Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
CHIPS for America Announces up to $300 million in Funding to Boost U.S. Semiconductor Packaging
On November 21, 2024, the Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry. The expected recipients are Absolics Inc. in Georgia, Applied Materials Inc. in California, and Arizona State University in Arizona.
These competitively awarded research investments, each expected to total as much as $100 million, represent novel efforts in advanced substrates. Advanced substrates are physical platforms that allow multiple semiconductor chips to be assembled seamlessly together, enable high-bandwidth communication between those chips, efficiently deliver power, and dissipate unwanted heat. The advanced packaging enabled by advanced substrates translates to high performance computing for AI, next-generation wireless communication, and more efficient power electronics.
Learn more about the awardees here.
CHIPS R&D Notice of Funding Opportunities (NOFO)
CARISSMA
CHIPS AI/AE for Rapid, Industry-informed Sustainable Semiconductor Materials and Processes (CARISSMA) Competition
Learn more about the CARRISMA NOFO here.
NAPMP NOFO 2
On October 18, 2024, the U.S. Department of Commerce issued a NOFO to enable the United States semiconductor industry to adopt innovative new advanced packaging flows for semiconductor technologies. CHIPS for America anticipates making available up to approximately $1.6 billion for funding multiple awards across five research and development (R&D) areas with the potential for follow-on funding for prototyping activities.
The five R&D areas are:
- Equipment, Tools, Processes, and Process Integration
- Power Delivery and Thermal Management
- Connector Technology, Including Photonics and Radio Frequency (RF)
- Chiplets Ecosystem
- Co-design/Electronic Design Automation (EDA)
Mandatory concept papers are due December 20, 2024. Concept papers received after this deadline will not be reviewed or considered.
Learn more about the NAPMP NOFO 2 here.
The purpose of the CHIPS Research and Development (R&D) programs is to advance the development of semiconductor technologies and to enhance the competitiveness of the U.S. semiconductor industry. The CHIPS R&D programs have three goals:
- Establish the capacity to invent, develop, prototype, and deploy the foundational semiconductor technologies of the future – here in America.
- Accelerate ideas to market. We want the best ideas to achieve commercial scale as quickly and cost effectively as possible, and
- Contribute to a robust semiconductor workforce. We want enough inventors, designers, researchers, developers, engineers, technicians, and staff to meet the needs of government and commercial sectors.
The CHIPS R&D programs address five cross-cutting issues that we identified through interactions with stakeholders:
- Access to facilities and equipment for late-stage R&D and prototyping
- Advanced packaging and testing
- Advanced metrology and characterization
- Advanced manufacturing technology
- Workforce development
To address these semiconductor R&D ecosystem gaps, CHIPS for America invests $11 billion in four integrated entities, all of which include some aspect of workforce training. These programs will share infrastructure, participants, and projects. They will operate in coordination with each other, with the CHIPS Incentives Program, and with microelectronics R&D programs supported by other U.S. federal agencies. CHIPS R&D programs will be informed by industry’s needs, and innovations from the R&D programs will accelerate innovation and increase competitiveness in the American semiconductor industry and establish our leadership in the sector for decades to come.
- National Semiconductor Technology Center – A public-private consortium that will serve as the focal point for semiconductor research for the nation. Learn more about the NSTC's vision and strategy.
- CHIPS National Advanced Packaging Manufacturing Program – The U.S. needs to develop the capability to package chips together in multiple dimensions with a variety of functions—known as advanced packaging—to regain and maintain leadership in semiconductor manufacturing. The NAPMP and NSTC will work closely together. Learn more about the NAPMP vision.
- CHIPS Manufacturing USA Institute – CHIPS for America will fund a new Manufacturing USA institute dedicated to digital twin technology for semiconductor manufacturing technologies, and related workforce training.
- CHIPS Metrology – NIST will conduct the measurement science, or metrology, critical to the development of new materials, packaging, and production methods for semiconductors. NIST will also work on reference materials, reference data, and calibrations for the precision equipment used in chip manufacturing, and advise on the development of standards for processes and cybersecurity.
The CHIPS for America R&D programs are guided by the Industrial Advisory Committee.
One-year progress report: CHIPS Research and Development programs.
