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  • Samsung Advanced Foundry Ecosystem
    Samsung Advanced Foundry Ecosystem
    Samsung Advanced Foundry Ecosystem

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A Comprehensive Ecosystem Collaboration for Advanced SoC Design A Comprehensive Ecosystem Collaboration for Advanced SoC Design A Comprehensive Ecosystem Collaboration for Advanced SoC Design

Samsung’s SAFE™ program fosters seamless collaboration between Samsung Foundry, ecosystem partners, and customers. The program facilitates innovative, competitive and robust System on Chip (SoC) designs. SAFE™ accelerates development and enhances performance for the next-generation of applications by integrating a range of certified key design components that include process design kits (PDKs), design methodologies (DMs), and intellectual properties (IPs). Additionally, the program provides advanced support with cloud-based integration, design methodology documents and scripts, design services, multi-die integration (MDI), and OSAT advanced 2.5D and 3D packaging. 

A circular diagram illustrating the SAFE™ Ecosystem with key elements labeled, including IP, EDA, Cloud, Design Service, MDI and OSAT.
SAFE™ Programs SAFE™ Programs SAFE™ Programs

IP Alliance
IP Alliance
IP Alliance

Samsung’s SAFE™ IP Alliance collaborates with IP providers to deliver high quality and verified IPs for mobile, HPC, AI and automotive sectors, supported by streamlined tools like Quality Control Program (QCP) and CONNECT™.
Samsung’s SAFE™ IP Alliance collaborates with IP providers to deliver high quality and verified IPs for mobile, HPC, AI and automotive sectors, supported by streamlined tools like Quality Control Program (QCP) and CONNECT™.
Samsung’s SAFE™ IP Alliance collaborates with IP providers to deliver high quality and verified IPs for mobile, HPC, AI and automotive sectors, supported by streamlined tools like Quality Control Program (QCP) and CONNECT™.
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EDA Alliance
EDA Alliance
EDA Alliance

Samsung’s SAFE™ EDA Alliance partners with top EDA companies to provide certified tools and methodologies, enabling efficient design of high-performance and low-power products across various applications. ¹The SAFE™ QEDA program ensures tools meet Samsung’s stringent process requirements, minimizing risks in adopting new technologies. The alliance helps customers create optimized chip designs for automotive HPC and IoT applications while meeting industry standards.
Samsung’s SAFE™ EDA Alliance partners with top EDA companies to provide certified tools and methodologies, enabling efficient design of high-performance and low-power products across various applications. ¹The SAFE™ QEDA program ensures tools meet Samsung’s stringent process requirements, minimizing risks in adopting new technologies. The alliance helps customers create optimized chip designs for automotive HPC and IoT applications while meeting industry standards.
Samsung’s SAFE™ EDA Alliance partners with top EDA companies to provide certified tools and methodologies, enabling efficient design of high-performance and low-power products across various applications. ¹The SAFE™ QEDA program ensures tools meet Samsung’s stringent process requirements, minimizing risks in adopting new technologies. The alliance helps customers create optimized chip designs for automotive HPC and IoT applications while meeting industry standards.
¹SAFE™ QEDA (Samsung Advanced Foundry Ecosystem-Qualification of EDA): A comprehensive program for EDA tool certification.
¹SAFE™ QEDA (Samsung Advanced Foundry Ecosystem-Qualification of EDA): A comprehensive program for EDA tool certification.
¹SAFE™ QEDA (Samsung Advanced Foundry Ecosystem-Qualification of EDA): A comprehensive program for EDA tool certification.
Processes of Wafer Manufacturing.

Cloud Alliance
Cloud Alliance
Cloud Alliance

Samsung’s SAFE™ Cloud Alliance provides cloud-based design tools through partnerships with cloud providers and EDA companies. The platform offers secure and flexible on-demand access to Samsung's design resources and tools, enabling efficient chip development for mobile, HPC, AI and automotive.
Samsung’s SAFE™ Cloud Alliance provides cloud-based design tools through partnerships with cloud providers and EDA companies. The platform offers secure and flexible on-demand access to Samsung's design resources and tools, enabling efficient chip development for mobile, HPC, AI and automotive.
Samsung’s SAFE™ Cloud Alliance provides cloud-based design tools through partnerships with cloud providers and EDA companies. The platform offers secure and flexible on-demand access to Samsung's design resources and tools, enabling efficient chip development for mobile, HPC, AI and automotive.
A panoramic view of the city through the cloud.

Design Service Alliance 
Design Service Alliance 
Design Service Alliance

Samsung’s SAFE™ Design Service Alliance partners with Design Solution Partners (DSPs) and Virtual Design Partners (VDPs) to offer end-to-end silicon design support, optimizing workflows and accelerating production for diverse applications such as mobile, HPC, and automotive.
Samsung’s SAFE™ Design Service Alliance partners with Design Solution Partners (DSPs) and Virtual Design Partners (VDPs) to offer end-to-end silicon design support, optimizing workflows and accelerating production for diverse applications such as mobile, HPC, and automotive.
Samsung’s SAFE™ Design Service Alliance partners with Design Solution Partners (DSPs) and Virtual Design Partners (VDPs) to offer end-to-end silicon design support, optimizing workflows and accelerating production for diverse applications such as mobile, HPC, and automotive.
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MDI Alliance
MDI Alliance
MDI Alliance

Samsung’s SAFE™ Multi-Die Integration (MDI) Alliance accelerates innovation in 2.5D and 3D packaging through ecosystem partnerships with EDA, IP, DSP, OSAT, and testing providers, delivering turnkey solutions and enabling silicon and system-level integration for next-gen HPC, mobile, and automotive technologies.
Samsung’s SAFE™ Multi-Die Integration (MDI) Alliance accelerates innovation in 2.5D and 3D packaging through ecosystem partnerships with EDA, IP, DSP, OSAT, and testing providers, delivering turnkey solutions and enabling silicon and system-level integration for next-gen HPC, mobile, and automotive technologies.
Samsung’s SAFE™ Multi-Die Integration (MDI) Alliance accelerates innovation in 2.5D and 3D packaging through ecosystem partnerships with EDA, IP, DSP, OSAT, and testing providers, delivering turnkey solutions and enabling silicon and system-level integration for next-gen HPC, mobile, and automotive technologies.
A circuit board design resembling a city, with glowing blue and orange paths and microchip-like structures.

OSAT Alliance
OSAT Alliance
OSAT Alliance

Samsung’s SAFE™ Outsourced Semiconductor Assembly and Test (OSAT) Alliance partners with industry-leading OSAT companies to integrate assembly and testing to deliver advanced 2.5D and 3D packaging, optimized for diverse applications such as HPC, mobile, and automotive.
Samsung’s SAFE™ Outsourced Semiconductor Assembly and Test (OSAT) Alliance partners with industry-leading OSAT companies to integrate assembly and testing to deliver advanced 2.5D and 3D packaging, optimized for diverse applications such as HPC, mobile, and automotive.
Samsung’s SAFE™ Outsourced Semiconductor Assembly and Test (OSAT) Alliance partners with industry-leading OSAT companies to integrate assembly and testing to deliver advanced 2.5D and 3D packaging, optimized for diverse applications such as HPC, mobile, and automotive.
A macro shot of wafer inspection equipment.