This document provides specifications for the P1603BV N-channel enhancement mode MOSFET. Key specifications include a breakdown voltage of 30V, on-resistance of 16mΩ at 10V gate-source voltage, and continuous drain current rating of 10A. The MOSFET has maximum junction temperature and storage temperature ranges of -55 to 150 degrees Celsius.
This document provides specifications for the P1603BV N-channel enhancement mode MOSFET. Key specifications include a breakdown voltage of 30V, on-resistance of 16mΩ at 10V gate-source voltage, and continuous drain current rating of 10A. The MOSFET has maximum junction temperature and storage temperature ranges of -55 to 150 degrees Celsius.
This document provides specifications for the P1603BV N-channel enhancement mode MOSFET. Key specifications include a breakdown voltage of 30V, on-resistance of 16mΩ at 10V gate-source voltage, and continuous drain current rating of 10A. The MOSFET has maximum junction temperature and storage temperature ranges of -55 to 150 degrees Celsius.
This document provides specifications for the P1603BV N-channel enhancement mode MOSFET. Key specifications include a breakdown voltage of 30V, on-resistance of 16mΩ at 10V gate-source voltage, and continuous drain current rating of 10A. The MOSFET has maximum junction temperature and storage temperature ranges of -55 to 150 degrees Celsius.
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C Unless Otherwise Noted)
PARAMETERS/TEST CONDITIONS SYMBOL LIMITS UNITS Gate-Source Voltage VGS ±20 V TA = 25 °C 10 Continuous Drain Current ID TA = 70 °C 8 1 A Pulsed Drain Current IDM 55 Avalanche Current IAS 23 Avalanche Energy L = 0.1mH EAS 26 mJ TA = 25 °C 2.6 Power Dissipation PD W TA = 70 °C 1.6 Operating Junction & Storage Temperature Range TJ, TSTG -55 to 150 °C
THERMAL RESISTANCE RATINGS
THERMAL RESISTANCE SYMBOL TYPICAL MAXIMUM UNITS Junction-to-Case RqJC 25 °C / W Junction-to-Ambient RqJA 50 1 Pulse width limited by maximum junction temperature.
Ver 1.0 1 2012/4/13
P1603BV N-Channel Enhancement Mode MOSFET
ELECTRICAL CHARACTERISTICS (TJ = 25 °C, Unless Otherwise Noted)
LIMITS PARAMETER SYMBOL TEST CONDITIONS UNIT MIN TYP MAX STATIC Drain-Source Breakdown Voltage V(BR)DSS VGS = 0V, ID = 250mA 30 V Gate Threshold Voltage VGS(th) VDS = VGS, ID = 250mA 1.0 1.8 2.5 Gate-Body Leakage IGSS VDS = 0V, VGS = ±20V ±100 nA VDS = 24V, VGS = 0V 1 Zero Gate Voltage Drain Current IDSS mA VDS = 20V, VGS = 0V , TJ = 125 °C 10 On-State Drain Current1 ID(ON) VDS = 10V, VGS = 10V 55 A Drain-Source On-State VGS = 4.5V, ID = 6A 19.4 25.0 RDS(ON) mΩ Resistance1 VGS = 10V, ID = 8A 11.8 16.0 Forward Transconductance1 gfs VDS = 5V, ID = 8A 40 S DYNAMIC Input Capacitance Ciss 560 Output Capacitance Coss VGS = 0V, VDS = 15V, f = 1MHz 179 pF Reverse Transfer Capacitance Crss 100 Gate Resistance Rg VGS = 0V, f = 1MHz 2 Ω Qg(VGS = 10V) 12 Total Gate Charge2 Qg(VGS = 4.5V) VDS = 0.5V(BR)DSS, 5 nC Gate-Source Charge 2 Qgs ID = 8A, VGS = 10V 2.1 Gate-Drain Charge2 Qgd 3.5 2 td(on) Turn-On Delay Time 7 2 tr Rise Time VDS = 15V, RL = 1.5Ω 29 nS Turn-Off Delay Time 2 td(off) VGS = 10V, ID @ 10A, RGEN = 6Ω 45 Fall Time2 tf 18 SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS (TJ = 25 °C) Continuous Current IS 2.6 A 1 VSD IF = 8A, VGS = 0V Forward Voltage 1 V Reverse Recovery Time trr 24 nS IF = 8A, dlF/dt = 100A / mS Reverse Recovery Charge Qrr 29 nC 1 Pulse test : Pulse Width 300 msec, Duty Cycle 2%. 2 Independent of operating temperature.