HTPLG 9 I
input clock IDCK+. This is the case for both single-ended and differential input clock modes.
When I2C is enabled (ISEL = high), this pin is used to monitor the hot plug detect signal. When used
for hot-plug detection, this pin requires a series
1-kΩ resistor.
Data de-skew enable. The de-skew function can be enabled either through I2C or by this pin when
I2C is disabled. When de-skew is enabled, the input clock to data setup/hold time can be adjusted in
discrete trim increments. The amount of trim per increment is defined by t(STEP).
When I2C is disabled (ISEL = low), a high level enables de-skew with the trim increment determined
DKEN 35 I
by pins DK[3:1] (see the Data De-skew Feature section). A low level disables de-skew and the
default trim setting is used.
When I2C is enabled (ISEL = high), the value of DKEN and the trim increment are selected through
I2C. In this configuration, the DKEN pin should be tied to either GND or VDD to avoid a floating input.
Input reference voltage. Selects the swing range of the digital data inputs (DATA[23:0], DE, HSYNC,
VSYNC, and IDCK±).
For high-swing 3.3-V input signal levels, VREF should be tied to VDD.
VREF 3 I
For low-swing input signal levels, VREF should be set to half of the maximum input voltage level. See
Recommended Operating Conditions for the allowable range for VREF.
The desired VREF voltage level is typically derived using a simple voltage-divider circuit.
Power down (active low). In the powerdown state, only the digital I/O buffers and I2C interface remain
active.
When I2C is disabled (ISEL = low), a high level selects the normal operating mode. A low level
selects the powerdown mode.
PD 10 I
When I2C is enabled (ISEL = high), the power-down state is selected through I2C. In this
configuration, the PD pin should be tied to GND.
Note: The default register value for PD is low, so the device is in powerdown mode when I2C is first
enabled or after an I2C RESET.
RESERVED
RESERVED 34 I This pin is reserved and must be tied to GND for normal operation.
DVI DIFFERENTIAL SIGNAL OUTPUT PINS
TX0+ 25 Channel 0 DVI differential output pair. TX0± transmits the 8-bit blue pixel data during active video
O
TX0− 24 andHSYNC and VSYNC during the blanking interval.
TX1+ 28 Channel 1 DVI differential output pair. TX1± transmits the 8-bit green pixel data during active video
O
TX1− 27 and CTL[1] during the blanking interval.
TX2+ 31 Channel 2 DVI differential output pair. TX2± transmits the 8-bit red pixel data during active video and
O
TX2− 30 CTL[3:2] during the blanking interval.
TXC+ 22
O DVI differential output clock.
TXC− 21
Full-scale adjust. This pin controls the amplitude of the DVI output voltage swing, determined by the
TFADJ 19 I
value of the pullup resistor RTFADJ connected to TVDD.
POWER AND GROUND PINS
DVDD 1, 12, 33 Power Digital power supply. Must be set to 3.3 V nominal.
PVDD 18 Power PLL power supply. Must be set to 3.3 V nominal.
TVDD 23, 29 Power Transmitter differential output driver power supply. Must be set to 3.3 V nominal.
16, 48,
DGND Ground Digital ground
64
PGND 17 Ground PLL ground
20, 26,
TGND Ground Transmitter differential output driver ground
32
NC 49 NC No connection required. If connected, tie high.

Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 5

Product Folder Links: TFP410
TFP410
SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014 www.ti.com

6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
DVDD, PVDD,
Supply voltage range –0.5 4 V
TVDD
Input voltage, logic/analog signals –0.5 4 V
RT External DVI single-ended termination resistance 0 to open circuit Ω
External TFADJ resistance, RTFADJ 300 to open circuit Ω
Case temperature for 10 seconds 260 °C
JEDEC latch-up (EIA/JESD78) 100 mA
Tstg Storage temperature 260 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
Human body model (HBM), per DVI pins ±4000
V(ESD) Electrostatic discharge ANSI/ESDA/JEDEC JS-001 (1) V
All other pins ±2000

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VDD Supply voltage (DVDD, PVDD, TVDD) 3.0 3.3 3.6 V
Low-swing mode 0.55 VDDQ/2 (1) 0.9 V
VREF Input reference voltage
High-swing mode DVDD V
AVDD DVI termination supply voltage (2) DVI receiver 3.14 3.3 3.46 V
RT DVI Single-ended termination resistance (3) DVI receiver 45 50 55 Ω
R(TFADJ) TFADJ resistor for DVI-compliant V(SWING) range 400 mV = V(SWING) = 600 mV 505 510 515 Ω
TA Operating free-air temperature range 0 25 70 °C

(1) VDDQ defines the maximum low-level input voltage, it is not an actual input voltage.
(2) AVDD is the termination supply voltage of the DVI link.
(3) RT is the single-ended termination resistance at the receiver end of the DVI link.

6.4 Thermal Information

TFP410
(1)
THERMAL METRIC PAP UNIT
64 PINS
RθJA Junction-to-ambient thermal resistance 26.6
RθJC(top) Junction-to-case (top) thermal resistance 14.1
RθJB Junction-to-board thermal resistance 11.3
°C/W
ψJT Junction-to-top characterization parameter 0.4
ψJB Junction-to-board characterization parameter 11.2
RθJC(bot) Junction-to-case (bottom) thermal resistance 0.9

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

6 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated

Product Folder Links: TFP410

TFP410
www.ti.com SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DC SPECIFICATIONS
VREF = DVDD 0.7 VDD
VIH High-level input voltage (CMOS input) V
0.5 V ≤ V ≤ 0.95 V VREF + 0.2
VREF = DVDD 0.3VDD
VIL Low-level input voltage (CMOS input) V
0.5 V ≤V ≤ 0.95 V VREF – 0.2
High-level digital output voltage (open-drain
VOH VDD = 3 V, IOH = 20 μA 2.4 V
output)
Low-level digital output voltage (open-drain
VOL VDD = 3.6 V, IOL = 4 mA 0.4 V
output)
IIH High-level input current VI = 3.6 V ±25 µA
IIL Low-level input current VI = 0 ±25 µA
VH DVI single-ended high-level output voltage AVDD – 0.01 AVDD + 0.01 V
VL DVI single-ended low-level output voltage AVDD = 3.3 V ± 5%, AVDD – 0.6 AVDD – 0.4 V
RT (1) = 50 Ω ± 10%,
VSWING DVI single-ended output swing voltage RTFADJ = 510 Ω ± 1% 400 600 mVP-P
VOFF DVI single-ended standby/off output voltage AVDD – 0.01 AVDD + 0.01 V
IPD Power-down current (2) 200 500 µA
IIDD Normal power supply current Worst-case pattern (3) 200 250 mA
AC SPECIFICATIONS
f(IDCK) IDCK frequency 25 165 MHz
tr DVI output rise time (20-80%) (4) 75 240 ps
tf DVI output fall time (20-80%) (4) 75 240 ps
DVI output intra-pair + to − differential skew (5)
, f(IDCK) = 165 MHz
tsk(D) 50 ps
see Figure 4
(6)
tojit DVI output clock jitter, max. 150 ps
t(STEP) De-skew trim increment DKEN = 1 350 ps

(1) RT is the single-ended termination resistance at the receiver end of the DVI link
(2) Assumes all inputs to the transmitter are not toggling.
(3) Black and white checkerboard pattern, each checker is one pixel wide.
(4) Rise and fall times are measured as the time between 20% and 80% of signal amplitude.
(5) Measured differentially at the 50% crossing point using the IDCK+ input clock as a trigger.
(6) Relative to input clock (IDCK).

6.6 Timing Requirements

MIN NOM MAX UNIT
t(pixel) Pixel time period (1) 6.06 40 ns
t(IDCK) IDCK duty cycle 30% 70%
t(ijit) IDCK clock jitter tolerance 2 ns
(2)
tsk(CC) DVI output inter-pair or channel-to-channel skew , see Figure 2 f(IDCK) = 165 MHz 1.2 ns
Data, DE, VSYNC, HSYNC setup time to IDCK+ falling edge, see
tsu(IDF) 1.2 ns
Figure 2 Single edge (BSEL=1, DSEL=0,
Data, DE, VSYNC, HSYNC hold time to IDCK+ falling edge, see DKEN=0, EDGE=0)
th(IDF) 1.3 ns
Figure 2
Data, DE, VSYNC, HSYNC setup time to IDCK+ rising edge, see
tsu(IDR) 1.2 ns
Figure 2 Single edge (BSEL=1, DSEL=0,
Data, DE, VSYNC, HSYNC hold time to IDCK+ rising edge, see DKEN=0, EDGE=1)
th(IDR) 1.3 ns
Figure 2
Data, DE, VSYNC, HSYNC setup time to IDCK+ falling/rising Dual edge(BSEL=0,
tsu(ID) 0.9 ns
edge, see Figure 3 DSEL=1, DKEN=0)
Data, DE, VSYNC, HSYNC hold time to IDCK+ falling/rising edge, Dual edge (BSEL=0,
th(ID) 1 ns
see Figure 3 DSEL=1, DKEN=0)

(1) t(pixel) is the pixel time defined as the period of the TXC output clock. The period of IDCK is equal to t(pixel).
(2) Measured differentially at the 50% crossing point using the IDCK+ input clock as a trigger.

Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 7

Product Folder Links: TFP410
TFP410
SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014 www.ti.com

tr tf

DVI 80% VOD

Outputs
20% VOD

Figure 1. Rise and Fall Time for DVI Outputs

th(IDF)
IDCK−

IDCK+
tsu(IDF) th(IDR)
tsu(IDR)

DATA[23:0], DE, VIH

HSYNC, VSYNC VIL

Figure 2. Control and Single-Edge-Data Setup/Hold Time to IDCK±

IDCK+

tsu(ID) th(ID) th(ID)

tsu(ID)

DATA[23:0], DE, VIH

HSYNC, VSYNC VIL

Figure 3. Dual Edge Data Setup/Hold Times to IDCK+

tsk(D)
TX+
50%
TX−

Figure 4. Analog Output Intra-Pair ± Differential Skew

TXN 50%

tsk(CC)

TXM 50%

Figure 5. Analog Output Channel-to-Channel Skew

8 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated

Product Folder Links: TFP410

TFP410
www.ti.com SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014

6.7 Typical Characteristics

900

800 RTFDAJ(ohm)

700

600

500

400

300 Vswing(mV)

200

100

0
Figure 6. RTFDAJ vs Vswing

Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 9

Product Folder Links: TFP410
TFP410
SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014 www.ti.com

7 Detailed Description

7.1 Overview
The TFP410 is a DVI-compliant digital transmitter that is used in digital host monitor systems to T.M.D.S. encode
and serialize RGB pixel data streams. TFP410 supports resolutions from VGA to WUXGA (and 1080p) and can
be controlled in two ways:
1. Configuration and state pins
2. The programmable I2C serial interface (see Table 1)
The host in a digital display system, usually a PC or consumer electronics device, contains a DVI-compatible
transmitter such as the TI TFP410 that receives 24-bit pixel data along with appropriate control signals. The
TFP410 encodes the signals into a high speed, low voltage, differential serial bit stream optimized for
transmission over a twisted-pair cable to a display device. The display device, usually a flat-panel monitor,
requires a DVI compatible receiver like the TI TFP401 to decode the serial bit stream back to the same 24-bit
pixel data and control signals that originated at the host. This decoded data can then be applied directly to the
flat panel drive circuitry to produce an image on the display. Because the host and display can be separated by
distances up to 5 meters or more, serial transmission of the pixel data is preferred (see the T.M.D.S. Pixel Data
and Control Signal Encoding section, Universal Graphics Controller Interface Voltage Signal Levels section, and
Universal Graphics Controller Interface Clock Inputs section).
The TFP410 integrates a high-speed digital interface, a T.M.D.S. encoder, and three differential T.M.D.S. drivers.
Data is driven to the TFP410 encoder across 12 or 24 data lines, along with differential clock pair and sync
signals. The flexibility of the TFP410 allows for multiple clock and data formats that enhance system
performance.
The TFP410 also has enhanced PLL noise immunity, an enhancement accomplished with on-chip regulators and
bypass capacitors.
The TFP410 is versatile and highly programmable to provide maximum flexibility for the user. An I2C host
interface is provided to allow enhanced configurations in addition to power-on default settings programmed by
pin-strapping resistors.
The TFP410 offers monitor detection through receiver detection, or hot-plug detection when I2C is enabled. The
monitor detection feature allows the user enhanced flexibility when attaching to digital displays or receivers (see
the Hot Plug/Unplug (Auto Connect/Disconnect Detection) section and the Register Maps section).
The TFP410 has a data de-skew feature allowing the users to de-skew the input data with respect to the IDCK±
(see the Data De-skew Feature section).

10 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated

Product Folder Links: TFP410

TFP410
www.ti.com SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014

7.2 Functional Block Diagram

IDCK± Universal Input T.M.D.S. Transmitter

DATA[23:0]
DE
12/24 Bit Data
VSYNC Encoder Serializer TX2±
I/F Format
HSYNC
VREF Serializer TX1±
Encoder
EDGE/HTPLG
DKEN
Encoder Serializer TX0±
MSEN
PD Control TXC±
ISEL/RST
CTL/A/DK[3:1]

BSEL/SCL I2C Slave I/F TFADJ

DSEL/SDA For DDC
1.8-V Regulators
With Bypass PLL
Capacitors

7.3 Feature Description

7.3.1 T.M.D.S. Pixel Data and Control Signal Encoding
For transition minimized differential signaling (T.M.D.S.), only one of two possible T.M.D.S. characters for a given
pixel is transmitted at a given time. The transmitter keeps a running count of the number of ones and zeros
previously sent and transmits the character that minimizes the number of transitions and approximates a dc
balance of the transmission line. Three T.M.D.S. channels are used to transmit RGB pixel data during the active
video interval (DE = High). These same three channels are also used to transmit HSYNC, VSYNC, and three
user definable control signals, CTL[3:1], during the inactive display or blanking interval (DE = Low). The following
table maps the transmitted output data to the appropriate T.M.D.S. output channel in a DVI-compliant system.

INPUT PINS TRANSMITTED PIXEL DATA

T.M.D.S. OUTPUT CHANNEL
(VALID FOR DE = High) ACTIVE DISPLAY (DE = High)
DATA[23:16] Channel 2 (TX2 ±) Red[7:0]
DATA[15:8] Channel 1 (TX1 ±) Green[7:0]
DATA[7:0] Channel 0 (TX0 ±) Blue[7:0]
INPUT PINS TRANSMITTED CONTROL DATA
T.M.D.S. OUTPUT CHANNEL
(VALID FOR DE = Low) BLANKING INTERVAL (DE = Low)
CTL3, CTL2 (1) Channel 2 (TX2 ±) CTL[3:2]
(1)
CTL1 Channel 1 (TX1 ±) CTL[1]
HSYNC, VSYNC Channel 0 (TX0 ±) HSYNC, VSYNC

(1) The TFP410 encodes and transfers the CTL[3:1] inputs during the vertical blanking interval. The CTL3 input is reserved for HDCP
compliant DVI TXs and the CTL[2:1] inputs are reserved for future use. When DE = high, CTL and SYNC pins must be held constant.

Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 11

Product Folder Links: TFP410
TFP410
SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014 www.ti.com

7.3.2 Universal Graphics Controller Interface Voltage Signal Levels

The universal graphics controller interface can operate in the following two distinct voltage modes:
• The high-swing mode where standard 3.3-V CMOS signaling levels are used.
• The low-swing mode where adjustable 1.1-V to 1.8-V signaling levels are used.
To select the high-swing mode, the VREF input pin must be tied to the 3.3-V power supply.
To select the low-swing mode, the VREF must be 0.55 to 0.95 V.
In the low-swing mode, VREF is used to set the midpoint of the adjustable signaling levels. The allowable range of
values for VREF is from 0.55 V to 0.9 V. The typical approach is to provide this from off chip by using a simple
voltage-divider circuit. The minimum allowable input signal swing in the low-swing mode is VREF ±0.2 V. In low-
swing mode, the VREF input is common to all differential input receivers.

7.3.3 Universal Graphics Controller Interface Clock Inputs

The universal graphics controller interface of the TFP410 supports both fully differential and single-ended clock
input modes. In the differential clock input mode, the universal graphics controller interface uses the crossover
point between the IDCK+ and IDCK− signals as the timing reference for latching incoming data (DATA[23:0], DE,
HSYNC, and VSYNC). Differential clock inputs provide greater common-mode noise rejection. The differential
clock input mode is only available in the low-swing mode. In the single-ended clock input mode, the IDCK+ input
(Pin 57) should be connected to the single-ended clock source and the IDCK− input (Pin 56) should be tied to
GND.
The universal graphics controller interface of the TFP410 provides selectable 12-bit dual-edge, and 24-bit single-
edge, input clocking modes. In the 12-bit dual-edge, the 12-bit data is latched on each edge of the input clock. In
the 24-bit single-edge mode, the 24-bit data is latched on the rising edge of the input clock when EDGE = 1 and
the falling edge of the input clock when EDGE = 0.
DKEN and DK[3:1] allow the user to compensate the skew between IDCK± and the pixel data and control
signals. See Table 10 for details.

7.4 Device Functional Modes

7.4.1 Universal Graphics Controller Interface Modes
Table 1 is a tabular representation of the different modes for the universal graphics controller interface. The 12-
bit mode is selected when BSEL=0 and the 24-bit mode when BSEL=1. The 12-bit mode uses dual-edge
clocking and the 24-bit mode uses single-edge clocking. The EDGE input is used to control the latching edge in
24-bit mode, or the primary latching edge in 12-bit mode. When EDGE=1, the data input is latched on the rising
edge of the input clock; and when EDGE=0, the data input is latched on the falling edge of the input clock. A fully
differential input clock is available only in the low-swing mode. Single-ended clocking is not recommended in the
low-swing mode as this decreases common-mode noise rejection.
Note that BSEL, DSEL, and EDGE are determined by register CTL_1_MODE when I2C is enabled (ISEL=1) and
by input pins when I2C is disabled (ISEL=0).

Table 1. Universal Graphics Controller Interface Options (Tabular Representation)

VREF BSEL EDGE DSEL BUS WIDTH LATCH MODE CLOCK EDGE CLOCK MODE
0.55 V − 0.9 V 0 0 0 12-bit Dual-edge Falling Differential (1) (2)
0.55 V − 0.9 V 0 0 1 12-bit Dual-edge Falling Single-ended
0.55 V – 0.9 V 0 1 0 12-bit Dual-edge Rising Differential (1) (2)
0.55 V − 0.9 V 0 1 1 12-bit Dual-edge Rising Single-ended
0.55 V – 0.9 V 1 0 0 24-bit Single-edge Falling Single-ended
0.55 V – 0.9 V 1 0 1 24-bit Single-edge Falling Differential (1) (3)
0.55 V – 0.9 V 1 1 0 24-bit Single-edge Rising Single-ended
0.55 V – 0.9 V 1 1 1 24-bit Single-edge Rising Differential (1) (3)

(1) The differential clock input mode is only available in the low signal swing mode (that is, VREF ≤ 0.9 V).
(2) The TFP410 does not support a 12-bit dual-clock, single-edge input clocking mode.
(3) The TFP410 does not support a 24-bit single-clock, dual-edge input clocking mode.
12 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated

Product Folder Links: TFP410

TFP410
www.ti.com SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014

Device Functional Modes (continued)

Table 1. Universal Graphics Controller Interface Options (Tabular Representation) (continued)
VREF BSEL EDGE DSEL BUS WIDTH LATCH MODE CLOCK EDGE CLOCK MODE
DVDD 0 0 X 12-bit Dual-edge Falling Single-ended (4)
DVDD 0 1 X 12-bit Dual-edge Rising Single-ended (4)
DVDD 1 0 X 24-bit Single-edge Falling Single-ended (4)
DVDD 1 1 X 24-bit Single-edge Rising Single-ended (4)

(4) In the high-swing mode (VREF = DVDD), DSEL is a don’t care; therefore, the device is always in the single-ended latch mode.

12-Bit, Dual-Edge Input Mode (BSEL = 0)

DE

L = Low Half Pixel

D[11:0] P0L P0H P1L P1H PN−1L PNL PNH PN+1L
H = High Half Pixel

DSEL=1
IDCK+ EDGE=0 Single-Ended
Clock Input
DSEL=1 Mode
IDCK+ EDGE=1

DSEL=0 Differential
{(IDCK+) − (IDCK−)} EDGE=0 Clock Input
Mode (Low
DSEL=0 Swing Only)
{(IDCK+) − (IDCK−)}
EDGE=1

First Latch Edge

Figure 7. Universal Graphics Controller Interface Options for 12-Bit Mode (Graphical Representation)

24-Bit, Single-Edge Input Mode (BSEL = 1)

DE

D[23:0] P0 P1 PN-1 PN

DSEL=0
IDCK+ EDGE=0 Single-Ended
Clock Input
DSEL=0 Mode
IDCK+ EDGE=1

DSEL=1 Differential
{(IDCK+) − (IDCK−)} EDGE=0 Clock Input
Mode (Low
DSEL=1 Swing Only)
{(IDCK+) − (IDCK−)}
EDGE=1

First Latch Edge

Figure 8. Universal Graphics Controller Interface Options for 24-Bit Mode (Graphical Representation)
Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Links: TFP410
TFP410
SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014 www.ti.com

Table 2. 12-Bit Mode Data Mapping

P0 P1 P2
PIN NAME P0L P0H P1L P1H P2L P2H
LOW HIGH LOW HIGH LOW HIGH
D11 G0[3] R0[7] G1[3] R1[7] G2[3] R2[7]
D10 G0[2] R0[6] G1[2] R1[6] G2[2] R2[6]
D9 G0[1] R0[5] G1[1] R1[5] G2[1] R2[5]
D8 G0[0] R0[4] G1[0] R1[4] G2[0] R2[4]
D7 B0[7] R0[3] B1[7] R1[3] B2[7] R2[3]
D6 B0[6] R0[2] B1[6] R1[2] B2[6] R2[2]
D5 B0[5] R0[1] B1[5] R1[1] B2[5] R2[1]
D4 B0[4] R0[0] B1[4] R1[0] B2[4] R2[0]
D3 B0[3] G0[7] B1[3] G1[7] B2[3] G2[7]
D2 B0[2] G0[6] B1[2] G1[6] B2[2] G2[6]
D1 B0[1] G0[5] B1[1] G1[5] B2[1] G2[5]
D0 B0[0] G0[4] B1[0] G1[4] B2[0] G2[4]

Table 3. 24-Bit Mode Data Mapping

PIN NAME P0 P1 P2 PIN NAME P0 P1 P2
D23 R0[7] R1[7] R2[7] D11 G0[3] G1[3] G2[3]
D22 R0[6] R1[6] R2[6] D10 G0[2] G1[2] G2[2]
D21 R0[5] R1[5] R2[5] D9 G0[1] G1[1] G2[1]
D20 R0[4] R1[4] R2[4] D8 G0[0] G1[0] G2[0]
D19 R0[3] R1[3] R2[3] D7 B0[7] B1[7] B2[7]
D18 R0[2] R1[2] R2[2] D6 B0[6] B1[6] B2[6]
D17 R0[1] R1[1] R2[1] D5 B0[5] B1[5] B2[5]
D16 R0[0] R1[0] R2[0] D4 B0[4] B1[4] B2[4]
D15 G0[7] G1[7] G2[7] D3 B0[3] B1[3] B2[3]
D14 G0[6] G1[6] G2[6] D2 B0[2] B1[2] B2[2]
D13 G0[5] G1[5] G2[5] D1 B0[1] B1[1] B2[1]
D12 G0[4] G1[4] G2[4] D0 B0[0] B1[0] B2[0]

7.4.2 Data De-skew Feature

The de-skew feature allows adjustment of the input setup/hold time. Specifically, the input data DATA[23:0] can
be latched slightly before or after the latching edge of the clock IDCK± depending on the amount of de-skew
desired. When de-skew enable (DKEN) is enabled, the amount of de-skew is programmable by setting the three
bits DK[3:1]. When disabled, a default de-skew setting is used. To allow maximum flexibility and ease of use,
DKEN and DK[3:1] are accessed directly through configuration pins when I2C is disabled, or through registers of
the same name when I2C is enabled. When using I2C mode, the DKEN pin should be tied to ground to avoid a
floating input.

14 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated

Product Folder Links: TFP410

TFP410
www.ti.com SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014

The input setup/hold time can be varied with respect to the input clock by an amount t(CD) given by the formula in
Equation 1.
t(CD) = (DK[3:1] – 4) × t(STEP)
where
• t(STEP) is the adjustment increment amount
• DK[3:1] is a number from 0 to 7 represented as a 3-bit binary number
• t(CD) is the cumulative de-skew amount (1)
(DK[3:1]-4) is simply a multiplier in the range {-4,-3,-2,-1, 0, 1, 2, 3} for t(STEP). Therefore, data can be latched in
increments from 4 times the value of t(STEP) before the latching edge of the clock to 3 times the value of t(STEP)
after the latching edge. Note that the input clock is not changed, only the time when data is latched with respect
to the clock.

DATA[23:0]

IDCK±

−t(CD) t(CD) −t(CD) t(CD)

DK[3:1] 000 100 111 000 100 111

t(CD) −4 × t(STEP) 0 3 × t(STEP) −4 × t(STEP) 0 3 × t(STEP)
Default Falling Default Rising

Figure 9. A Graphical Representation of the De-Skew Function

7.4.3 Hot Plug/Unplug (Auto Connect/Disconnect Detection)

TFP410 supports hot plug/unplug (auto connect/disconnect detection) for the DVI link. The receiver sense input
(RSEN) bit indicates if a DVI receiver is connected to TXC+ and TXC–. The HTPLG bit reflects the current state
of the HTPLG pin connected to the monitor via the DVI connector. When I2C is disabled (ISEL=0), the RSEN
value is available on the MSEN pin. When I2C is enabled, the connection status of the DVI link and HTPLG
sense pins are provided by the CTL_2_MODE register. The MSEL bits of the CTL_2_MODE register can be
used to program the MSEN to output the HTPLG value, the RSEN value, an interrupt, or be disabled.
The source of the interrupt event is selected by TSEL in the CTL_2_MODE register. An interrupt is generated by
a change in status of the selected signal. The interrupt status is indicated in the MDI bit of CTL_2_MODE and
can be output via the MSEN pin. The interrupt continues to be asserted until a 1 is written to the MDI bit,
resetting the bit back to 0. Writing 0 to the MDI bit has no effect.

7.4.4 Device Configuration and I2C RESET Description

The TFP410 device configuration can be programmed by several different methods to allow maximum flexibility
for the user’s application. Device configuration is controlled depending on the state of the ISEL/RST pin,
configuration pins (BSEL, DSEL, EDGE, VREF) and state pins (PD, DKEN). I2C bus select and I2C RESET (active
low) are shared functions on the ISEL/RST pin, which operates asynchronously.
Holding ISEL/RST low causes the device configuration to be set by the configuration pins (BSEL, DSEL, EDGE,
and VREF) and state pins (PD, DKEN). The I2C bus is disabled.
Holding ISEL/RST high causes the chip configuration to be set based on the configuration bits (BSEL, DSEL,
EDGE) and state bits (PD, DKEN) in the I2C registers. The I2C bus is enabled.
Momentarily bringing ISEL/RST low and then back high while the device is operating in normal or power-down
mode will RESET the I2C registers to their default values. The device configuration will be changed to the default
power-up state with I2C enabled. After power up, the device must be reset. It is suggested that this pin be tied to
the system reset signal, which is low during power up and is then asserted high after all the power supplies are
fully functional.

Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 15

Product Folder Links: TFP410
TFP410
SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014 www.ti.com

7.4.5 DE Generator
The TFP410 contains a DE generator that can be used to generate an internal DE signal when the original data
source does not provide one. There are several I2C programmable values that control the DE generator (see
Figure 10). DE_GEN in the DE_CTL register enables this function. When enabled, the DE pin is ignored.
DE_TOP and DE_LIN are line counts used to control the number of lines after VSYNC goes active that DE is
enabled, and the total number of lines that DE remains active, respectively. The polarity of VSYNC must be set
by VS_POL in the DE_CTL register.
DE_DLY and DE_CNT are pixel counts used to control the number of pixels after HSYNC goes active that DE is
enabled, and the total number of pixels that DE remains active, respectively. The polarity of HSYNC must be set
by HS_POL in the DE_CTL register.
The TFP410 also counts the total number of HSYNC pulses between VSYNC pulses, and the total number of
pixels between HSYNC pulses. These values, the total vertical and horizontal resolutions, are available in
V_RES and H_RES, respectively. These values are available at all times, whether or not the DE generator is
enabled.

Full Vertical Frame

DE_TOP

DE_DLY

DE_CNT V_RES

DE_LIN

Actual Display Area

H_RES

Figure 10. DE Generator Register Functions

16 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated

Product Folder Links: TFP410

TFP410
www.ti.com SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014

7.5 Programming
7.5.1 I2C interface
The I2C interface is used to access the internal TFP410 registers. This two-pin interface consists of the SCL
clock line and the SDA serial data line. The basic I2C access cycles are shown in Figure 11 and Figure 12.

SDA

SCL

Start Condition (S) Stop Condition (P)

Figure 11. I2C Start and Stop Conditions

The basic access write cycle consists of the following:

1. A start condition
2. A slave address cycle
3. A sub-address cycle
4. Any number of data cycles
5. A stop condition
The basic access read cycle consists of the following:
1. A start condition
2. A slave write address cycle
3. A sub-address cycle
4. A restart condition
5. A slave read address cycle
6. Any number of data cycles
7. A stop condition
The start and stop conditions are shown in Figure 11. The high to low transition of SDA while SCL is high defines
the start condition. The low to high transition of SDA while SCL is high defines the stop condition. Each cycle,
data or address, consists of 8 bits of serial data followed by one acknowledge bit generated by the receiving
device. Thus, each data/address cycle contains 9 bits as shown in Figure 12.
1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9
SCL

SDA

Slave Address Sub-Address Data Stop

2
Figure 12. I C Access Cycles

Following a start condition, each I2C device decodes the slave address. The TFP410 responds with an
acknowledge by pulling the SDA line low during the ninth clock cycle if it decodes the address as its address.
During subsequent sub-address and data cycles, the TFP410 responds with acknowledge as shown in
Figure 13. The sub-address is auto-incremented after each data cycle.

Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 17

Product Folder Links: TFP410
TFP410
SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014 www.ti.com

Programming (continued)
The transmitting device must not drive the SDA signal during the acknowledge cycle so that the receiving device
may drive the SDA signal low. The master indicates a not acknowledge condition (A) by keeping the SDA signal
high just before it asserts the stop condition (P). This sequence terminates a read cycle as shown in Figure 14.
The slave address consists of 7 bits of address along with 1 bit of read/write information (read = 1, write = 0) as
shown below in Figure 12 and Figure 13. For the TFP410, the selectable slave addresses (including the R/W bit)
using A[3:1] are 0x70, 0x72, 0x74, 0x76, 0x78, 0x7A, 0x7C, and 0x7E for write cycles and 0x71, 0x73, 0x75,
0x77, 0x79, 0x7B, 0x7D, and 0x7F for read cycles.

S Slave Address W A Sub-Address A Data A Data A P

Where:

From Master A Acknowledge

From Slave S Start condition
P Stop Condition

Figure 13. I2C Write Cycle

S Slave Address W A Sub-Address A Sr Slave Address R A Data A Data /A P

Where:

From Master A Acknowledge

From Slave S Start condition
/A Not acknowledge (SDA high) P Stop Condition
R Read Condition = 1 Sr Restart Condition
W Write Condition = 0

Figure 14. I2C Read Cycle

7.6 Register Maps

The TFP410 is a standard I2C slave device. All the registers can be written and read through the I2C interface
(unless otherwise specified). The TFP410 slave machine supports only byte read and write cycles. Page mode is
not supported. The 8-bit binary address of the I2C machine is 0111 A3A2A1X, where A[3:1] are pin
programmable or set to 000 by default. The I2C base address of the TFP410 is dependent on A[3:1] (pins 6, 7
and 8 respectively) as shown below.

WRITE ADDRESS READ ADDRESS

A[3:1]
(Hex) (Hex)
000 70 71
001 72 73
010 74 75
011 76 77
100 78 79
101 7A 7B
110 7C 7D
111 7E 7F

SUB-
REGISTER RW BIT7 BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 BIT0
ADDRESS
VEN_ID R 00 VEN_ID[7:0]
R 01 VEN_ID[15:8]
DEV_ID R 02 DEV_ID[7:0]
R 03 DEV_ID[15:8]

18 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated

Product Folder Links: TFP410

TFP410
www.ti.com SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014

SUB-
REGISTER RW BIT7 BIT6 BIT5 BIT4 BIT3 BIT2 BIT1 BIT0
ADDRESS
REV_ID R 04 REV_ID[7:0]
RESERVED R 05-07 Reserved
CTL_1_MODE RW 08 RSVD TDIS VEN HEN DSEL BSEL EDGE PD
CTL_2_MODE RW 09 VLOW MSEL TSEL RSEN HTPLG MDI
CTL_3_MODE RW 0A DK DKEN CTL RSVD
CFG RW 0B CFG
RESERVED RW 0C-31 Reserved
DE_DLY RW 32 DE_DLY[7:0]
DE_CTL RW 33 RSVD DE_GEN VS_POL HS_POL RSVD DE_DLY[8]
DE_TOP RW 34 RSVD DE_DLY[6:0]
RESERVED RW 35 Reserved
DE_CNT RW 36 DE_CNT[7:0]
RW 37 Reserved DE_CNT[10:8]
DE_LIN RW 38 DE_LIN[7:0]
RW 39 Reserved DE_LIN[10:8]
H_RES R 3A H_RES[7:0]
R 3B Reserved H_RES[10:8]
V_RES R 3C V_RES[7:0]
R 3D Reserved V_RES[10:8]
RESERVED R 3E−FF

7.6.1 VEN_ID Register (Sub-Address = 01−00 ) [reset = 0x014C]

Figure 15. VEN_ID Register
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
VEN_ID[15:8] VEN_ID[7:0]

Table 4. VEN_ID Field Descriptions

Bit Field Type Description
15:8 VEN_ID R These read-only registers contain the 16-bit Texas Instruments vendor ID. VEN_ID is
hardwired to 0x014C.
7:0 VEN_ID R

7.6.2 DEV_ID Register (Sub-Address = 03–02) [reset = 0x0410]

Figure 16. DEV_ID Register
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
DEV_ID[15:8] DEV_ID[7:0]

Table 5. DEV_ID Register Field Descriptions

Bit Field Type Description
15:8 DEV_ID R These read-only registers contain the 16-bit device ID for the TFP410. DEV_ID is
hardwired to 0x0410.
7:0 DEV_ID R

Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 19

Product Folder Links: TFP410
TFP410
SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014 www.ti.com

7.6.3 REV_ID Register (Sub-Address = 04) [reset = 0x00]

Figure 17. REV_ID Register
7 6 5 4 3 2 1 0
REV_ID[7:0]

Table 6. REV_ID Register Field Descriptions

Bit Field Type Description
7:0 REV_ID R This read-only register contains the revision ID.

7.6.4 Reserved Register (Sub-Address = 07–05) [reset = 0x641400]

Figure 18. Reserved
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
RESERVED[15:8] RESERVED[7:0]

Table 7. Reserved Field Descriptions

Bit Field Type Description
15:8 RESERVED Read Only —
7:0 RESERVED Read Only —

7.6.5 CTL_1_MODE (Sub-Address = 08) [reset = 0xFE]

Figure 19. CTL_1_MODE Register
7 6 5 4 3 2 1 0
RSVD TDIS VEN HEN DSEL BSEL EDGE PD

Table 8. CTL_1_MODE Field Descriptions

Bit Field Type Description
7 RSVD R/W Reserved
This read/write register contains the T.M.D.S. disable mode
6 TDIS R/W 0: T.M.D.S. circuitry enable state is determined by PD.
1: T.M.D.S. circuitry is disabled.
This read/write register contains the vertical sync enable mode.
5 VEN R/W 0: VSYNC input is transmitted as a fixed low
1: VSYNC input is transmitted in its original state
This read/write register contains the horizontal sync enable mode.
4 HEN R/W 0: HSYNC input is transmitted as a fixed low
1: HSYNC input is transmitted in its original state
This read/write register is used in combination with BSEL and VREF to select the
3 DSEL R/W single-ended or differential input clock mode. In the high-swing mode, DSEL is a
don’t care because IDCK is always single-ended.
This read/write register contains the input bus select mode.
2 BSEL R/W 0: 12-bit operation with dual-edge clock
1: 24-bit operation with single-edge clock
This read/write register contains the edge select mode.
1 EDGE R/W 0: Input data latches to the falling edge of IDCK+
1: Input data latches to the rising edge of IDCK+
This read/write register contains the power-down mode.
0 PD R/W 0: Power down (default after RESET)
1: Normal operation

20 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated

Product Folder Links: TFP410

TFP410
www.ti.com SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014

7.6.6 CTL_2_MODE Register (Sub-Address = 09) [reset = 0x00]

Figure 20. CTL_2_MODE Register
7 6 5 4 3 2 1 0
VLOW MSEL[3:1] TSEL RSEN HTPLG MDI

Table 9. CTL_2_MODE Field Descriptions

Bit Field Type Description
This read only register indicates the VREF input level.
7 VLOW R/W 0: This bit is a logic level (0) if the VREF analog input selects high-swing inputs
1: This bit is a logic level (1) if the VREF analog input selects low-swing inputs
This read/write register contains the source select of the monitor sense output pin.
000: Disabled. MSEN output high
6:4 MSEL[3:1] R/W 001: Outputs the MDI bit (interrupt)
010: Outputs the RSEN bit (receiver detect)
011: Outputs the HTPLG bit (hot plug detect)
This read/write register contains the interrupt generation source select.
3 TSEL R/W 0: Interrupt bit (MDI) is generated by monitoring RSEN
1: Interrupt bit (MDI) is generated by monitoring HTPLG
This read only register contains the receiver sense input logic state, which is valid
only for dc-coupled systems.
2 RSEN R/W 0: A powered-on receiver is not detected
1: A powered-on receiver is detected (that is, connected to the DVI transmitter
outputs)
This read only register contains the hot plug detection input logic state.
1 HTPLG R/W 0: Logic level detected on the EDGE/HTPLG pin (pin 9)
1: High level detected on the EDGE/HTPLG pin (pin 9)
This read/write register contains the monitor detect interrupt mode.
0 MDI R/W 0: Detected logic level change in detection signal (to clear, write one to this bit)
1: Logic level remains the same

7.6.7 CTL_3_MODE Register (Sub-Address = 0A) [reset = 0x80]

Figure 21. CTL_3_MODE Register
7 6 5 4 3 2 1 0
DK[3:1] DKEN CTL[3:1] RSVD

Table 10. CTL_3_MODE Register Field Descriptions

Bit Field Type Description
This read/write register contains the de-skew setting, each increment adjusts the
skew by t(STEP).
000: Step 1 (minimum setup/maximum hold)
001: Step 2
010: Step 3
7:5 DK[3:1] RW
011: Step 4
100: Step 5 (default)
101: Step 6
110: Step 7
111: Step 8 (maximum setup/minimum hold)
This read/write register controls the data de-skew enable.
4 DKEN RW 0: Data de-skew is disabled, the values in DK[3:1] are not used
1: Data de-skew is enabled, the de-skew setting is controlled through DK[3:1]
This read/write register contains the values of the three CTL[3:1] bits that are
3:1 CTL[3:1] RW
output on the DVI port during the blanking interval.
0 RSVD RW —

Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 21

Product Folder Links: TFP410
TFP410
SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014 www.ti.com

7.6.8 CFG Register (Sub-Address = 0B)

Figure 22. CFG Register
7 6 5 4 3 2 1 0
CFG[7:0]

Table 11. CFG Register Field Descriptions

Bit Field Type Description
This read-only register contains the state of the inputs D[23:16]. These pins can
7:0 (D[23:16]) CFG Read Only be used to provide the user with selectable configuration data through the I2C
bus.

7.6.9 RESERVED Register (Sub-Address = 0E–0C) [reset = 0x97D0A9]

Figure 23. RESERVED Register
7 6 5 4 3 2 1 0
RESERVED

Table 12. RESERVED Register Field Descriptions

Bit Field Type Description
7:0 RESERVED R/W —

7.6.10 DE_DLY Register (Sub-Address = 32) [reset = 0x00]

Figure 24. DE_DLY Register
7 6 5 4 3 2 1 0
DE_DLY[7:0]

Table 13. DE_DLY Field Descriptions

Bit Field Type Description
7:0 DE_DLY R/W This read/write register defines the number of pixels after HSYNC goes active
that DE is generated, when the DE generator is enabled.

7.6.11 DE_CTL Register (Sub-Address = 33) [reset = 0x00]

Figure 25. DE_CTL Register
7 6 5 4 3 2 1 0
Reserved DE_GEN VS_POL HS_POL Reserved DE_DLY[8]

Table 14. DE_CTL Register Field Descriptions

Bit Field Type Description
7 Reserved R/W —
This read/write register enables the internal DE generator.
6 DE_GEN R/W 0: DE generator is disabled. Signal required on DE pin
1: DE generator is enabled. DE pin is ignored.
This read/write register sets the VSYNC polarity.
0: VSYNC is considered active low.
5 VS_POL R/W
1: VSYNC is considered active high.
Line counts are reset on the VSYNC active edge.
This read/write register sets the HSYNC polarity.
4 HS_POL R/W 0: HSYNC is considered active low.
1: HSYNC is considered active high. Pixel counts are reset on the HSYNC active edge.
1:3 Reserved R/W —
0 DE_DLY[8] R/W This read/write register contains the top bit of DE_DLY.

22 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated

Product Folder Links: TFP410

TFP410
www.ti.com SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014

7.6.12 DE_TOP Register (Sub-Address = 34) [reset = 0x00]

Figure 26. DE_TOP Register
7 6 5 4 3 2 1 0
DE_TOP[7:0]

Table 15. DE_TOP Register Field Descriptions

Bit Field Type Description
This read/write register defines the number of pixels after VSYNC goes active
7:0 DE_TOP R/W
that DE is generated, when the DE generator is enabled.

7.6.13 DE_CNT Register (Sub-Address = 37–36) [reset = 0x0000]

Figure 27. DE_CNT Register
7 6 5 4 3 2 1 0
DE_CNT[7:0]
Reserved DE_CNT[10:8]

Table 16. DE_CNT Register Field Descriptions

Bit Field Type Description
10:8 DE_CNT R/W These read/write registers define the width of the active display, in pixels, when the
7:0 DE_CNT R/W DE generator is enabled.

7.6.14 DE_LIN Register (Sub-Address = 39–38) [reset = 0x0000]

Figure 28. DE_LIN Register
7 6 5 4 3 2 1 0
DE_LIN[7:0]
Reserved DE_LIN[10:8]

Table 17. DE_LIN Register Field Descriptions

Bit Field Type Description
10:8 DE_LIN R/W These read/write registers define the height of the active display, in lines, when the
7:0 DE_LIN R/W DE generator is enabled.

7.6.15 H_RES Register (Sub-Address = 3B−3A)

Figure 29. H_RES Register
7 6 5 4 3 2 1 0
H_RES[7:0]
Reserved H_RES[10:8]

Table 18. H_RES Register Field Descriptions

Bit Field Type Description
10:8 H_RES Read Only These read-only registers return the number of pixels between consecutive
7:0 H_RES Read Only HSYNC pulses.

Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 23

Product Folder Links: TFP410
TFP410
SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014 www.ti.com

7.6.16 V_RES Register (Sub-Address = 3D−3C)

Figure 30. V_RES Register
7 6 5 4 3 2 1 0
V_RES[7:0]
Reserved V_RES[10:8]

Table 19. V_RES Register Field Descriptions

Bit Field Type Description
10:8 V_RES Read Only These read-only registers return the number of lines between consecutive
7:0 V_RES Read Only VSYNC pulses.

24 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated

Product Folder Links: TFP410

TFP410
www.ti.com SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014

8 Application and Implementation

NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.

8.1 Application Information

The TFP401 is a DVI (Digital Visual Interface) compliant digital receiver that is used in digital flat panel display
systems to receive and decode T.M.D.S. encoded RGB pixel data streams. In a digital display system a host,
usually a PC or workstation, contains a DVI compliant transmitter that receives 24 bit pixel data along with
appropriate control signals and encodes them into a high-speed, low voltage differential serial bit stream fit for
transmission over a twisted-pair cable to a display device. The display device, usually a flat-panel monitor, will
require a DVI compliant receiver like the TI TFP401 to decode the serial bit stream back to the same 24-bit pixel
data and control signals that originated at the host. This decoded data can then be applied directly to the flat
panel drive circuitry to produce an image on the display. Because the host and display can be separated by
distances up to 5 meters or more, serial transmission of the pixel data is preferred. The TFP401 will support
resolutions up to UXGA.

8.2 Typical Application

Figure 31. Typical Application for the TFP410 Device

8.2.1 Design Requirements

PARAMETER VALUE
Power supply 3.3 V dc at 1 A
Input clock Single-ended
Input clock frequency range 25 MHz — 165 MHz
Output format 24 bits/pixel
Input clock latching Rising edge
I2C EEPROM support No
De-skew No

Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 25

Product Folder Links: TFP410
TFP410
SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014 www.ti.com

8.2.2 Detailed Design Procedure

8.2.2.1 Data and Control Signals

The trace length of data and control signals out of the receiver should be kept as close to equal as possible.
Trace separation should be approximately 5 times the height. As a general rule, traces also should be less than
2.8” if possible (longer traces can be acceptable).
Delay = 85 × SQRT × er
where
• er = 4.35; relative permativity of 50% resin FR-4 @ 1 GHz
• Delay = 177 pS/in (2)
Length of rising edge = Tr(ps) / Delay; Tr = 3 ns
where
• = 3000 ps / 177 ps per inch
• = 16.9 inches (3)
Length of rising edge / 6 = Max length of trace for lumped circuit. (4)
16.9 / 6 = 2.8 inches (5)

Figure 32. Data Signals

8.2.2.2 Configuration Options

The TFP410 can be configured in several modes depending on the required input format, for example 1
byte/clock, 2 bytes/clock, falling/rinsing clock edge.
Refer to Table 1 for more information about configuration options.

26 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated

Product Folder Links: TFP410

TFP410
www.ti.com SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014

8.2.2.3 Power Supplies Decoupling

Digital, analog, and PLL supplies must be decoupled from each other to avoid electrical noise on the PLL and the
core.

Figure 33. Power Decoupling

8.2.3 Application Curves

Sometimes the Panel does not support the same format as the GPU (graphics processor unit). In these cases
the user must decide how to connect the unused bits.
Figure 34 and Figure 35 show the mismatches between the 18-bit GPU and a 24-bit LCD where “x” and “y”
represent the 2 LSB of the Panel.

260 260
240 B2 B1 = GND, B0=1 240 x=GND, y=1
B2 B1 B0 = B7 B6 B5 x=B7, y=B6
220 220
200 200
180 180
Pixel Value (dec)
Pixel Value (dec)

160 160
140 140
120 120
100 100
80 80
60 60
40 40
20 20
0 0
0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 0 4 8 12 16 20 24 28 32 36 40 44 48 52 56 60 64
Pixel samples D001
Pixel samples D002
Figure 34. 16b GPU to 24b LCD Figure 35. 18b GPU to 24b LCD

Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 27

Product Folder Links: TFP410
TFP410
SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014 www.ti.com

9 Power Supply Recommendations

Use solid ground planes. Tie ground planes together with as many vias as is practical. This will provide a
desirable return path for current. Each supply should be on separate split power planes, where each power plane
should be as large an area as possible. Connect PanelBus receiver power and ground pins and all bypass caps
to appropriate power or ground plane with via. Vias should be as fat and short as practical, the goal is to
minimize the inductance.

9.1 DVDD
Place one 0.01-µF capacitor as close as possible between each DVDD device pins and ground. A 22-µF
tantalum capacitor should be placed between the supply and 0.01-µF capacitors. A ferrite bead should be used
between the source and the 22-µF capacitor.

9.2 TVDD
Place one 0.01-µF capacitor as close as possible between each TVDD device pins and ground. A 22-µF
tantalum capacitor should be placed between the supply and 0.01-µF capacitors. A ferrite bead should be used
between the source and the 22-µF capacitor.

9.3 PVDD
Place three 0.01-µF capacitors in parallel as close as possible between the PVDD device pin and ground. A
22-µF tantalum capacitor should be placed between the supply and 0.01-µF capacitors. A ferrite bead should be
used between the source and the 22-µF capacitor.

28 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated

Product Folder Links: TFP410

TFP410
www.ti.com SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014

10 Layout

10.1 Layout Guidelines

10.1.1 Layer Stack

The pinout of Texas Instruments' High Speed Interface (HSI) devices features differential signal pairs and the
remaining signals comprise the supply rails, VCC and ground, and lower-speed signals, such as control pins. As
an example, consider a device X which is a repeater/re-driver, so both inputs and outputs are high-speed
differential signals. These guidelines can be applied to other high-speed devices such as drivers, receivers,
multiplexers, and so on.
A minimum of four layers is required to accomplish a low-EMI PCB design. Layer stacking should be in the
following order (top-to-bottom): high-speed differential signal layer, ground plane, power plane and control signal
layer.

Figure 36. PCB Stack Up

10.1.2 Routing High-Speed Differential Signal Traces

(RxC-, RxC+, Rx0-, Rx0+, Rx1-, Rx1+, Rx2-, Rx2+)
Trace impedance should be controlled for optimal performance. Each differential pair should be equal in length
and symmetrical and should have equal impedance to ground with a trace separation of 2 times to 4 times the
height. A differential trace separation of 4 times the height yields about 6% cross-talk (6% effect on impedance).
We recommend that differential trace routing should be side-by-side, though it is not important that the differential
traces be tightly coupled together, because tight coupling is not achievable on PCB traces. Typical ratios on
PCBs are only 20% to 50%; 99.9% is the value of a well balanced twisted pair cable. Each differential trace
should be as short as possible (< 2 inches is preferable) with no 90° angles. These high-speed transmission
traces should be on layer 1, which is the top layer.
RxC-, RxC+, Rx0-, Rx0+, Rx1-, Rx1+, Rx2-, Rx2+ signals all route directly from the DVI connector pins to the
device, no external components are needed.

10.1.3 DVI Connector

Clear-out holes for connector pins should leave space between pins to allow continuous ground through the pin
field. Allow enough spacing in ground plane around signal pins vias however, keep enough copper between vias
to allow for ground current to flow between the vias. Avoid creating a large ground plane slot around the entire
connector, because minimizing the via capacitance is the goal.

Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 29

Product Folder Links: TFP410
TFP410
SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014 www.ti.com

10.2 Layout Example

DVI connector trace matching is shown in Figure 37.

Figure 37. DVI Signal Routing

Keep the data lines as far as possible from each other as shown in Figure 38.

30 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated

Product Folder Links: TFP410

TFP410
www.ti.com SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014

Layout Example (continued)

Figure 38. Data Signal Routing

Connect the thermal pad to ground as shown in Figure 39.

Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 31

Product Folder Links: TFP410
TFP410
SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014 www.ti.com

Layout Example (continued)

Figure 39. Ground Routing

32 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated

Product Folder Links: TFP410

TFP410
www.ti.com SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014

10.3 TI PowerPAD 64-Pin HTQFP Package

The TFP410 is available in TI’s thermally enhanced 64-pin TQFP PowerPAD package. The PowerPAD package
is a 10-mm × 10-mm × 1.0-mm TQFP outline with 0,5 mm lead-pitch. The PowerPAD package has a specially
designed die mount pad that offers improved thermal capability over typical TQFP packages of the same outline.
The TI 64-pin TQFP PowerPAD package offers a backside solder plane that connects directly to the die mount
pad for enhanced thermal conduction. For thermal considerations, soldering the backside of the TFP410 to the
application board is not required because the device power dissipation is well within the package capability when
not soldered.
Soldering the backside of the device to the PCB ground plane is recommended for electrical considerations.
Because the die pad is electrically connected to the chip substrate and hence chip ground, connecting the back
side of the PowerPAD package to a PCG ground plane provides a low-inductance, low-impedance connection to
help improve EMI, ground bounce, and power supply noise performance.
Table 20 contains the thermal properties of the TI 64-pin TQFP PowerPAD package. The 64-pin TQFP non-
PowerPAD package is included only for reference.

Table 20. TI 64-Pin TQFP (10-mm × 10-mm × 1.0-mm) / 0.5-mm Lead-Pitch

PowerPAD™ PowerPAD™
WITHOUT
PARAMETER NOT CONNECTED TO CONNECTED TO PCB
PowerPAD™
PCB THERMAL PLANE THERMAL PLANE (1)
RθJA Thermal resistance, junction-to-ambient (1) (2) 75.83°C/W 42.20°C/W 21.47°C/W
(1) (2)
RθJC Thermal resistance, junction-to-case 7.80°/W 0.38°C/W 0.38°C/W
Power handling capabilities of package
PD (1) (2) (3) 0.92 W 1.66 W 3.26 W

(1) Specified with the PowerPAD bond pad on the backside of the package soldered to a 2-oz. Cu plate PCB thermal plane.
(2) Airflow is at 0 LFM (no airflow)
(3) Specified at 150°C junction temperature and 80°C ambient temperature.

Copyright © 2001–2014, Texas Instruments Incorporated Submit Documentation Feedback 33

Product Folder Links: TFP410
TFP410
SLDS145C – OCTOBER 2001 – REVISED DECEMBER 2014 www.ti.com

11 Device and Documentation Support

11.1 Trademarks
PowerPAD, EPIC-5, PanelBus are trademarks of Texas Instruments.
Intel is a trademark of Intel Corporation.
All other trademarks are the property of their respective owners.
11.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.

11.3 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

34 Submit Documentation Feedback Copyright © 2001–2014, Texas Instruments Incorporated

Product Folder Links: TFP410

PACKAGE OPTION ADDENDUM

www.ti.com 22-Jan-2015

PACKAGING INFORMATION

Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)

TFP410PAP ACTIVE HTQFP PAP 64 160 Green (RoHS CU NIPDAU Level-3-260C-168 HR 0 to 70 TFP410PAP
& no Sb/Br)
TFP410PAPG4 ACTIVE HTQFP PAP 64 160 Green (RoHS CU NIPDAU Level-3-260C-168 HR 0 to 70 TFP410PAP
& no Sb/Br)

(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.

(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)

(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.

(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

Addendum-Page 1
PACKAGE OPTION ADDENDUM

www.ti.com 22-Jan-2015

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF TFP410 :

• Enhanced Product: TFP410-EP

NOTE: Qualified Version Definitions:

• Enhanced Product - Supports Defense, Aerospace and Medical Applications

Addendum-Page 2
www.ti.com
IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated