HMC 310
HMC 310
HMC 310
v03.0607
BLUETOOTH & 2.4 GHz WLAN
GaAs MMIC TRANSCEIVER
TE
Functional Diagram General Description
The HMC310MS8G & HMC310MS8GE are multi-
function RFICs that incorporates a power amplifier
(PA) and low noise amplifier (LNA) with a transmit/
12 3
8 2
TE
+25C +25 C
4 +85C 1 +85 C
-40C -40 C
0 0
2 2.2 2.4 2.6 2.8 3 2 2.2 2.4 2.6 2.8 3
FREQUENCY (GHz) FREQUENCY (GHz)
Rx Return Loss
0
LE Rx 1dB Compression Point
0
-2
-5
RETURN LOSS (dB)
P1dB (dBm)
-4
SO
-10
-6
-15 +25 C
-8 +85 C
Input Return Loss -40 C
Output Return Loss
-20 -10
2 2.2 2.4 2.6 2.8 3 2 2.2 2.4 2.6 2.8 3
FREQUENCY (GHz) FREQUENCY (GHz)
B
10
8
IP3 (dBm)
0
2 2.2 2.4 2.6 2.8 3
FREQUENCY (GHz)
16
-5
12
-10
+25 C
8 +85 C
-40 C
TE
-15
4
Input Return Loss
Output Return Loss
0 -20
2 2.2 2.4 2.6 2.8 3 2 2.2 2.4 2.6 2.8 3
FREQUENCY (GHz) FREQUENCY (GHz)
8
LE Tx Output Third Order Intercept Point
15
13
P1dB (dBm)
IP3 (dBm)
6 11
SO
4 9
+25 C
2 +85 C 7
-40 C
0 5
2 2.2 2.4 2.6 2.8 3 2 2.2 2.4 2.6 2.8 3
FREQUENCY (GHz) FREQUENCY (GHz)
B
O
TE
(channel to ground paddle)
Storage Temperature -65 to +150 °C ELECTROSTATIC SENSITIVE DEVICE
Operating Temperature -40 to +85 °C OBSERVE HANDLING PRECAUTIONS
Outline Drawing
LE
SO
B
O
NOTES:
1. LEADFRAME MATERIAL: COPPER ALLOY
2. DIMENSIONS ARE IN INCHES [MILLIMETERS]
3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
Package Information
Part Number Package Body Material Lead Finish MSL Rating Package Marking [3]
[1] H310
HMC310MS8G Low Stress Injection Molded Plastic Sn/Pb Solder MSL1
XXXX
[2] H310
HMC310MS8GE RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1
XXXX
[1] Max peak reflow temperature of 235 °C
[2] Max peak reflow temperature of 260 °C
[3] 4-Digit lot number XXXX
8 Evaluation PCB
LOW NOISE AMPLIFIERS - SMT
TE
LE Note:
DC blocking capacitors on the Tx and ANT
ports are required to evaluate this part. These
SO
capacitors may not be required in the final cir-
cuit design if interfacing components are DC
blocked.
B
Item Description The circuit board used in the final application should
J1, J2, J3 PCB Mount SMA Connector use RF circuit design techniques. Signal lines
J4, J5 DC Pins should have 50 ohm impedance while the package
C1 .01 μF Capacitor, 0603 Pkg. ground leads and backside ground slug should be
C2, C3 100 pF Capacitor, 0603 Pkg. connected directly to the ground plane similar to that
U1 HMC310MS8G / HMC310MS8GE Transceiver
shown. A sufficient number of via holes should be
PCB [2] Evaluation Board 1.5” x 1.55”
used to connect the top and bottom ground planes.
[1] Reference this number when ordering complete evaluation PCB
The evaluation circuit board shown is available from
[2] Circuit Board Material: Rogers 4350
Hittite upon request.
Notes:
8