Ti系の英語

To form a Ti-based self diffusion barrier film on a wiring surface, even if a Cu-Ti-based sputter film is heat-treated at a temperature lower than the conventional temperatures.例文帳に追加

Cu-Ti系スパッタ膜を従来よりも低い温度で熱処理しても、配線表面にTi系自己拡散バリア膜を形成できるようにする。 - 特許庁

After forming an extremely thin Ti-based film on a base material 1 as a first film 2, by having a compound film including a slope structure of a Ti-based material of a Ti-based material and a Cu-based material formed as a second film 3, and a third film 4 formed on the compound film as a Cu-based electrode, a precursor having a three-layer structure is formed.例文帳に追加

極薄のTi系膜を第一の膜２として基材１上に形成した後、Ti系材料のTi系材料とCu系材料との傾斜構造を持つ複合膜を第二の膜３として形成し、その上にCu系電極となる第三の膜４を形成することにより、３層構造の前駆体を形成する。 - 特許庁

To provide a Ti-based amorphous alloy having a large temperature width of a supercooled liquid region and a strength sufficient for practical use.例文帳に追加

過冷却液体領域の広い温度幅を有し、且つ、実用に耐えうる強度を有するTi系非結晶質合金を提供する。 - 特許庁

By heat-treating the precursor at 450C° or lower, the Cu-based electrode including the Ti-based barrier film can be formed.例文帳に追加

この前駆体を450℃以下で熱処理することで、Ti系バリア膜を有するCu系電極を形成することが可能となる。 - 特許庁

To provide a method for producing an Ni-Ti based shape memory alloy by continuously producing an Ni-Ti laminated metallic strip with a desired shape in industrially, sufficiently practicable technical ranges, i.e., at ordinary temperature and low rolling ratio and performing heating diffusion treatment.例文帳に追加

工業的に十分実用可能な技術の範囲で、即ち、常温において低い圧延率で所望の形状をもったNi-Ti積層金属帯を連続生産し、加熱拡散処理を施してNi-Ti系の形状記憶合金を製造する方法を提供する。 - 特許庁

Surfaces of final annealed, single directional silicon steel sheets are coated by insulation films comprising 0.01-0.2 μm thick Ti(N, O) oxide film on which 0.01-0.2 μm thick SiNx ceramics film is coated, the latter in turn being covered by 0.01-2.0 μm thick film consisting of phosphate and silica as major elements.例文帳に追加

仕上焼鈍済みの一方向性けい素鋼板の表面に、0.01〜0.2 μm 厚のTi系の窒・酸化物被膜〔Ti(N,O) 膜〕、その上に0.01〜0.2 μm 厚のSiＮ_X 系セラミック被膜、さらにその上に0.01〜2.0 μm 厚のりん酸塩とシリカを主成分とする絶縁被膜を被成する。 - 特許庁