Next-generation lithography or NGL is a term used in integrated circuit manufacturing to describe the lithography technologies slated to replace photolithography. As of 2009 the most advanced form of photolithography is immersion lithography, in which water is used as an immersion medium for the final lens. It is being applied to the 45 nm and 32 nm nodes. Several companies, including IBM, Intel and TSMC, have prepared for the continued use of current lithography, using double patterning, for the 22 nm and 16 nm nodes, and extending double patterning beyond 10 nm.
Candidates for next-generation lithography include: extreme ultraviolet lithography (EUV-lithography), X-ray lithography, electron beam lithography, focused ion beam lithography, and nanoimprint lithography. Electron beam lithography was most popular during the 1970s, but was replaced in popularity by X-ray lithography during the 1980s and early 1990s, and then by EUV lithography from the mid-1990s to the mid-2000s. Focused ion beam lithography has carved a niche for itself in the area of defect repair. Nanoimprint's popularity is rising, and is positioned to succeed EUV as the most popular choice for next-generation lithography, due to its inherent simplicity and low cost of operation as well as its success in the LED, hard disk drive and microfluidics sectors.
The Boeing 737 Next Generation, commonly abbreviated as 737NG, is the name given to the −600/-700/-800/-900 series of the Boeing 737 airliner. It is the third generation derivative of the 737, and follows the 737 Classic (−300/-400/-500) series, which began production in the 1980s. They are short- to medium-range, narrow-bodyjet airliners. Produced since 1996 by Boeing Commercial Airplanes, the 737NG series includes four variants and can seat between 110 to 210 passengers.
A total of 5,419 737NG aircraft have been delivered by the end of May 2015, with more than 6,800 ordered. The -700, -800, and -900ER have unfilled orders and are being produced, but orders for -600 and -900 have been filled. The 737NG's primary competition is with the Airbus A320 family. Upgraded and re-engined models in development as the 737 MAX series will eventually supplant the 737NG.
Design and development
Background
Prompted by the development of the Airbus A320, which incorporated ground-breaking technologies such as fly-by-wire, in 1991 Boeing initiated development of an updated series of aircraft. After working with potential customers, the 737 Next Generation (NG) program was announced on November 17, 1993. The 737NG encompasses the −600, −700, −800 and −900 variants, and is to date the most significant upgrade of the airframe. The performance of the 737NG is essentially that of a new airplane, but important commonality is retained from previous 737 generations. The wing was modified, increasing its area by 25% and span by 16ft (4.88m), which increased the total fuel capacity by 30%. New quieter and more fuel-efficient CFM56-7B engines were used. These improvements combine to increase the 737's range by 900nmi, permitting transcontinental service. A flight test program was operated by 10 aircraft: 3 -600s, 4 -700s, and 3 -800s.
Next Generation (also known as NextGen) was a video game magazine that was made by Imagine Media publishing company (now Future Network USA). It was affiliated to and shared editorial with the UK's Edge magazine. Next Generation ran from January 1995 until January 2002. It was published by Jonathan Simpson-Bint and edited by Neil West. Other editors included Chris Charla, Tom Russo, and Blake Fischer. Unlike its competitors GamePro and Electronic Gaming Monthly, Next Generation was directed towards a different readership by focusing on the industry itself rather than individual games.
Publication history
Next Generation was first published prior to the North American launch of the Sega Saturn and Sony PlayStation, and much of the early content was in anticipation of those systems.
The magazine was first published by GP Publications up until May 1995 when the publisher was acquired by Imagine Media.
In September 1999, Next Generation was redesigned, its cover name shortened to simply NextGen. This would start what was known as "Lifecycle 2" of the magazine. A year later, in September 2000, the magazine's width was increased from its standard 8inches to 9inches, however this wider format lasted less than a year. Subscribers of Next-Gen Magazine received issues of PlayStation Magazine when the magazine's life-cycle was terminated.
Aki Fujimura, CEO of D2S, sat down with Semiconductor Engineering to talk about the challenges of moving to the next process nodes and how that will affect everything from lithography to the write time, size and cost of photomasks.
published: 19 Feb 2014
Next Generation Lithography : Nanoimprint
Next generation lithography options besides EUV
Nanoimprint Lithography
published: 11 Sep 2012
Behind this Door: Learn about EUV, Intel’s Most Precise, Complex Machine
In Intel’s second “Behind this Door” video, take a sneak peek into fab D1X in Oregon to see what is likely the most complicated machine humans have built. An extreme ultraviolet (EUV) lithography system uses radically shorter wavelengths to project circuit patterns onto silicon wafers. The #EUV machine pushes Moore’s Law forward and #chip makers cannot produce leading-edge chips without it. (Credit: Intel Corporation)
#Intel #Manufacturing #Semiconductor
▶ Learn more on Intel's EUV: https://intel.ly/3AeAKwz
Notice: This video contains footage provided by external vendors who have their own safety and health policies. Moreover, some footage was recorded prior to the COVID outbreak when no pandemic-related mask or social-distancing policies were needed or in place.
About Intel Newsroom
In...
published: 21 Dec 2021
What ASML Has Next After EUV
Right now, Extreme Ultraviolet Lithography is working. Foundries are using dozens of these $150 million machines to create amazing patterns nanometers wide.
The industry labored for decades on this intricate technology. But there is no time to rest. ASML is already looking ahead at the next generation of EUV: High-NA EUV. The centi-million dollar machine that will be better than regular EUV.
In this video, we are going to do a deep dive into what’s next in the world of EUV. ASML's follow-up to the most complicated nanolithography system ever delivered.
Links:
- The Asianometry Newsletter: https://asianometry.com
- Patreon: https://www.patreon.com/Asianometry
- The Podcast: https://anchor.fm/asianometry
- Twitter: https://twitter.com/asianometry
published: 20 Jan 2022
The next generation of direct writing lithography
Heidelberg Instruments significantly extends its leadership in manufacturing of direct write lithography systems with the launch of MLA Maskless Aligner series of systems. Low to mid volume lithography traditionally consist of creating designs with a CAD software, followed by fabricating or purchasing a photomask and finally using a mask aligner or stepper to transfer the pattern on to the photoresist. For high volume manufacturing of sub-micron design nodes, this traditional process is required. However, for many other applications, such as designs with patterns of over one micron in a mid or low volume production or prototyping environment, why not directly irradiate the wafer, forming the desired pattern and thereby getting rid of the mask aligner and the photomask process all togeth...
published: 12 Jun 2019
How EUV lithography works
Over the years, semiconductors have drastically shrunk in size. Computers used to take up entire rooms, and now we have machines more powerful than the computers that guided NASA to the Moon sitting on our wrist. To find ways to make chips even smaller and more powerful, we have to work with new tools. Back in 2015, IBM Research argued that the future of chipmaking would require EUV lithography machines, which are now becoming the industry standard for chips with transistors just three or four nanometers wide. Learn more about what EUV lithography is, and how it relates to a centuries-old printing technique.
https://research.ibm.com/semiconductors
#EUV #eda #semiconductors #chiplets
Subscribe and stay up to date on news and announcements from IBM Research → http://ibm.biz/subscribe_IBM_Re...
published: 12 Jul 2023
Metrology at the nanoscale key to understanding of next generation lithography processes
An interview from SPIE Advanced Lithography 2017 - http://spie.org/al
J. Alexander Liddle is the Acting Deputy Director for CNST and the Group Leader of the CNST Nanofabrication Research Group.
Liddle received his BA and DPhil degrees in Materials Science from the University of Oxford in 1986 and 1989 respectively. He spent the next decade at Bell Laboratories, where his primary efforts were directed towards the research, development and eventual commercialization of a novel electron-beam lithography technology.
He subsequently became the leader of an optical telecommunications MEMS group before moving to Lawrence Berkeley National Lab. There, he led the nanofabrication group in the Center for X-ray optics, before becoming Lead Scientist of the Molecular Foundry nanofabrication user fac...
published: 12 Jul 2017
Intro to Nanotech - Next Generation Lithography
Lecture discussing Next-Generation Lithography techniques like e-beam lithography, FIB, AFM litho, etc.
published: 01 Aug 2020
semiconductor revolution - forging the next generation of chipmakers in india
published: 10 Nov 2024
Next Generation Lithography : DSA, E-beam
Next generation lithography options besides EUV
Directed Self Assembly (DSA)
Mask Less Lithography - Electron Beam Lithography
Aki Fujimura, CEO of D2S, sat down with Semiconductor Engineering to talk about the challenges of moving to the next process nodes and how that will affect ever...
Aki Fujimura, CEO of D2S, sat down with Semiconductor Engineering to talk about the challenges of moving to the next process nodes and how that will affect everything from lithography to the write time, size and cost of photomasks.
Aki Fujimura, CEO of D2S, sat down with Semiconductor Engineering to talk about the challenges of moving to the next process nodes and how that will affect everything from lithography to the write time, size and cost of photomasks.
In Intel’s second “Behind this Door” video, take a sneak peek into fab D1X in Oregon to see what is likely the most complicated machine humans have built. An ex...
In Intel’s second “Behind this Door” video, take a sneak peek into fab D1X in Oregon to see what is likely the most complicated machine humans have built. An extreme ultraviolet (EUV) lithography system uses radically shorter wavelengths to project circuit patterns onto silicon wafers. The #EUV machine pushes Moore’s Law forward and #chip makers cannot produce leading-edge chips without it. (Credit: Intel Corporation)
#Intel #Manufacturing #Semiconductor
▶ Learn more on Intel's EUV: https://intel.ly/3AeAKwz
Notice: This video contains footage provided by external vendors who have their own safety and health policies. Moreover, some footage was recorded prior to the COVID outbreak when no pandemic-related mask or social-distancing policies were needed or in place.
About Intel Newsroom
Intel Newsroom brings you the latest news and updates on world-changing technology that enriches the lives of everyone on Earth. Connect with us today!
Subscribe now to Intel Newsroom on YouTube: https://www.youtube.com/user/intelnewsroom
Visit the Intel Newsroom: https://www.intel.com/content/www/us/en/newsroom/home.html
Follow @IntelNews on Twitter: https://twitter.com/intelnews
In Intel’s second “Behind this Door” video, take a sneak peek into fab D1X in Oregon to see what is likely the most complicated machine humans have built. An extreme ultraviolet (EUV) lithography system uses radically shorter wavelengths to project circuit patterns onto silicon wafers. The #EUV machine pushes Moore’s Law forward and #chip makers cannot produce leading-edge chips without it. (Credit: Intel Corporation)
#Intel #Manufacturing #Semiconductor
▶ Learn more on Intel's EUV: https://intel.ly/3AeAKwz
Notice: This video contains footage provided by external vendors who have their own safety and health policies. Moreover, some footage was recorded prior to the COVID outbreak when no pandemic-related mask or social-distancing policies were needed or in place.
About Intel Newsroom
Intel Newsroom brings you the latest news and updates on world-changing technology that enriches the lives of everyone on Earth. Connect with us today!
Subscribe now to Intel Newsroom on YouTube: https://www.youtube.com/user/intelnewsroom
Visit the Intel Newsroom: https://www.intel.com/content/www/us/en/newsroom/home.html
Follow @IntelNews on Twitter: https://twitter.com/intelnews
Right now, Extreme Ultraviolet Lithography is working. Foundries are using dozens of these $150 million machines to create amazing patterns nanometers wide.
T...
Right now, Extreme Ultraviolet Lithography is working. Foundries are using dozens of these $150 million machines to create amazing patterns nanometers wide.
The industry labored for decades on this intricate technology. But there is no time to rest. ASML is already looking ahead at the next generation of EUV: High-NA EUV. The centi-million dollar machine that will be better than regular EUV.
In this video, we are going to do a deep dive into what’s next in the world of EUV. ASML's follow-up to the most complicated nanolithography system ever delivered.
Links:
- The Asianometry Newsletter: https://asianometry.com
- Patreon: https://www.patreon.com/Asianometry
- The Podcast: https://anchor.fm/asianometry
- Twitter: https://twitter.com/asianometry
Right now, Extreme Ultraviolet Lithography is working. Foundries are using dozens of these $150 million machines to create amazing patterns nanometers wide.
The industry labored for decades on this intricate technology. But there is no time to rest. ASML is already looking ahead at the next generation of EUV: High-NA EUV. The centi-million dollar machine that will be better than regular EUV.
In this video, we are going to do a deep dive into what’s next in the world of EUV. ASML's follow-up to the most complicated nanolithography system ever delivered.
Links:
- The Asianometry Newsletter: https://asianometry.com
- Patreon: https://www.patreon.com/Asianometry
- The Podcast: https://anchor.fm/asianometry
- Twitter: https://twitter.com/asianometry
Heidelberg Instruments significantly extends its leadership in manufacturing of direct write lithography systems with the launch of MLA Maskless Aligner series ...
Heidelberg Instruments significantly extends its leadership in manufacturing of direct write lithography systems with the launch of MLA Maskless Aligner series of systems. Low to mid volume lithography traditionally consist of creating designs with a CAD software, followed by fabricating or purchasing a photomask and finally using a mask aligner or stepper to transfer the pattern on to the photoresist. For high volume manufacturing of sub-micron design nodes, this traditional process is required. However, for many other applications, such as designs with patterns of over one micron in a mid or low volume production or prototyping environment, why not directly irradiate the wafer, forming the desired pattern and thereby getting rid of the mask aligner and the photomask process all together? At Heidelberg Instruments we think you absolutely should and therefore have introduced the MLA Maskless Aligner. No need for photomasks, Mask Aligners or Steppers! Just create your design file and expose it directly on the wafer coated with resist.
Contact Nano Vacuum Australia & New Zealand for more information: www.nanovactech.com
Heidelberg Instruments significantly extends its leadership in manufacturing of direct write lithography systems with the launch of MLA Maskless Aligner series of systems. Low to mid volume lithography traditionally consist of creating designs with a CAD software, followed by fabricating or purchasing a photomask and finally using a mask aligner or stepper to transfer the pattern on to the photoresist. For high volume manufacturing of sub-micron design nodes, this traditional process is required. However, for many other applications, such as designs with patterns of over one micron in a mid or low volume production or prototyping environment, why not directly irradiate the wafer, forming the desired pattern and thereby getting rid of the mask aligner and the photomask process all together? At Heidelberg Instruments we think you absolutely should and therefore have introduced the MLA Maskless Aligner. No need for photomasks, Mask Aligners or Steppers! Just create your design file and expose it directly on the wafer coated with resist.
Contact Nano Vacuum Australia & New Zealand for more information: www.nanovactech.com
Over the years, semiconductors have drastically shrunk in size. Computers used to take up entire rooms, and now we have machines more powerful than the computer...
Over the years, semiconductors have drastically shrunk in size. Computers used to take up entire rooms, and now we have machines more powerful than the computers that guided NASA to the Moon sitting on our wrist. To find ways to make chips even smaller and more powerful, we have to work with new tools. Back in 2015, IBM Research argued that the future of chipmaking would require EUV lithography machines, which are now becoming the industry standard for chips with transistors just three or four nanometers wide. Learn more about what EUV lithography is, and how it relates to a centuries-old printing technique.
https://research.ibm.com/semiconductors
#EUV #eda #semiconductors #chiplets
Subscribe and stay up to date on news and announcements from IBM Research → http://ibm.biz/subscribe_IBM_Research
Over the years, semiconductors have drastically shrunk in size. Computers used to take up entire rooms, and now we have machines more powerful than the computers that guided NASA to the Moon sitting on our wrist. To find ways to make chips even smaller and more powerful, we have to work with new tools. Back in 2015, IBM Research argued that the future of chipmaking would require EUV lithography machines, which are now becoming the industry standard for chips with transistors just three or four nanometers wide. Learn more about what EUV lithography is, and how it relates to a centuries-old printing technique.
https://research.ibm.com/semiconductors
#EUV #eda #semiconductors #chiplets
Subscribe and stay up to date on news and announcements from IBM Research → http://ibm.biz/subscribe_IBM_Research
An interview from SPIE Advanced Lithography 2017 - http://spie.org/al
J. Alexander Liddle is the Acting Deputy Director for CNST and the Group Leader of the CN...
An interview from SPIE Advanced Lithography 2017 - http://spie.org/al
J. Alexander Liddle is the Acting Deputy Director for CNST and the Group Leader of the CNST Nanofabrication Research Group.
Liddle received his BA and DPhil degrees in Materials Science from the University of Oxford in 1986 and 1989 respectively. He spent the next decade at Bell Laboratories, where his primary efforts were directed towards the research, development and eventual commercialization of a novel electron-beam lithography technology.
He subsequently became the leader of an optical telecommunications MEMS group before moving to Lawrence Berkeley National Lab. There, he led the nanofabrication group in the Center for X-ray optics, before becoming Lead Scientist of the Molecular Foundry nanofabrication user facility, where he was involved in research ranging from quantum computation to guided self-assembly. In 2006 he moved to NIST, where he is now a Senior Scientist and leader of the Nanofabrication Research Group in the Center for Nanoscale Science and Technology.
He has been acting Deputy Director of the Center for the past two years. He has published over 250 papers in areas ranging from electron-beam lithography to DNA-controlled nanoparticle assembly and is a fellow of the APS and the Washington Academy of Science.
Liddle's research at NIST focuses on nanofabrication and self-assembly for nanomanufacturing. He holds 16 U.S. patents and has over 250 publications, including several in high-profile journals such as Nature and Nano Letters. Liddle has also helped organize a number of international conferences and workshops on nanofabrication and self-assembly.
An interview from SPIE Advanced Lithography 2017 - http://spie.org/al
J. Alexander Liddle is the Acting Deputy Director for CNST and the Group Leader of the CNST Nanofabrication Research Group.
Liddle received his BA and DPhil degrees in Materials Science from the University of Oxford in 1986 and 1989 respectively. He spent the next decade at Bell Laboratories, where his primary efforts were directed towards the research, development and eventual commercialization of a novel electron-beam lithography technology.
He subsequently became the leader of an optical telecommunications MEMS group before moving to Lawrence Berkeley National Lab. There, he led the nanofabrication group in the Center for X-ray optics, before becoming Lead Scientist of the Molecular Foundry nanofabrication user facility, where he was involved in research ranging from quantum computation to guided self-assembly. In 2006 he moved to NIST, where he is now a Senior Scientist and leader of the Nanofabrication Research Group in the Center for Nanoscale Science and Technology.
He has been acting Deputy Director of the Center for the past two years. He has published over 250 papers in areas ranging from electron-beam lithography to DNA-controlled nanoparticle assembly and is a fellow of the APS and the Washington Academy of Science.
Liddle's research at NIST focuses on nanofabrication and self-assembly for nanomanufacturing. He holds 16 U.S. patents and has over 250 publications, including several in high-profile journals such as Nature and Nano Letters. Liddle has also helped organize a number of international conferences and workshops on nanofabrication and self-assembly.
Aki Fujimura, CEO of D2S, sat down with Semiconductor Engineering to talk about the challenges of moving to the next process nodes and how that will affect everything from lithography to the write time, size and cost of photomasks.
In Intel’s second “Behind this Door” video, take a sneak peek into fab D1X in Oregon to see what is likely the most complicated machine humans have built. An extreme ultraviolet (EUV) lithography system uses radically shorter wavelengths to project circuit patterns onto silicon wafers. The #EUV machine pushes Moore’s Law forward and #chip makers cannot produce leading-edge chips without it. (Credit: Intel Corporation)
#Intel #Manufacturing #Semiconductor
▶ Learn more on Intel's EUV: https://intel.ly/3AeAKwz
Notice: This video contains footage provided by external vendors who have their own safety and health policies. Moreover, some footage was recorded prior to the COVID outbreak when no pandemic-related mask or social-distancing policies were needed or in place.
About Intel Newsroom
Intel Newsroom brings you the latest news and updates on world-changing technology that enriches the lives of everyone on Earth. Connect with us today!
Subscribe now to Intel Newsroom on YouTube: https://www.youtube.com/user/intelnewsroom
Visit the Intel Newsroom: https://www.intel.com/content/www/us/en/newsroom/home.html
Follow @IntelNews on Twitter: https://twitter.com/intelnews
Right now, Extreme Ultraviolet Lithography is working. Foundries are using dozens of these $150 million machines to create amazing patterns nanometers wide.
The industry labored for decades on this intricate technology. But there is no time to rest. ASML is already looking ahead at the next generation of EUV: High-NA EUV. The centi-million dollar machine that will be better than regular EUV.
In this video, we are going to do a deep dive into what’s next in the world of EUV. ASML's follow-up to the most complicated nanolithography system ever delivered.
Links:
- The Asianometry Newsletter: https://asianometry.com
- Patreon: https://www.patreon.com/Asianometry
- The Podcast: https://anchor.fm/asianometry
- Twitter: https://twitter.com/asianometry
Heidelberg Instruments significantly extends its leadership in manufacturing of direct write lithography systems with the launch of MLA Maskless Aligner series of systems. Low to mid volume lithography traditionally consist of creating designs with a CAD software, followed by fabricating or purchasing a photomask and finally using a mask aligner or stepper to transfer the pattern on to the photoresist. For high volume manufacturing of sub-micron design nodes, this traditional process is required. However, for many other applications, such as designs with patterns of over one micron in a mid or low volume production or prototyping environment, why not directly irradiate the wafer, forming the desired pattern and thereby getting rid of the mask aligner and the photomask process all together? At Heidelberg Instruments we think you absolutely should and therefore have introduced the MLA Maskless Aligner. No need for photomasks, Mask Aligners or Steppers! Just create your design file and expose it directly on the wafer coated with resist.
Contact Nano Vacuum Australia & New Zealand for more information: www.nanovactech.com
Over the years, semiconductors have drastically shrunk in size. Computers used to take up entire rooms, and now we have machines more powerful than the computers that guided NASA to the Moon sitting on our wrist. To find ways to make chips even smaller and more powerful, we have to work with new tools. Back in 2015, IBM Research argued that the future of chipmaking would require EUV lithography machines, which are now becoming the industry standard for chips with transistors just three or four nanometers wide. Learn more about what EUV lithography is, and how it relates to a centuries-old printing technique.
https://research.ibm.com/semiconductors
#EUV #eda #semiconductors #chiplets
Subscribe and stay up to date on news and announcements from IBM Research → http://ibm.biz/subscribe_IBM_Research
An interview from SPIE Advanced Lithography 2017 - http://spie.org/al
J. Alexander Liddle is the Acting Deputy Director for CNST and the Group Leader of the CNST Nanofabrication Research Group.
Liddle received his BA and DPhil degrees in Materials Science from the University of Oxford in 1986 and 1989 respectively. He spent the next decade at Bell Laboratories, where his primary efforts were directed towards the research, development and eventual commercialization of a novel electron-beam lithography technology.
He subsequently became the leader of an optical telecommunications MEMS group before moving to Lawrence Berkeley National Lab. There, he led the nanofabrication group in the Center for X-ray optics, before becoming Lead Scientist of the Molecular Foundry nanofabrication user facility, where he was involved in research ranging from quantum computation to guided self-assembly. In 2006 he moved to NIST, where he is now a Senior Scientist and leader of the Nanofabrication Research Group in the Center for Nanoscale Science and Technology.
He has been acting Deputy Director of the Center for the past two years. He has published over 250 papers in areas ranging from electron-beam lithography to DNA-controlled nanoparticle assembly and is a fellow of the APS and the Washington Academy of Science.
Liddle's research at NIST focuses on nanofabrication and self-assembly for nanomanufacturing. He holds 16 U.S. patents and has over 250 publications, including several in high-profile journals such as Nature and Nano Letters. Liddle has also helped organize a number of international conferences and workshops on nanofabrication and self-assembly.
Next-generation lithography or NGL is a term used in integrated circuit manufacturing to describe the lithography technologies slated to replace photolithography. As of 2009 the most advanced form of photolithography is immersion lithography, in which water is used as an immersion medium for the final lens. It is being applied to the 45 nm and 32 nm nodes. Several companies, including IBM, Intel and TSMC, have prepared for the continued use of current lithography, using double patterning, for the 22 nm and 16 nm nodes, and extending double patterning beyond 10 nm.
Candidates for next-generation lithography include: extreme ultraviolet lithography (EUV-lithography), X-ray lithography, electron beam lithography, focused ion beam lithography, and nanoimprint lithography. Electron beam lithography was most popular during the 1970s, but was replaced in popularity by X-ray lithography during the 1980s and early 1990s, and then by EUV lithography from the mid-1990s to the mid-2000s. Focused ion beam lithography has carved a niche for itself in the area of defect repair. Nanoimprint's popularity is rising, and is positioned to succeed EUV as the most popular choice for next-generation lithography, due to its inherent simplicity and low cost of operation as well as its success in the LED, hard disk drive and microfluidics sectors.
There's a place not far away where we can go to get away there's no rules and there's no laws there's no fighting you can't go wrong [Chorus:] 'cause we're the next generation destroy your generation. Help me up when i'm down and out hear me scream and hear me shout time to blow their generation away let 'em that we're here and we're here to stay [Chorus] my freedom's been takin' away don't wanna hear what i gotta say lock me up and throw away the key