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apu2e4 System board
Status Active
Part numbers apu2e0 = 2 i211AT LAN / AMD GX-412TC CPU / 2 GB DRAM (stripped down board)
apu2e2 = 3 i211AT LAN / AMD GX-412TC CPU / 2 GB DRAM
apu2e4 = 3 i210AT LAN / AMD GX-412TC CPU / 4 GB DRAM
apu2e5 = 3 i211AT LAN / AMD GX-412TC CPU / 4 GB DRAM
apu2d0 = 2 i211AT LAN / AMD GX-412TC CPU / 2 GB DRAM (superseded)
apu2d2 = 3 i211AT LAN / AMD GX-412TC CPU / 2 GB DRAM (superseded)
apu2d4 = 3 i210AT LAN / AMD GX-412TC CPU / 4 GB DRAM (superseded)
apu2c0 = 2 i211AT LAN / AMD GX-412TC CPU / 2 GB DRAM (superseded)
apu2c2 = 3 i211AT LAN / AMD GX-412TC CPU / 2 GB DRAM (superseded)
apu2c4 = 3 i210AT LAN / AMD GX-412TC CPU / 4 GB DRAM (superseded)
apu2b2 = 3 i211AT LAN / AMD GX-412TC CPU / 2 GB DRAM (superseded)
apu2b4 = 3 i210AT LAN / AMD GX-412TC CPU / 4 GB DRAM (superseded)
Use with case1d2u / case1d2blku / case1d2redu / case1d2bluu enclosures (use 2 LAN enclosures for apu2c0)
ac12veur3 / ac12vus2 / ac12vuk AC adapter
msata16f / msata16g (and other sizes) mSATA SSD
sd4b SD card
wle200nx / wle600vx / wle900vx miniPCI express wireless modules
spi1a flash recovery module
Specification
  • CPU: AMD Embedded G series GX-412TC, 1 GHz quad Jaguar core with 64 bit and AES-NI support, 32K data + 32K instruction cache per core, shared 2MB L2 cache.
  • DRAM: 2 or 4 GB DDR3-1333 DRAM
  • Storage: Boot from m-SATA SSD, SD card (internal sdhci controller), or external USB. 1 SATA + power connector.
  • 12V DC, about 6 to 12W depending on CPU load. Jack = 2.5 mm, center positive
  • Connectivity: 2 or 3 Gigabit Ethernet channels (Intel i211AT on apu2b2, i210AT on apu2b4)
  • I/O: DB9 serial port, 2 USB 3.0 external + + 2 USB 2.0 internal, three front panel LEDs, pushbutton
  • Expansion: 2 miniPCI express (one with SIM socket), LPC bus, GPIO header, I2C bus, COM2 (3.3V RXD / TXD)
  • Board size: 6 x 6" (152.4 x 152.4 mm) - same as apu1d, alix2d13 and wrap1e.
  • Firmware: coreboot
  • Cooling: Conductive cooling from the CPU to the enclosure using a 3 mm alu heat spreader (included).
Documentation user's manual
Howto HowTo collection
Cooling assembly apu cooling assembly instructions
BIOS update Update 3/2017: various fixes, iPXE with setup
Update 3/11/2016: add iPXE payload (cannot disable in setup yet)
Update 3/7/2016: add SD boot support
Update 2/11/2016: fix some performance leaks
Update 1/20/2016: fix miniPCIe IRQ assignments, wle200nx working

Please see Howto collection for instructions on BIOS upgrade.

Update apu2e: Changed battery socket footprint to avoid contact problems. Add signal integrity resistor for core voltage control signal.
Update apu2d: Reduce leakage current between V3 and V3A power rails (can cause problems with SD cards). Add options for better compatibility with LTE modem modules.
Update apu2c: Integrate blue wire patches (EMI, power-up circuit) into PCB fab.
Schematic apu2b / apu2c / apu2d schematics
Manufacturer PC Engines
Origin Taiwan
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