石油重質成分の英語

重金属成分を含有する石油系重質油の鉄系触媒による懸濁床方式の水素化分解方法における沈降式固液分離法によるTI（コーク）選択的除去の際に、軽質な溶剤を添加しなくてもよい水素化分解方法を提供する。例文帳に追加

To provide a method of hydrocracking which does not require addition of a light solvent when a petroleum heavy oil containing a heavy metal component is hydrocracked with an iron-based catalyst in a suspension bed and then a TI (coke) is selectively eliminated by settling type solid-liquid separation. - 特許庁

重質油の非水素下における分解装置から得られる硫黄及びオレフィンを多量に含有する分解石油ガス成分から、オレフィン分を減少させることなく、長期間にわたって安定にかつ経済的に硫黄分を除去、低減できる方法を提供する。例文帳に追加

To provide a method for stably and economically removing or reducing sulfur content, over a long period of time, from cracked oil gas components which is obtained from an apparatus for cracking heavy oil in the absence of hydrogen and contains large amounts of sulfur and olefin, without reducing olefin content. - 特許庁

（Ａ）オルソクレゾールとα−ナフトールをメチレン基を介して共重合した樹脂をグリシジルエーテル化したエポキシ樹脂、（Ｂ）石油系重質油又はピッチ類とホルムアルデヒド重縮合物とフェノール類とを酸触媒の存在下で重縮合させたフェノール樹脂、（Ｃ）無機充填材、及び（Ｄ）硬化促進剤を必須成分とすることを特徴とする半導体封止用エポキシ樹脂組成物。例文帳に追加

This epoxy resin composition for semiconductor sealing is characterized by including (A) an epoxy resin obtained by glycidyletherizing a resin obtained by copolymerizing ortho-cresol with α-naphthol through methylene group, (B) a phenol resin obtained by polycondensing petroleum-based heavy oil or pitches with formaldehyde polycondensation product and phenols in the presence of an acid catalyst, (C) inorganic filler and (D) a curing accelerator as essential components. - 特許庁

（Ａ）フェノールアラルキル型エポキシ樹脂、（Ｂ）石油系重質油又はピッチ類とホルムアルデヒド重縮合物とフェノール類とを酸触媒の存在下で重縮合させたフェノール樹脂、（Ｃ）無機充填材、及び（Ｄ）硬化促進剤を必須成分とすることを特徴とする半導体封止用エポキシ樹脂組成物。例文帳に追加

The epoxy resin composition essentially consists of (A) a phenol aralkyl epoxy resin, (B) a phenol resin composed by polycondensing petroleum heavy oil or pitches, formaldehyde polycondensate and phenols in the presence of an acid catalyst, (C) an inorganic filler, and (D) an accelerator. - 特許庁

（Ａ）エポキシ樹脂、（Ｂ）石油系重質油又はピッチ類とホルムアルデヒド重合物とフェノール類とを酸触媒の存在下で重縮合させて得られる変性フェノール樹脂、（Ｃ）無機充填材、（Ｄ）硬化促進剤、及び（Ｅ）環状ホスファゼン化合物を必須成分とすることを特徴とする半導体封止用エポキシ樹脂組成物。例文帳に追加

The composition is characterized, as the essential components, by containing (A) an epoxy resin, (B) a modified phenol resin obtained by polycondensing a petroleum-based heavy oil or pitches with a formaldehyde polymer and phenols in the presence of an acidic catalyst, (C) an inorganic filler, (D) a curing accelerator and (E) a cyclic phosphazene compound. - 特許庁

（Ａ）石油系重質油又はピッチ類とホルムアルデヒド重合物とフェノール類とを酸触媒の存在下で重縮合させて得られた変性フェノール樹脂のエポキシ化物、（Ｂ）フェノール樹脂硬化剤、（Ｃ）無機充填材、及び（Ｄ）硬化促進剤を必須成分とすること特徴とする半導体封止用エポキシ樹脂組成物。例文帳に追加

This composition for semiconductor sealing contains, as essential ingredients, (A) an epoxidation product of a modified phenol resin obtained by the polycondensation of a petroleum-derived heavy oil or a pitch, a formaldehyde polymer, and a phenol in the presence of an acid catalyst, (B) a phenol resin curing agent, (C) an inorganic filler, and (D) a cure accelerator. - 特許庁

オルソクレゾールノボラック型エポキシ樹脂、石油系重質油又はピッチ類とホルムアルデヒド重合物とフェノール類とを酸触媒の存在下で重縮合させて得られた水酸基当量１５０〜３００ｇ／ｅｑの変性フェノール樹脂、無機充填材、及び硬化促進剤を必須成分とすることを特徴とする半導体封止用エポキシ樹脂組成物。例文帳に追加

The resin composition for semiconductor sealing essentially contains an o-cresol novolak epoxy resin, a modified phenol resin which is prepared by the polycondensation of a petroleum-base heavy oil or a pitch, a formaldehyde polymer, and a phenol in the presence of and acid catalyst and has a hydroxyl equivalent of 150-300 g/eq, an inorganic filler, and a cure accelerator. - 特許庁