Over at benchlife they posted an unboxing of the MSI GeForce RTX 5080 16G Suprim SOC. The graphics card features a large cooling system with dimensions of 359 x 150 x 76 mm and is designed as a 4-slot card. Its size can be attributed to the use of a similar cooling module found in the GeForce RTX 5090, which demands a larger system. The octagonal geometric style and hairline metal top cover design replicate the aesthetics of previous generations. There are two sets of LED lights on the front in contrast to the three found on earlier models, indicating a design simplification. This model uses MSI’s newly introduced StormForce Fan technology, which replaces the previous TORX FAN 5.0.
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Intel Corporation's stock experienced a notable increase of approximately 9% amid emerging speculation regarding a potential acquisition by an undisclosed buyer. This development surfaced from a report by Charlie Demerjian, founder of the news portal SemiAccurate, who indicated that he had obtained an email that outlined intentions to acquire the company. Although the name of the interested party was not disclosed, the implications of such a move are significant given Intel's current market challenges. The recent rise in stock price reflects investor optimism and market responsiveness to these rumors while the underlying acquisition details remain unconfirmed.
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The new PlayStation console is expected to use an AMD Zen 5-based system with 3D V-Cache technology. According to reports, Sony is planning to build the PlayStation 6 around AMD's latest technologies. This includes a combination of Zen 5 CPU cores, more extensive cache memory, and a new GPU architecture known as UDNA. This GPU is an updated version of the RDNA series used in current Radeon RX 9000 GPUs. By using 3D V-Cache technology, the console could see significant improvements in performance, particularly in speed and responsiveness. This approach has been successful in AMD's Ryzen X3D series processors, which show better loading times and improved performance in demanding games due to the increased cache size.
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NVIDIA plans to release its new GeForce RTX 5090 and 5080 graphics cards, yet reports suggest that availability at launch will be very restricted. The company has set particular criteria to determine which regions and suppliers will receive the new Blackwell series GPUs first. This strategy could affect large distributors and retailers by limiting the number of units they can access, thereby impacting the global supply chain. The high demand for these advanced GPUs will likely strain the distribution network, making it challenging for many potential buyers to secure a unit immediately upon release.
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The recent unboxing of the ASUS Radeon RX 9070 XT TUF Gaming GPU indicates potential immediate availability at retail stores. The information emerged from an unboxing video purportedly posted on Instagram by Artline, which has since been deleted. This action has led to speculation that the GPU might reach consumers earlier than AMD’s official timeline. The event has sparked discussions around the RDNA 4 architecture, as the product appears to be on-hand at retailers, potentially weeks before its official release.
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Samsung Electronics has announced a technical collaboration with Nexon Korea and Neople to deliver a new level of 3D gaming experience in the upcoming title, 'The First Berserker: Khazan.' This partnership focuses on integrating specialized 3D elements into the game, leveraging Samsung’s technological expertise and the capabilities of the Odyssey 3D monitor. The development team is working on customizing the game’s 3D visuals with precision by adjusting character compositions, background elements, and cinematic sequences. This methodical approach ensures that the graphical enhancements align with the technical requirements of modern hardware, offering players a consistent and immersive visual experience. The partnership demonstrates a blend of software optimization and hardware utilization, where each 3D effect is tailored during development to suit the display capabilities, reducing visual artifacts and enhancing clarity.
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The upcoming AMD Threadripper 9000 "Shimada Peak" processor series, which has not yet been officially announced, appears to be detailed in new shipping manifest leaks. Data analyzed by investigator Everest/Olrak_29 from NBD indicates a lineup based on the Zen 5 architecture that may feature models with 16, 32, 64, and 96 cores. Previously, the only widely known information pertained to 16-core and 96-core models, but these new details expand the potential range, pointing to a more comprehensive lineup. Despite the lack of an official statement from AMD, these revelations suggest that AMD is continuing to develop its HEDT offerings, likely building upon its current Threadripper 7000 "Storm Peak" architecture to create successors with similar fundamental designs and performance targets.
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Lexar has released the PLAY PRO microSD Express memory card, which uses PCIe 3.0 and NVMe 1.3 interface protocols. This card adheres to the microSD Express standard and differs from traditional TF storage cards due to its distinct interface. On compatible devices, the card achieves a peak sequential read speed of up to 985 MB/s and a peak sequential write speed of up to 600 MB/s.
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Thermal Grizzly Duronaut thermal paste offers a composition crafted to deliver reliable long-term performance and efficient heat transfer. It combines aluminium microparticles with zinc oxide nanoparticles suspended in a specially formulated silicone oil. By selecting and optimizing the size and shape of these particles, the thermal paste achieves enhanced adhesion and can be applied in very thin layers. This precise formulation minimizes the risk of the paste separating from the contact surface over time, a common issue known as the "pump-out effect." The result is a consistent thermal interface that maintains low thermal resistance from CPU to cooler, ensuring stable performance throughout its lifespan.
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Microsoft has revised its recent decision regarding the free upgrade offer from Windows 10 to Windows 11. The company removed a blog post from its Tech Community that implied a potential time limit for the upgrade, citing inaccuracies and a misleading headline as reasons for the withdrawal. According to Microsoft, the free upgrade program remains unchanged, and there are no new restrictions on the upgrade process. This decision reinforces the existing policy that allows users to transition from Windows 10 to Windows 11 without financial obligations. The reversal of the earlier position appears to be aimed at minimizing confusion and ensuring that users receive correct information about their upgrade options.
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AI-based upscaling solutions such as NVIDIA’s Deep Learning Super Sampling (DLSS), AMD’s FidelityFX Super Resolution (FSR), and Intel’s Xe Super Sampling (XeSS) have become integral tools in the modern gaming landscape. These technologies are engineered to improve graphical fidelity and frame rates, even on hardware that may not be the most powerful. By utilizing AI and machine learning techniques, these upscaling solutions render games at a lower resolution and then upscale them to meet higher resolution targets. This method helps achieve smoother gameplay without the need for high-end GPUs. The usefulness of these approaches has been validated by user adoption; for instance, during an NVIDIA event, data indicated that more than 80% of GeForce RTX users are already employing DLSS technology in their gaming setups.
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Nvidia's latest GPUs, the RTX 5090 and RTX 5080, have been closely examined for their L1 and L2 cache configurations, as well as memory enhancements. According to recent reports by Tom's Hardware, the L1 cache size per Streaming Multiprocessor (SM) in both the RTX 5090 and RTX 5080 remains unchanged from the previous generation. For the RTX 5090, each SM on the GB202 chip is equipped with a 128KB L1 cache, identical to the AD102 chip found in the RTX 4090. With a total of 170 SM units, this results in a cumulative L1 cache of 21.25MB. The RTX 4090, by comparison, contains 128 SM units, yielding a total of 16MB L1 cache. Similarly, the RTX 5080 maintains a comparable setup to the RTX 4080. The minor difference in SM count between the two results in the RTX 5080 possessing a slightly larger aggregate L1 cache of 10.5MB compared to the RTX 4080's 10MB. The L2 cache in the RTX 5090 sees a significant upgrade, rising to 96MB, which marks a 33% increase from the RTX 4090's 72MB.
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Jonsbo has recently announced the launch of two ultra-compact Mini-ITX cases, the N10 and NV10, which are designed to support a variety of hardware configurations within a very limited space. These new chassis have a three-dimensional size of 205×205×108 mm, resulting in a compact volume of only 4.54 liters. Despite their small size, they are engineered to support either four hard drives or half-height graphics cards, depending on the chosen model. The cases can be oriented both vertically and horizontally, providing flexibility in placement and system design. With careful consideration for thermal management, the cases also incorporate design features that allow for efficient airflow, which is essential given the limited space inside.
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AMD is planning to develop its next-generation CCD, implementing the Zen 6 microarchitecture, using TSMC’s 3nm N3E process node. This development follows discussions on technical forums about AMD’s strategic roadmap. The new Zen 6 CCD is expected to take advantage of the TSMC N3E node, which delivers a 20% increase in speed, over 30% reduction in power consumption, and approximately a 60% increase in logic density compared to the existing TSMC N5. The N3E node employs extreme ultraviolet (EUV) double-patterning techniques to achieve these improvements. In parallel, AMD is rumored to update its I/O dies by constructing them on a 4nm node, likely using TSMC’s N4C technology. The transition from a 6nm to a 4nm node for the I/O die allows for higher performance and more advanced features in future processors.
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This move marks the introduction of the RX 9000 series within PowerColor's lineup of AMD-based graphics cards. The product page provides a series of promotional images, but no detailed technical specifications have been shared, likely due to existing non-disclosure agreements surrounding the RDNA 4 architecture. The images suggest a focus on design aspects, particularly the distinctive red elements associated with the "Red Devil" branding. Additionally, the page hints at the possibility of a limited edition release, which may include special packaging and bundled accessories. 
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MONTECH Heritage PC case series integrates high quality leather and metal components with practical features including a suitcase style handle for portability. Aimed at technical users, this case maintains a compact design that supports a range of cooling options. Its structure includes support for top radiators up to 360 mm, 170 mm air coolers and up to eight fans, permitting high-performance configurations while conserving space. The elongated feet design provides increased stability for heavy components. The Heritage PRO variant includes four pre-installed GF 120 fans and a replaceable handle connection for added utility.
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It's not confirmed by AMD, but we can confirm that things are awfully quiet on their end. AMD’s planned launch for the Radeon RX 9070 XT and Radeon RX 9070 graphics cards seems to have been delayed. Originally expected on January 23, the launch is now scheduled for some time after the Chinese Spring Festival, according to a report from the Chiphell forum. The shift in schedule has introduced uncertainty into the timeline for consumers and partners, as no new specific release date has been confirmed. This uncertainty points to possible strategic considerations or logistical challenges that AMD faces as it approaches the launch of these new models.
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G.Skill has released a DDR5 memory kit with 96 GB total capacity in a 2x 48 GB configuration. The kit operates at DDR5-6400 speed with a CAS latency of CL30 and secondary timings of 39-39-102. The modules are part of the Trident Z5 series, supporting the Intel XMP 3.0 overclocking profile for simplified configuration in compatible systems. This technical update details the kit’s intended use in environments requiring large memory capacities and low latency, such as high-performance workstations and gaming systems. It emphasizes the systematic approach taken in developing these modules for compatibility with various motherboards and processors, including both Intel and AMD platforms.
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AMD Radeon RX 9070 XT and RX 9070 custom models have unexpectedly appeared in European inventory ahead of scheduled release dates. Industry professionals reported these findings after evidence emerged from a prominent subreddit, where photographs showed sealed Sapphire Pulse models in an Israeli computer store's stockroom. The documentation of these graphics cards suggests that AMD partners may be ahead in distributing units compared to earlier projections. Such early listings have implications for scheduled marketing campaigns, particularly for Sapphire, whose promotional efforts experienced disruptions with the unanticipated visibility of these boxed units.
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The upcoming release of the GEEKOM A6 mini PC on January 17th, 2025, is positioned as a compact yet powerful computing solution priced around $449. Featuring a ventilated aluminum casing that measures 0.47 liters, the A6 merges a small footprint with advanced hardware components such as a robust AMD Ryzen 7 6800H processor, high-bandwidth DDR5 memory, and a rapid PCIe Gen 4 SSD. Currently available for pre-order through GEEKOM's official sales channels, the A6 aims to serve users who require efficient performance in a space-saving design, tailored towards intensive computing tasks without compromising on processing speed or multitasking ability.
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