D D D D D D D: Compatible With Standard TTL Integrated Circuits
D D D D D D D: Compatible With Standard TTL Integrated Circuits
D D D D D D D: Compatible With Standard TTL Integrated Circuits
OPTOCOUPLERS
SOES023 – MARCH 1983 – REVISED OCTOBER 1995
PRODUCTION DATA information is current as of publication date. Copyright 1995, Texas Instruments Incorporated
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
switching characteristics
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tr Rise time VCC = 10 V,, IC(on) = 2 mA,,
Phototransistor operation 5 µs
tf Fall time RL = 100 Ω, See Test Circuit A of Figure 1
tr Rise time VCC = 10 V, µA,
IC(on) 20 µ
Photodiode operation 1 µs
tf Fall time RL = 1 kΩ, See Test Circuit B of Figure 1
NOTES: A. The input waveform is supplied by a generator with the following characteristics: ZO = 50 Ω, tr ≤ 15 ns, duty cycle 1%,
tw = 100 µs.
B. The output waveform is monitored on an oscilloscope with the following characteristics: tr ≤ 12 ns, Rin ≥ 1 MΩ, Cin ≤ 20 pF.
TYPICAL CHARACTERISTICS
I C – Collector Current – mA
I C – Collector Current – mA
10
40
4 Max Continuous
Power Dissipation
1 30
0.4 IF = 40 mA
20
IF = 30 mA
0.1
IF = 20 mA
10
0.04 IF = 20 mA
0.01 0
0 2 4 6 8 10 12 14 16 18 20
0.1 0.4 1 4 10 40 100
VCE – Collector-Emitter Voltage – V
IF – Input-Diode Forward Current – mA
NOTE A: Pulse operation of input diode is required for operation
beyond limits shown by dotted lines.
Figure 2 Figure 3
ON-STATE COLLECTOR CURRENT
(RELATIVE TO VALUE AT 25°C)
vs
FREE-AIR TEMPERATURE
1.6
VCE = 0.4 V to 10 V
1.4 IB = 0
IF = 10 mA
(Relative to Value at TA = 25 °C)
See Note B
On-State Collector Current
1.2
0.8
0.6
0.4
0.2
0
– 75 – 50 – 25 0 25 50 75 100 125
TA – Free-Air Temperature – °C
NOTE B: These parameters were measured using pulse
techniques, tw = 1 ms, duty cycle ≤ 2 %.
Figure 4
MECHANICAL INFORMATION
The package consists of a gallium-arsenide infrared-emitting diode and an npn silicon phototransistor mounted
on a 6-lead frame encapsulated within an electrically nonconductive plastic compound. The case can withstand
soldering temperature with no deformation and device performance characteristics remain stable when
operated in high-humidity conditions. Unit weight is approximately 0.52 grams.
C
L C
L
9,40 (0.370) 5,46 (0.215)
8,38 (0.330) 7,62 (0.300) T.P.
6 5 4 2,92 (0.115)
6,61 (0.260) 1,78 (0.070)
1,78 (0.070) MAX
6,09 (0.240) 0,51 (0.020)
Index Dot 6 Places
(see Note B)
1 2 3 Seating Plane
(see Note C) 105° 1,01 (0.040) MIN
90°
2,29 (0.090) 0,534 (0.021)
0,305 (0.012) 1,27 (0.050)
3,81 (0.150) 0,381 (0.015)
0,203 (0.008)
3,17 (0.125) 6 Places
2,54 (0.100) T.P.
(see Note A)
NOTES: A. Leads are within 0,13 (0.005) radius of true position (T.P.) with maximum material condition and unit installed.
B. Pin 1 identified by index dot.
C. Terminal connections:
1. Anode (part of the infrared-emitting diode)
2. Cathode (part of the infrared-emitting diode)
3. No internal connection
4. Emitter (part of the phototransistor)
5. Collector (part of the phototransistor)
6. Base (part of the phototransistor)
D. The dimensions given fall within JEDEC MO-001 AM dimensions.
E. All linear dimensions are given in millimeters and parenthetically given in inches.
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